Compare architectures.
Workload, interfaces and trade-offs between processors, programmable logic and dedicated devices.
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Advanced systems.
Clearer engineering decisions.
Explore the electronics behind servers, communication networks, precision instruments and complex equipment. Start with the application; leave with the questions your next design review needs to answer.
Explore industries ↓FIND YOUR APPLICATION
An industry map for the next project.
Choose a sector or search a system, interface or engineering concern.
48 application briefs across 12 industries
Reset filters01 / 4 applications
Data centres & HPC
Servers, accelerators, storage and rack infrastructure.
Explore applications →02 / 4 applicationsTelecom & networking
Base stations, radio units, transport and precision timing.
Explore applications →03 / 4 applicationsTest & measurement
Oscilloscopes, RF instruments, acquisition and protocol analysis.
Explore applications →04 / 4 applicationsSemiconductor equipment
ATE, wafer inspection, motion stages and packaging equipment.
Explore applications →05 / 4 applicationsIndustrial automation
Robotics, motion control, industrial networks and condition monitoring.
Explore applications →06 / 4 applicationsImaging & photonics
Machine vision, high-speed cameras, optical sensing and displays.
Explore applications →07 / 4 applicationsMedical & life science
Imaging, laboratory instruments and biological measurement systems.
Explore applications →08 / 4 applicationsAerospace & civil telemetry
Space electronics, ground equipment, flight testing and inspection payloads.
Explore applications →09 / 4 applicationsEnergy & power systems
Grid monitoring, storage, conversion and charging infrastructure.
Explore applications →10 / 4 applicationsTransport & mobility
Vehicle compute, rail electronics, roadside systems and marine sensing.
Explore applications →11 / 4 applicationsScientific research systems
Accelerators, quantum laboratories, telescopes and large experiments.
Explore applications →12 / 4 applicationsBroadcast & professional AV
Live production, video routing, encoding and precision audio.
Explore applications →No application matches both filters.
Try a broader term, choose another industry or reset the filters. You can also bring a new application to the engineering discussion.
Ask an engineering question →EXPLORE / QUESTION / PREPARE
Open an application brief.
Planning prompts, not verified BOMs or customer case studies. Expand a system to see what to gather.
Data centres & HPCServers, accelerators, storage and rack infrastructure.4 briefs
Start with the workload and host software. Compare CPU, GPU, dedicated silicon and FPGA paths against sustained throughput, power and integration effort.
AI & HPC serversView planning brief
Illustrative system pathHost CPU → accelerator / memory → fabric
Chip categories to evaluate
Server processors, GPU/FPGA accelerators, memory, power controllers.
Question that changes the shortlist
Where is the measured bottleneck: compute, memory movement, host I/O or cooling?
Bring to the design review
Workload profile, host interface map, power envelope and software ownership.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
SmartNIC & DPU platformsView planning brief
Illustrative system pathNetwork ports → packet pipeline → host / storage
Chip categories to evaluate
Network controllers, programmable logic, transceivers, clocks.
Question that changes the shortlist
Which packet operations need offload, and how will worst-case latency be measured?
Bring to the design review
Traffic profiles, port map, packet-loss criteria and host-driver requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Storage & NVMe infrastructureView planning brief
Illustrative system pathStorage media → controller / switch → host fabric
Chip categories to evaluate
Storage controllers, PCIe switches, memory, power protection.
Question that changes the shortlist
How do queue depth, recovery and power-loss behavior change the architecture?
Bring to the design review
Capacity and endurance targets, interface topology and recovery test plan.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Server & rack managementView planning brief
Illustrative system pathRail / thermal sensors → controller → management network
Chip categories to evaluate
Management processors, CPLDs, sensors, supervisors, PMICs.
Question that changes the shortlist
Who owns sequencing, fault response and remote firmware recovery?
Bring to the design review
Rail sequencing, telemetry list, update policy and service-access requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Telecom & networkingBase stations, radio units, transport and precision timing.4 briefs
Keep radio, transport and timing budgets separate. A headline interface rate does not establish useful payload throughput or end-to-end synchronization.
