SIDE-BY-SIDE REVIEW

Compare FPGA devices

Review resource differences, package constraints and the fields that still need confirmation.

Select devices (2–4)

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.

Parameter / status	XC7A200T-L1SBG484IArtix-7	XC7K325T-1FBG676CKintex-7
Logic cellsDifferent	215360 logic cellsDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.	326080 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.
6-input LUTsDifferent	134600 LUT6DS180 ↗ · derivedp. 3, Table 4, XC7A200T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 33650 slices x 4 LUT6 per slice.	203800 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K325T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 50950 slices x 4 LUT6 per slice.
Block RAM capacityDifferent	13140 KbDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.	16020 KbDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.
36 Kb block RAM blocksDifferent	365 blocksDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.	445 blocksDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.
DSP slicesDifferent	740 DSP48E1DS180 ↗ · devicep. 3, Table 4, XC7A200T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.	840 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K325T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.
User I/O in this packageDifferent	285 I/ODS180 ↗ · device-packagep. 3, Table 5, XC7A200T row, SBG484 columns Conditions Package-specific user I/O. HR I/O; excludes serial transceiver channels.	400 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K325T row, FBG676 columns Conditions Package-specific user I/O. HR + HP; excludes GT serial channels.
Serial transceivers in this packageDifferent resource definitions	4 GTPDS180 ↗ · device-packagep. 3, Table 5, XC7A200T row, SBG484 columns; GTP column Conditions Number of channels exposed in this selected device/package; not device-family maximum.	8 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K325T row, FBG676 columns; GTX column Conditions Number of channels exposed in this selected device/package; not device-family maximum.
Package codeDifferent	SBG484UG475 ↗ · packagep. 265, Figure 4-11 title Conditions Exact package token; does not establish any full orderable MPN.	FBG676UG475 ↗ · packagep. 268, Figure 4-14 title Conditions Exact package token; does not establish any full orderable MPN.
Package ball countDifferent	484 ballsUG475 ↗ · packagep. 265, Figure 4-11; full 22 x 22 bottom-view matrix Conditions full 22 x 22 bottom-view matrix	676 ballsUG475 ↗ · packagep. 268, Figure 4-14; full 26 x 26 bottom-view matrix; Kintex equivalent p. 279 Figure 4-25 Conditions full 26 x 26 bottom-view matrix; Kintex equivalent p. 279 Figure 4-25
Package bodyDifferent	19 x 19 mmUG475 ↗ · packagep. 11, Table 1-1; p. 265, Figure 4-11, D/E dimensions Conditions Package body width x length; excludes PCB keep-out and component height.	27 x 27 mmUG475 ↗ · packagep. 11, Table 1-1; p. 268, Figure 4-14, D/E dimensions Conditions Package body width x length; excludes PCB keep-out and component height.
Ball pitchDifferent	0.8 mmUG475 ↗ · packagep. 11, Table 1-1; p. 265, Figure 4-11, e dimension Conditions Ball-to-ball pitch.	1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 268, Figure 4-14, e dimension Conditions Ball-to-ball pitch.
Package terminals / leads (vendor count)Unconfirmed data	Not confirmed	Not confirmed Conditions Not verified in this bounded review.
Speed gradeDifferent	-1LDS180 ↗ · MPNp. 16, Figure 2; note 1 Conditions Retain original ordering code -L1 in the literal MPN. Datasheet grade is -1L. This is not a single application clock limit.	-1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend Conditions Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Junction temperature (Tj)Different	-40 to +100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.	0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature gradeDifferent	Industrial (I)DS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Core voltage conditionsUnconfirmed data	Not confirmed Conditions Not verified in this review.	Not confirmed Conditions Not verified in this bounded review.
Maximum application clockUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Application powerUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Minimum junction temperatureDifferent	-40 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.	0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Maximum junction temperatureDifferent	100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.	85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Temperature referenceSame	TjDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.	TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Conditional temperature operationUnconfirmed data	Not confirmed	Not confirmed Conditions Not verified in this bounded review.
Minimum core voltageUnconfirmed data	Not confirmed	Not confirmed Conditions Not verified in this bounded review.
Nominal core voltageUnconfirmed data	Not confirmed	Not confirmed Conditions Not verified in this bounded review.
Maximum core voltageUnconfirmed data	Not confirmed	Not confirmed Conditions Not verified in this bounded review.
Current lifecycleUnconfirmed data	Not confirmed Conditions Not verified in this review.	Not confirmed Conditions Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement.
Available stockUnconfirmed data	Not confirmed Conditions Not verified in this review.	Not confirmed Conditions No inventory, stock, price or lead-time evidence was reviewed.