Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for XC7A100T-1CSG324C. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
XC7A100T-1CSG324C is an FPGA in the AMD / Xilinx Artix-7 family, supplied in the CSG324 package. Its reviewed resources include 101,440 logic cells, 4,860 Kb of block RAM, 210 I/O for this device/package combination. This ordering code specifies speed grade -1 and Commercial (C) temperature grade. The selected device/package has 0 GTP channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
A parallel-interface design needs a pin plan before a larger FPGA
Use these checks to prepare a design review or a sourcing request for XC7A100T-1CSG324C. The evidence rows describe the device; the actions are engineering guidance, not completed validation.
Separate ordinary I/O from dedicated serial links
User I/O in this package
210 I/O
Serial transceivers in this package
0 GTP
Check: List parallel buses, control signals and dedicated serial links separately. Use the CSG324 channel row as a stop/go check before choosing a transceiver-based interface.
Prepare: A signal list with a physical pin class for every interface; a general-purpose pin budget must not be presented as a GTP lane budget.
Evidence and conditions
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. No GTP channels exposed in this selected device/package combination.
Turn the package count into bank assignments
Package code
CSG324
User I/O in this package
210 I/O
Check: Group interfaces by required I/O standard and bank supply. Place clock-capable inputs, differential pairs and configuration functions using the exact CSG324 pinout; a positive spare-pin total alone is insufficient.
Prepare: A bank-voltage table and preliminary pin assignment checked in the vendor tools before schematic release.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
Review assembly geometry and operating temperature
Package body
15 × 15 mm
Ball pitch
0.8 mm
Junction temperature (Tj)
0 to +85 °C
Temperature reference
Tj
Check: Give the PCB and assembly supplier the official package drawing, stack-up and escape-routing proposal. Evaluate the documented temperature basis with the board power and cooling estimate rather than treating it as an ambient rating.
Prepare: A footprint/drawing cross-check and thermal assumptions attached to the board revision.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Before accepting a quotation
Require the quote and label to retain -1CSG324C; a different package or grade needs a separate approval.
Ask for quantity, unit-price breaks, currency, destination, shipment date and whether the offer is stock or a procurement estimate.
Define required traceability, lot/date-code limits and acceptance tests before comparing offers; a package photograph alone is not authenticity evidence.
Availability, price, shipment date and evidence deliverables require confirmation for the actual offer. No supplier stock or replacement qualification is established by this page.
Choose the sourcing or redesign route
For an existing CSG324 board, preserve the exact approved ordering code and check the offered lot against the BOM.
If the design needs dedicated transceiver lanes, compare a documented package that exposes them; include clocking and pinout review.
If the issue is logic or memory capacity, use the implementation report first, then compare density and package together.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operation
Not confirmed
unconfirmed
Minimum core voltage
Not confirmed
unconfirmed
Nominal core voltage
Not confirmed
unconfirmed
Maximum core voltage
Not confirmed
unconfirmed
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
supplyConditions
Confirm the current manufacturer lifecycle at quotation.
Available stock
Not confirmed
supplyConditions
Stock, lot traceability and delivery are confirmed during quotation.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Check the CSG324 connection budget before choosing the logic density
This selection is useful when a parallel control or buffered processing design needs the XC7A100T resource set in CSG324. Treat the sourced package GTP count as a gating check for any dedicated serial-link requirement before layout. Compare the larger Artix option below for I/O and serial-channel exposure, then reassess footprint and timing.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 130 I/O remain in the count-only budget (38.1% allocated).
Planning diagram: assumed I/O allocation 80 I/O assumed allocation / 210 documented package I/O; 130 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
38.1% of the sourced package count allocated; 130 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 32,768 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 4,860 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7A100T-1CSG324C and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7A100T-1CSG324C
Lifecycle / ordering: Confirm the current manufacturer lifecycle at quotation.
Speed grade: -1.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: MPN. Speed grade is not a single guaranteed application clock frequency.
Operating temperature (see basis/conditions): 0 to +85 °C.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature.
Temperature basis: Tj.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 15 × 15 mm.UG475 — Packaging and Pinout · Package overview and device/package combinations · scope: package.
Package user I/O: 210 I/O.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
Package dedicated channels: 0 GTP.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. No GTP channels exposed in this selected device/package combination.
Logic cells (AMD): 101,440 logic cells.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. Vendor logic-cell metric; not equivalent to another architecture's ALM count.
Embedded block memory: 4,860 Kb.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. AMD source unit retained: Kb is kilobits, not kilobytes.
Sources and conditions: XC7A200T-2FBG484C
Package: CSG324 → FBG484. Verify the applicable limits and design impact.
Speed grade: -1 → -2. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Artix 7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 1.27.1 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR I/O; excludes serial transceiver channels.
Package dedicated channels: 4 GTP.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 5, XC7A200T row, FBG484 columns; GTP column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 215,360 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 13,140 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Practical questions for this selection
Can I reserve the same pins for a future GTP link?
Use the sourced CSG324 channel count in the comparison table. General-purpose I/O cannot be counted as dedicated GTP channels. A future serial-link option needs a documented device/package with sufficient exposed channels and a fresh clock, pinout and board review.
What does the numerical example establish for XC7A100T-1CSG324C?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
117 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Package: CSG324 → FBG484. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