5G / Open RAN base stationsView planning brief
Illustrative system pathAntenna / RF → radio processing → fronthaul / baseband
Chip categories to evaluate
RF transceivers, converters, FPGA/SoC, clocking, power devices.
Question that changes the shortlist
Which split, channel bandwidth and antenna count define the processing and transport load?
Bring to the design review
Functional split, radio-channel matrix, fronthaul budget and timing requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Microwave & backhaul linksView planning brief
Illustrative system pathRF front end → modem processing → network interface
Chip categories to evaluate
RF devices, converters, programmable logic, Ethernet interfaces.
Question that changes the shortlist
How do modulation, channel conditions and link availability affect buffering and processing?
Bring to the design review
Link assumptions, bandwidth targets, interface map and environmental envelope.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Optical & packet transportView planning brief
Illustrative system pathOptical module → framing / switching → network fabric
Chip categories to evaluate
Optical control ICs, retimers, network silicon, FPGA, power devices.
Question that changes the shortlist
Which protocols, lane rates and module power states must the board support?
Bring to the design review
Lane map, protocol versions, signal-integrity plan and module-management requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Network timing & synchronizationView planning brief
Illustrative system pathReference clock → synchronization engine → distributed nodes
Chip categories to evaluate
Clock generators, jitter cleaners, timing processors, programmable logic.
Question that changes the shortlist
What are the reference-loss behavior and allowed timing error at each endpoint?
Bring to the design review
Clock tree, holdover assumptions, synchronization budget and measurement points.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Test & measurementOscilloscopes, RF instruments, acquisition and protocol analysis.4 briefs
Measurement accuracy depends on the analog chain, calibration, clocks and test conditions. Digital resource counts alone cannot prove instrument performance.
Oscilloscopes & digitizersView planning brief
Illustrative system pathAnalog front end → ADC → trigger / capture memory → host
Chip categories to evaluate
Amplifiers, ADCs, clocking, FPGA/SoC, memory.
Question that changes the shortlist
What sample rate, resolution, channel count and capture length must operate together?
Bring to the design review
Acquisition budget, trigger requirements, analog limits and calibration approach.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
RF signal & spectrum instrumentsView planning brief
Illustrative system pathRF conditioning → ADC / DAC → digital processing → control
Chip categories to evaluate
RF signal-chain ICs, data converters, synthesizers, DSP/FPGA.
Question that changes the shortlist
Which bandwidth, noise and dynamic-range targets need independent measurement?
Bring to the design review
Frequency plan, signal-chain budget, calibration references and test conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Precision data acquisitionView planning brief
Illustrative system pathSensors → conditioning → synchronized conversion → storage
Chip categories to evaluate
Precision amplifiers, ADCs, isolation, clocks, MCU/FPGA.
Question that changes the shortlist
How are channel alignment, input protection and drift characterized?
Bring to the design review
Channel matrix, accuracy budget, isolation needs and sustained logging requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Protocol analyzers & BERTView planning brief
Illustrative system pathLink under test → capture / pattern engine → analysis host
Chip categories to evaluate
High-speed transceivers, FPGA, retimers, memory, clocking.
Question that changes the shortlist
Which protocol revisions and electrical conditions must be generated or observed?
Bring to the design review
Protocol coverage, lane map, reference clock plan and acceptance test matrix.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Semiconductor equipmentATE, wafer inspection, motion stages and packaging equipment.4 briefs
Separate equipment control from measurement and protection. Define serviceability, calibration and long-life component support before freezing the board.
Automated test equipmentView planning brief
Illustrative system pathPattern / timing engine → device interface → capture / analysis
Chip categories to evaluate
FPGA, pin electronics, converters, precision clocks, power ICs.
Question that changes the shortlist
How do test-site count, timing resolution and device interfaces scale together?
Bring to the design review
Pin map, pattern budget, synchronization plan and fixture revision control.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Wafer & mask inspectionView planning brief
Illustrative system pathOptical sensors → acquisition → image processing → defect review
Chip categories to evaluate
Image sensors, analog front ends, FPGA/GPU, memory, links.
