Your commercial contact
KB Group Co.,LTD
Chip sourcing and PCBA project coordination.
Manufacturing capability references: PCBSync group facilities. The quotation identifies the contracting party and delivery terms.
PCB FABRICATION
PCB fabrication for FPGA designs
Connect stack-up, routing and material requirements with the process window your FPGA board needs.
GROUP MANUFACTURING
PCB process capability
FPGA.io combines chip sourcing with PCBSync group manufacturing resources. The published process window guides the review of your board.
| Process | Published group capability | Confirm for your project |
|---|---|---|
| Multilayer rigid PCB | 1–24 layers in the published mass-production windowPCBSync process source ↗ | Advanced layer counts require engineering review; group pages list different upper limits. |
| Fine lines / spaces | 3 mil minimum in the published rigid-board tablePCBSync process source ↗ | Confirm copper weight, stack-up and production yield requirements together. |
| Controlled impedance | ±10% production; ±7% extended windowPCBSync process source ↗ | Agree material, stack-up, coupon and TDR report scope. |
| Heavy copper | 4 oz production; up to 12 oz extendedPCBSync process source ↗ | Fine-line capability and maximum copper are separate process conditions. |
| HDI & high-speed routing | Microvias, via-in-pad, back-drilling and low-loss materialsPCBSync process source ↗ | Submit package fan-out, via structure and signal requirements for DFM. |
| Bare-board evidence | AOI, electrical test, microsection and impedance verificationPCBSync process source ↗ | Confirm which checks and reports apply to your lot. |
Source pages reviewed 30 September 2026. Published limits describe individual capabilities; they do not guarantee that all extremes can be combined. The approved quotation defines the selected process and acceptance criteria.
BUILD YOUR REVIEW BRIEF
What does your board need?
Select the issues to include in your request. Your design files stay with you until a transfer route is agreed.
SUPPLIER QUALIFICATION
Know what will be confirmed.
Arrange evidence for the exact build, material and delivery scope.
Engineering confirmation
You provide the controlled BOM, drawing revision and acceptance criteria. FPGA.io coordinates the sourcing and manufacturing review; process exceptions require your approval.
Ask for the relevant DFM findings, stack-up confirmation, first-article plan and inspection scope.
Quality & traceability evidence
Specify required lot/date-code records, material declarations, test results and certificates with your inquiry.
Where certification is required, request the current certificate, issuing body, entity and scope. An IPC acceptance class or “capable” statement is not a certification.
PCBSync quality process ↗QUOTATION & HANDOVER
A quotation your team can evaluate.
Before order approval
- Exact MPNs / board revision and quantity
- Component supply and approved-alternate scope
- Unit price, tooling / setup and test charges
- Proposed lead time, freight and payment terms
- Validity, exclusions and outstanding decisions
Before the build
- Frozen BOM and manufacturing data revision
- Approved stack-up and DFM exceptions
- Inspection class, coverage and test criteria
- Programming files and fixtures, if required
- Agreed release and change-approval contacts
Delivery record checklist
Illustrative checklist — agree the required documents in your quotation.
- Build / lot identifiers and revision
- Inspection and agreed test records
- Material / component traceability documents
- Approved deviations and packing details
CONTROLLED DESIGN INPUTS
Prepare a reviewable package.
Start with non-confidential requirements. Agree an NDA and secure file-transfer route before sharing controlled design files.
Board data
Gerber / ODB++ outputs, drill data, Stack-up, impedance requirements, dimensions, finish and fabrication notes. State the drawing revision.
Components & assembly
Complete MPNs, quantities, approved alternates, BOM revision, pick-and-place data, assembly drawing and any supplied components.
Acceptance & delivery
Required inspection class, test plan, programming files, fixtures, traceability records, delivery destination and requested date.
Check manufacturing file readiness → · Download editable project worksheets →
FROM REQUIREMENT TO QUOTATION
A clear project handoff.
One request connects the chip, the board and the evidence your team needs.
- 01
Send the outline
Full part number, board revision, quantity and the requested schedule.
- 02
Review the scope
Assess the BOM, manufacturing inputs and inspection requirements.
- 03
Approve the quotation
Confirm cost, lead time, process exceptions and acceptance criteria.
- 04
Build & document
Follow the agreed build, release and reporting requirements.
Bring the chip and board into one review.
Include the complete MPN, build quantity and board revision.