Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for XC7A200T-L1SBG484I. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
XC7A200T-L1SBG484I is an FPGA in the AMD / Xilinx Artix-7 family, supplied in the SBG484 package. Its reviewed resources include 215,360 logic cells, 13,140 Kb of block RAM, 285 I/O for this device/package combination. This ordering code specifies speed grade -1L and Industrial (I) temperature grade. The selected device/package has 4 GTP channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
An SBG484 industrial board needs an explicit power-mode review
Use these checks to prepare a design review or a sourcing request for XC7A200T-L1SBG484I. The evidence rows describe the device; the actions are engineering guidance, not completed validation.
Resolve the -1L operating conditions before choosing rails
Speed grade
-1L
Temperature grade
Industrial (I)
Check: Retain the L1 ordering designation when locating the applicable Artix-7 electrical tables. Do not infer a board voltage or watts from the low-power label; check the supported operating mode and timing conditions.
Prepare: A power-tree review that identifies the exact electrical table, operating mode and timing assumptions.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; note 1 · scope: MPN. Retain original ordering code -L1 in the literal MPN. Datasheet grade is -1L. This is not a single application clock limit.
Check: Compare SBG484 and FBG484 geometry in their official package drawings. Ask the PCB supplier to review your proposed fan-out, drill rules and stack-up rather than selecting a layer count from pitch alone.
Prepare: A manufacturable routing proposal tied to the official package drawing and your fabricator's rules.
Check: Check every bus and lane against the package pinout, then estimate power and cooling for the actual activity. Industrial grade does not validate the enclosure ambient temperature or the design's power consumption.
Prepare: Pin/bank allocation plus a documented thermal calculation under the intended operating conditions.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, SBG484 columns · scope: device-package. Package-specific user I/O. HR I/O; excludes serial transceiver channels.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, SBG484 columns; GTP column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Before accepting a quotation
Keep L1, SBG484 and I together on the approved BOM and supplier offer.
For a proposed FBG or SBV option, request a distinct full-MPN line; review geometry, grade, power conditions and lifecycle independently.
Provide build quantity, delivery deadline and destination, and agree lot/traceability and moisture-handling evidence required for acceptance.
Availability, price, shipment date and evidence deliverables require confirmation for the actual offer. No supplier stock or replacement qualification is established by this page.
Choose the sourcing or redesign route
Keep the existing footprint: source the exact approved SBG484 code and check the offer against its full suffix.
Power is the concern: review measured or estimated activity and the applicable operating mode before changing speed designation.
Assembly or routing is the concern: compare FBG484 dimensions and pitch as a possible board change, with a new fabrication and assembly review.
Core device, package and grade fields are linked to official documents. The full MPN is evidenced by a historical manufacturer listing; current lifecycle and availability require confirmation. Voltage, application timing and power are not fully characterized here.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operation
Not confirmed
unconfirmed
Minimum core voltage
Not confirmed
unconfirmed
Nominal core voltage
Not confirmed
unconfirmed
Maximum core voltage
Not confirmed
unconfirmed
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
unconfirmedConditions
Not verified in this review.
Available stock
Not confirmed
unconfirmedConditions
Not verified in this review.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Full ordering-number evidence: XCN20011 v1.0, p. 2, Table 4, single table block, data row 25, Replacement Part column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Review the low-power designation and SBG484 escape routing together
The SBG484 industrial selection changes the board geometry compared with FBG484, while its -1L designation calls for a separate electrical-condition review. It is a candidate when the compact body is relevant and the design can be validated in that timing bin. The comparison's historical SBV part does not transfer its lifecycle status to this G-package code.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 109 I/O remain in the count-only budget (61.8% allocated).
Planning diagram: assumed I/O allocation 176 I/O assumed allocation / 285 documented package I/O; 109 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
61.8% of the sourced package count allocated; 109 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 196,608 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 13,140 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7A200T-L1SBG484I and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7A200T-L1SBG484I
Lifecycle / ordering: Not verified in this review.
Speed grade: -1L.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; note 1 · scope: MPN. Retain original ordering code -L1 in the literal MPN. Datasheet grade is -1L. This is not a single application clock limit.
Operating temperature (see basis/conditions): -40 to +100 °C.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 19 x 19 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 265, Figure 4-11, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, SBG484 columns · scope: device-package. Package-specific user I/O. HR I/O; excludes serial transceiver channels.
Package dedicated channels: 4 GTP.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, SBG484 columns; GTP column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 215,360 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 13,140 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7A200T-2FBG484C
Package: SBG484 → FBG484. Verify the applicable limits and design impact.
Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -1L → -2. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR I/O; excludes serial transceiver channels.
Package dedicated channels: 4 GTP.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, FBG484 columns; GTP column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 215,360 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 13,140 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7A200T-2SBV484I
Package: SBG484 → SBV484. Verify the applicable limits and design impact.
Speed grade: -1L → -2. Verify the applicable limits and design impact.
Lifecycle / ordering: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.
Package: SBV484.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 265, Figure 4-11, shared SBG484/SBV484 drawing, title · scope: package. Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): -40 to +100 °C.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 19 x 19 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 265, Figure 4-11, shared SBG484/SBV484 drawing, D/E dimensions · scope: package. Package body width x length, not die dimensions, height or PCB keep-out.
Package user I/O: 285 I/O.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 16, Table 1-8, XC7A200T row, SBG484/SBV484 shared column · scope: device-package. HR user I/O only; excludes serial transceiver channels.
Package dedicated channels: 4 GTP channels.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 12, Table 1-3, XC7A200T row, SBG484/SBV484 shared column · scope: device-package. Channels bonded out in this exact device/package; a blank or dash is never read as zero.
Logic cells (AMD): 215,360 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 13,140 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Does the low-power designation give a board power figure?
No. This record does not establish application watts. Use the relevant voltage and timing conditions, actual resource activity and I/O loading in vendor power estimation, then validate the rail and thermal plan.
What does the numerical example establish for XC7A200T-L1SBG484I?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
86 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Package: SBG484 → FBG676. Verify the applicable limits and design impact.
Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -1L → -1. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