Question that changes the shortlist
Can acquisition and processing sustain the scan without losing inspection data?
Bring to the design review
Pixel/data budget, scan synchronization, calibration and host-transfer plan.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Precision stage controlView planning brief
Illustrative system pathPosition feedback → real-time control → actuator interface
Chip categories to evaluate
Encoder interfaces, converters, real-time processors, isolation.
Question that changes the shortlist
What jitter, feedback delay and independent protection are required?
Bring to the design review
Axis timing, feedback interfaces, motion envelope and protection responsibilities.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Advanced packaging equipmentView planning brief
Illustrative system pathVision / process sensors → coordination → machine actuators
Chip categories to evaluate
MCU/SoC, vision interfaces, FPGA, motor and power devices.
Question that changes the shortlist
How will process measurements be associated with the correct unit and recipe?
Bring to the design review
Sensor map, recipe/version records, traceability fields and controller interfaces.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Industrial automationRobotics, motion control, industrial networks and condition monitoring.4 briefs
An FPGA is one implementation option for parallel I/O or timing. Compare it with real-time processors and dedicated controllers; document independent protection functions.
Robotics & multi-axis controlView planning brief
Illustrative system pathEncoders / sensors → coordinated control → drive interface
Chip categories to evaluate
Real-time processors, FPGA, encoder ICs, isolation, power devices.
Question that changes the shortlist
Which axes and sensor interfaces share a timing deadline?
Bring to the design review
Axis/channel matrix, synchronization targets and separation of control and protection.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Industrial Ethernet & gatewaysView planning brief
Illustrative system pathField interfaces → protocol bridge → plant network
Chip categories to evaluate
Ethernet PHYs, processors, FPGA, isolation, secure elements.
Question that changes the shortlist
Which network schedules and legacy interfaces must coexist?
Bring to the design review
Protocol matrix, timing limits, port isolation and update/maintenance policy.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Servo drives & motor systemsView planning brief
Illustrative system pathCurrent / position feedback → control → gate-drive stage
Chip categories to evaluate
Converters, control processors, isolators, gate drivers, power switches.
Question that changes the shortlist
How are sensing delay and fault shutdown verified independently?
Bring to the design review
Control-loop assumptions, power-stage scope, sensing map and fault-test responsibilities.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Machine condition monitoringView planning brief
Illustrative system pathVibration / current sensors → acquisition → analysis → gateway
Chip categories to evaluate
Sensors, low-noise amplifiers, ADCs, MCU/FPGA, communications ICs.
Question that changes the shortlist
What bandwidth and recording window are needed to capture the event of interest?
Bring to the design review
Sensor placement assumptions, sampling plan, storage budget and detection validation data.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Imaging & photonicsMachine vision, high-speed cameras, optical sensing and displays.4 briefs
Evaluate the whole path from exposure to host memory. A processor choice needs the actual pixel format, number of streams, latency and optical constraints.
Industrial vision & inspectionView planning brief
Illustrative system pathSensor → acquisition → buffering / processing → host
Chip categories to evaluate
Image sensors, interface ICs, FPGA/SoC, memory, power devices.
Question that changes the shortlist
What are the pixel format, frame rate and number of simultaneous streams?
Bring to the design review
Image-bandwidth budget, interface map, latency target and inspection data set.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
High-speed scientific camerasView planning brief
Illustrative system pathSensor array → parallel capture → frame buffer → recorder
Chip categories to evaluate
Sensor interfaces, FPGA, high-bandwidth memory, host-link devices.
Question that changes the shortlist
How long can the camera sustain a burst before buffering or output becomes limiting?
Bring to the design review
Burst/capture budget, synchronization triggers, thermal envelope and storage plan.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Optical & spectral sensingView planning brief
Illustrative system pathDetector → analog conditioning → conversion → spectral analysis
Chip categories to evaluate
Photodetector front ends, converters, clocks, DSP/FPGA.
Question that changes the shortlist
Which detector noise and calibration effects dominate the result?
