Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for XC7K410T-1FFG900C. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
XC7K410T-1FFG900C is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FFG900 package. Its reviewed resources include 406,720 logic cells, 28,620 Kb of block RAM, 500 I/O for this device/package combination. This ordering code specifies speed grade -1 and Commercial (C) temperature grade. The selected device/package has 16 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Choose the right balance of parallel connections and dedicated lanes
Use these checks to prepare a design review or a sourcing request for XC7K410T-1FFG900C. The evidence rows describe the device; the actions are engineering guidance, not completed validation.
Compare interface balance, not only the density number
User I/O in this package
500 I/O
Serial transceivers in this package
16 GTX
Logic cells
406,720 logic cells
Check: To evaluate XC7K420T in FFG1156, first decide whether the application is limited by ordinary I/O, dedicated lanes or internal resources. Compare the current sourced rows for both packages; nearby device numbers need not have the same interface balance.
Prepare: An interface worksheet that specifies which requirement motivates a device change.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Include package geometry in the board trade-off
Package code
FFG900
Package body
31 x 31 mm
Ball pitch
1 mm
Check: A move to FFG1156 requires a fresh geometry and pin-plan review. Check board area, escape routing, power distribution and assembly feasibility before choosing a package for its documented channel exposure.
Prepare: A board-impact estimate with the package drawings, stack-up assumptions and connection mapping.
Validate processing capacity at the required conditions
Block RAM capacity
28,620 Kb
Speed grade
-1
Junction temperature (Tj)
0 to +85 °C
Temperature reference
Tj
Check: Budget buffers by block geometry and required ports, then check the implemented pipeline and clock constraints. Commercial grade and nominal resource counts do not establish throughput or ambient-temperature suitability.
Prepare: Buffer allocation, utilization/timing results and the power/thermal conditions used for evaluation.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Before accepting a quotation
Keep -1FFG900C on the quote and label review; a different density or grade remains a separate candidate.
Provide required quantity, delivery date, destination and traceability expectations so supplier offers can be compared on the same basis.
If a redesign is being considered, request separate availability and cost reviews; no comparison-table row is an approved substitution.
Availability, price, shipment date and evidence deliverables require confirmation for the actual offer. No supplier stock or replacement qualification is established by this page.
Choose the sourcing or redesign route
Existing FFG900 board meets requirements: source the exact code under the agreed lot and delivery conditions.
More dedicated lanes are required: examine FFG1156 and its board impact, using the actual lane/protocol requirements.
Only processing capacity is limiting: use implementation results to choose a resource change without assuming the interface plan stays valid.
Core device, package and grade fields are linked to official documents. The full MPN is evidenced by a historical manufacturer listing; current lifecycle and availability require confirmation. Voltage, application timing and power are not fully characterized here.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operation
Not confirmed
unconfirmed
Minimum core voltage
Not confirmed
unconfirmed
Nominal core voltage
Not confirmed
unconfirmed
Maximum core voltage
Not confirmed
unconfirmed
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
unconfirmedConditions
Not verified in this review.
Available stock
Not confirmed
unconfirmedConditions
Not verified in this review.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Full ordering-number evidence: XCN20011 v1.0, p. 3, Table 5, right table block, data row 23, Replacement Part column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Distinguish core-resource growth from a serial-lane requirement
The FFG900 commercial row is a candidate for a design that needs the XC7K410T core and its documented package connection set. Compare XC7K420T carefully: the larger package has different exposed I/O and transceiver totals, so a close density number does not mean the same board interface balance. Compare the industrial historical row only with a separate lifecycle and grade review.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 60 I/O remain in the count-only budget (88% allocated).
Planning diagram: assumed I/O allocation 440 I/O assumed allocation / 500 documented package I/O; 60 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
88% of the sourced package count allocated; 60 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 1,572,864 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 28,620 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7K410T-1FFG900C and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7K410T-1FFG900C
Lifecycle / ordering: Not verified in this review.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 289, Figure 4-35, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 500 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 16 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 406,720 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 28,620 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K420T-2FFG1156C
Package: FFG900 → FFG1156. Verify the applicable limits and design impact.
Speed grade: -1 → -2. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 35 x 35 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 272, Figure 4-18, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 400 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K420T row, FFG1156 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 32 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K420T row, FFG1156 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 416,960 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K420T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 30,060 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K420T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K325T-2FFV900I
Package: FFG900 → FFV900. Verify the applicable limits and design impact.
Temperature grade: Commercial (C) → Industrial (I). Verify the applicable limits and design impact.
Speed grade: -1 → -2. Verify the applicable limits and design impact.
Lifecycle / ordering: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.
Package: FFV900.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 289, Figure 4-35, shared FFG900/FFV900 drawing, title · scope: package. Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): -40 to +100 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 289, Figure 4-35, shared FFG900/FFV900 drawing, D/E dimensions · scope: package. Package body width x length, not die dimensions, height or PCB keep-out.
Package user I/O: 500 I/O.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 18, Table 1-9, XC7K325T row, FFG900/FFV900 shared column · scope: device-package. 350 HR + 150 HP = 500; transceiver channels are separate.
Package dedicated channels: 16 GTX channels.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 13, Table 1-4, XC7K325T row, FFG900/FFV900 shared column · scope: device-package. Channels bonded out in this exact device/package; a blank or dash is never read as zero.
Logic cells (AMD): 326,080 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 16,020 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Does the higher density number always mean more parallel I/O?
No. Read the exact package rows. Core resources, general-purpose I/O and exposed transceiver channels are separate limits; evaluate the signals, lanes, banks and reference clocks individually.
What does the numerical example establish for XC7K410T-1FFG900C?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
9 full MPNs meet the entered numeric constraints. Showing 1 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Package: FFG900 → FBG900. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