Bring to the design review
Optical assumptions, acquisition window, calibration procedure and processing budget.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Precision display & projectionView planning brief
Illustrative system pathVideo input → processing / timing → display interface
Chip categories to evaluate
Video receivers, FPGA/SoC, timing devices, display drivers.
Question that changes the shortlist
Which resolution, synchronization and latency combinations need support?
Bring to the design review
Format matrix, frame-buffer requirements, clock map and image-quality criteria.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Medical & life scienceImaging, laboratory instruments and biological measurement systems.4 briefs
These are electronics planning prompts. Device selection does not establish clinical performance, patient safety or regulatory qualification; those require the equipment team's own evidence.
Ultrasound acquisition electronicsView planning brief
Illustrative system pathTransducer interface → analog front end → processing → host
Chip categories to evaluate
Ultrasound AFEs, converters, FPGA/SoC, memory, power devices.
Question that changes the shortlist
How do channel count, synchronization and data movement constrain the electronics?
Bring to the design review
Channel/data budget, interface conditions and assigned system-verification responsibilities.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
X-ray & CT detector readoutView planning brief
Illustrative system pathDetector electronics → synchronized acquisition → reconstruction host
Chip categories to evaluate
Detector AFEs, ADCs, FPGA, memory, high-speed interfaces.
Question that changes the shortlist
What timing, data integrity and calibration evidence is required from the readout chain?
Bring to the design review
Detector interface specification, acquisition timing and traceable data-path tests.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Laboratory automation & diagnosticsView planning brief
Illustrative system pathOptical / fluidic sensors → acquisition / control → analysis host
Chip categories to evaluate
Precision analog, converters, motor controls, processors, interfaces.
Question that changes the shortlist
How are measurements tied to the correct sample, calibration and hardware revision?
Bring to the design review
Channel map, sample-tracking interface, calibration records and test ownership.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Life-science optical instrumentsView planning brief
Illustrative system pathOptical detector → low-noise acquisition → processing → workstation
Chip categories to evaluate
Low-noise amplifiers, ADCs, clocks, FPGA/processor, memory.
Question that changes the shortlist
Which measurement interval and noise sources govern the acquisition design?
Bring to the design review
Signal/noise assumptions, synchronization plan and reproducible electronic test conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Aerospace & civil telemetrySpace electronics, ground equipment, flight testing and inspection payloads.4 briefs
Keep mission/environment qualification separate from the functional architecture. The applications listed here do not establish flight heritage or qualification of FPGA.io services.
Scientific satellite payload electronicsView planning brief
Illustrative system pathScientific sensors → payload processing → onboard data interface
Chip categories to evaluate
Qualified processors/FPGA, converters, memory, power devices.
Question that changes the shortlist
Which environment, fault recovery and parts-screening requirements belong to the mission?
Bring to the design review
Mission constraints, interface control document and component qualification evidence list.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Civil satellite ground equipmentView planning brief
Illustrative system pathRF front end → modem / processing → terrestrial network
Chip categories to evaluate
RF devices, converters, FPGA/SoC, timing and network ICs.
Question that changes the shortlist
What bandwidth, synchronization and host interfaces define the ground equipment?
Bring to the design review
Frequency/interface plan, data budget, environmental scope and verification conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Flight-test data recordersView planning brief
Illustrative system pathInstrumentation sensors → timestamped capture → storage
Chip categories to evaluate
Converters, programmable logic, timing, storage and interface ICs.
Question that changes the shortlist
How are timestamps, data gaps and recovery behavior recorded for later analysis?
Bring to the design review
Channel/timestamp specification, retention budget and environmental test scope.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Civil drones & field inspectionView planning brief
Illustrative system pathCamera / sensors → payload processing → storage / telemetry
Chip categories to evaluate
Vision processors, memory, sensor interfaces, optional FPGA.
Question that changes the shortlist
What power, mass and thermal envelope is available to the inspection payload?
Bring to the design review
Payload interface map, local/remote processing split and platform responsibility boundaries.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Energy & power systemsGrid monitoring, storage, conversion and charging infrastructure.4 briefs
Start from measurement, isolation and protection requirements. Component ratings must be checked in the actual electrical, thermal and fault conditions.
Grid & power-quality monitoringView planning brief
Illustrative system pathVoltage / current sensing → synchronized conversion → analysis
Chip categories to evaluate
Metering AFEs, ADCs, isolation, timing, MCU/FPGA.
Question that changes the shortlist
How will phase alignment, sampling and isolation affect the reported measurements?
Bring to the design review
Measurement ranges, timing budget, isolation scope and calibration plan.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Energy storage & battery systemsView planning brief
Illustrative system pathCell / pack sensing → management controller → power interface
Chip categories to evaluate
Battery monitors, isolated communications, controllers, protection ICs.
Question that changes the shortlist
Which measurements and independent protection actions must remain available during faults?
Bring to the design review
Sensing topology, communications map and protection/validation responsibilities.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Renewable energy & conversionView planning brief
Illustrative system pathSensing → control computation → isolated drive → power stage
Chip categories to evaluate
Controllers, converters, isolators, gate drivers, power semiconductors.
Question that changes the shortlist
What switching, sensing and thermal assumptions constrain the control electronics?
Bring to the design review
Power-stage envelope, timing budget, sensing requirements and test-access plan.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
EV charging infrastructureView planning brief
Illustrative system pathMetering / control → isolated conversion → vehicle interface
Chip categories to evaluate
Power devices, controllers, metering, isolation and communications ICs.
Question that changes the shortlist
Which charging interfaces and power-module responsibilities are fixed for the project?
Bring to the design review
Interface/version matrix, power budget, control boundaries and manufacturing test scope.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Transport & mobilityVehicle compute, rail electronics, roadside systems and marine sensing.4 briefs
An application match does not establish automotive or railway qualification. Check grade, lifecycle, operating conditions and system-level validation separately.
Vehicle sensor & domain computeView planning brief
Illustrative system pathCameras / sensors → synchronized processing → vehicle network
Chip categories to evaluate
Sensor interfaces, compute SoCs, memory, power and network devices.
Question that changes the shortlist
Which tasks need deterministic timing and which can tolerate host scheduling?
Bring to the design review
Interface/data budget, compute workload and separation of prototype and qualified hardware.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Rail monitoring & onboard electronicsView planning brief
Illustrative system pathVehicle sensors → acquisition / gateway → onboard network
Chip categories to evaluate
Isolated interfaces, controllers, FPGA, memory, power protection.
Question that changes the shortlist
What environment, maintenance period and communications requirements govern the board?
Bring to the design review
Lifecycle plan, interface control document and equipment qualification responsibilities.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Roadside sensing & infrastructureView planning brief
Illustrative system pathCamera / environmental sensors → local processing → network
Chip categories to evaluate
Sensor ICs, edge processors, FPGA interfaces, memory, power devices.
Question that changes the shortlist
What can be processed locally under the available power and communications limits?
Bring to the design review
Sensor/data map, remote maintenance needs and outdoor operating conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Marine survey & monitoringView planning brief
Illustrative system pathAcoustic / environmental sensors → acquisition → processing / storage
Chip categories to evaluate
Analog front ends, converters, FPGA/processor, timing, interfaces.
Question that changes the shortlist
How are channel timing, data retention and platform motion recorded?
Bring to the design review
Channel and timestamp map, storage budget and enclosure/environment requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Scientific research systemsAccelerators, quantum laboratories, telescopes and large experiments.4 briefs
Treat each facility as a distinct integration project. Record experiment timing, detector interfaces, software versions and reproducibility requirements before selecting a platform.
Particle detector readoutView planning brief
Illustrative system pathDetector channels → timestamp / event selection → data network
Chip categories to evaluate
Detector front ends, FPGA, clocks, memory, optical interfaces.
Question that changes the shortlist
What event rate, burst occupancy and backpressure must the readout tolerate?
Bring to the design review
Event/data budget, trigger timing and documented data-loss behavior.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Accelerator & beamline controlsView planning brief
Illustrative system pathInstrumentation → synchronized control / acquisition → facility network
Chip categories to evaluate
Converters, timing devices, FPGA/SoC, interfaces, power controllers.
Question that changes the shortlist
Which loops and acquisition nodes require a common time reference?
Bring to the design review
Timing architecture, channel specification and equipment protection boundaries.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Quantum control instrumentationView planning brief
Illustrative system pathWaveform generation / capture → synchronized electronics → experiment
Chip categories to evaluate
DACs, ADCs, synthesizers, FPGA, timing and RF components.
Question that changes the shortlist
Which synchronization, latency and calibration requirements can be measured independently?
Bring to the design review
Channel timing budget, waveform requirements and electronics calibration records.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Radio astronomy & observatoriesView planning brief
Illustrative system pathReceiver arrays → digitization → channelization / correlation → storage
Chip categories to evaluate
Low-noise RF, converters, FPGA/GPU, timing, optical links.
Question that changes the shortlist
How do channel count and sustained data rate determine processing and transport?
Bring to the design review
Array/data-flow budget, synchronization reference and retained-data requirements.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Broadcast & professional AVLive production, video routing, encoding and precision audio.4 briefs
Compare image/audio quality, latency and interoperability under the actual format set. Keep licensing, protocol versions and product lifecycle in the platform decision.
Live video productionView planning brief
Illustrative system pathCamera inputs → synchronization / processing → production outputs
Chip categories to evaluate
Video interface ICs, FPGA/SoC, memory, clocks, power devices.
Question that changes the shortlist
Which simultaneous formats and frame delays must the production workflow support?
Bring to the design review
Input/output matrix, synchronization plan and end-to-end latency budget.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
IP video & media gatewaysView planning brief
Illustrative system pathVideo / audio streams → packet processing → network
Chip categories to evaluate
Ethernet devices, FPGA/SoC, timing, memory, transceivers.
Question that changes the shortlist
How do packet buffering and network timing affect stream continuity?
Bring to the design review
Stream bandwidth, timing profile, packet-loss behavior and interoperability tests.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Video encoding & contributionView planning brief
Illustrative system pathVideo capture → codec / processing → network or storage
Chip categories to evaluate
Codec processors, FPGA/GPU options, memory, interface and power ICs.
Question that changes the shortlist
What quality, delay and bitrate trade-offs are acceptable for each content type?
Bring to the design review
Codec/profile matrix, representative input material and throughput/power test conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
Professional audio & synchronizationView planning brief
Illustrative system pathAudio converters → routing / DSP → synchronized outputs
Chip categories to evaluate
Audio ADCs/DACs, DSP/FPGA, clocks, network interfaces.
Question that changes the shortlist
What channel count, clock relationships and routing delay must remain predictable?
Bring to the design review
Audio channel map, clock-domain plan, latency budget and noise measurement conditions.
Continue with exact evidence
Check package, grade, official documents, lifecycle and software support before selecting a part.
ROOM FOR DEEPER PROJECTS
From application briefs to engineering evidence.
Future content will build on these sectors as sources, practical work and shareable project evidence become available.
Evaluate exact parts.
Source-linked specifications, lifecycle, package differences and migration conditions.
Prepare the hardware.
Power, clocks, layout, manufacturing handoff and a clearly scoped test plan.
Show what was verified.
Actual scope, measured results and limitations, published only with appropriate evidence and permission.
FROM SYSTEM TO BOARD
Bring a project we can scope.
For chip sourcing and PCBA, start with the exact parts or board revision, expected quantity, delivery needs and required inspection or test evidence.
01 · Prepare the board review →02 · Work through the engineering budgets →03 · Review PCBA and inspection scope →
Discuss a sourcing + PCBA project ↗SCOPE & SOURCES
Use these briefs to start the review.
FPGA.io editorial planning · AI-assisted preparation. Application questions and deliverables are original planning prompts. They do not establish a validated design, customer relationship, certification or manufacturer endorsement.
Manufacturer pages provide application context. Confirm exact component and system requirements against the applicable original documents.