FPGA.io Part NumberFIO-5F2B7C9E2150DFC4Internal catalogue reference · manufacturer MPN remains unchanged
Lifecycle & ordering review: Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement. Evidence and conditions ↓
Core fields reviewed 2026-09-28 Source links and conditions accompany each parameter.
Technical schematicBase-device resource diagram for XC7K160T. Not an exact-package photograph or pinout; package, I/O and grade limits for XC7K160T-1FBG484C appear in the sourced specifications below. Parameter sources below ↓
XC7K160T-1FBG484C is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FBG484 package. Its reviewed resources include 162,240 logic cells, 11,700 Kb of block RAM, 285 I/O for this device/package combination. This ordering code specifies speed grade -1 and Commercial (C) temperature grade. The selected device/package has 4 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
A higher logic density is useful only if the FBG484 interfaces fit
Use these checks to prepare a design review or a sourcing request for XC7K160T-1FBG484C. The evidence rows describe the device; the actions are engineering guidance, not completed validation.
Separate core-resource growth from package exposure
Logic cells
162,240 logic cells
Block RAM capacity
11,700 Kb
User I/O in this package
285 I/O
Serial transceivers in this package
4 GTX
Check: Use the implementation report to identify whether logic, buffering or external connections are the bottleneck. A larger core does not add pins or serial lanes to a package that has already reached its limit.
Prepare: A resource-versus-interface worksheet that names the actual limiting requirement.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Treat the -3E comparison as a grade change
Speed grade
-1
Junction temperature (Tj)
0 to +85 °C
Temperature reference
Tj
Check: When comparing -1FBG484C with -3FBG484E, keep the shared package label separate from the speed and temperature-grade decision. Recheck electrical tables, timing and thermal assumptions; a shared footprint is not a completed qualification.
Prepare: A difference report for the complete codes and a timing run for the proposed operating conditions.
Evidence and conditions
7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Retain the G-package lifecycle distinction
Package code
FBG484
Package body
23 x 23 mm
Ball pitch
1 mm
Check: Check the exact ordering evidence and lifecycle notes before a sourcing decision. A G-package replacement reference must not inherit the discontinuation event of the affected V-package code.
Prepare: A quote review recording the exact MPN, current lifecycle evidence when available and the board drawing used.
Ask for XC7K160T-1FBG484C explicitly; a -3E or FBV484 offer is an alternative requiring review.
Separate the supplier's current offer from historical manufacturer replacement documentation.
Specify lot/traceability requirements, desired delivery date, acceptance checks and whether PCBA programming/test is part of the request.
Availability, price, shipment date and evidence deliverables require confirmation for the actual offer. No supplier stock or replacement qualification is established by this page.
Choose the sourcing or redesign route
BOM unchanged: compare exact-code supplier offers on delivery, evidence and acceptance terms.
Timing is the bottleneck: evaluate another speed/grade with the same design constraints and an independent thermal review.
Interfaces or memory are the bottleneck: compare package and device resources, then assess the board and implementation changes.
Ordering-history check: Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement. Read the source and exact identity conditions.
Historical G-package replacement product listed in XCN20011. Exact MPN, device resources, exact package, package-specific I/O/transceivers, speed interpretation and junction-temperature grade have official evidence. Current supply, voltage, application clock and power are not characterized.
Full ordering-number evidence: XCN20011 v1.0, p. 3, Table 5, left block, data row 1, Replacement Part column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Check commercial -1 timing before paying the routing cost of a larger Kintex
The FBG484 commercial -1 option is a useful reference for a Kintex-7 design whose package connection count fits. Compare the -3 extended version to separate grade and timing decisions without changing the package label. A larger Kintex density can add core resources but must still satisfy its own package I/O budget and board constraints.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 61 I/O remain in the count-only budget (78.6% allocated).
Planning diagram: assumed I/O allocation 224 I/O assumed allocation / 285 documented package I/O; 61 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
78.6% of the sourced package count allocated; 61 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 393,216 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 11,700 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7K160T-1FBG484C and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7K160T-1FBG484C
Lifecycle / ordering: Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 4 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 162,240 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 11,700 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K160T-3FBG484E
Temperature grade: Commercial (C) → Extended (E). Verify the applicable limits and design impact.
Speed grade: -1 → -3. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -3.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -3 in the literal MPN. Datasheet grade is -3. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +100 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 4 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 162,240 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 11,700 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K410T-1FFG900C
Package: FBG484 → FFG900. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 289, Figure 4-35, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 500 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 16 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 406,720 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 28,620 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Exact identity evidence:XCN20011 — Product Discontinuation Notice for Selective FFV, FBV and SBV Device Packages · XCN20011 v1.0, p. 3, Table 5, left block, data row 1, Replacement Part column · Historical manufacturer replacement listing (2020-09-28), Replacement Part column. The notice does not establish current lifecycle, stock or orderability of this G-package replacement.
Practical questions for this selection
Does this G-package code inherit the V-package discontinuation notice?
The reviewed record specifically warns against transferring the V-package notice to its G-package replacement. Its current lifecycle remains unverified; check current manufacturer evidence for the exact code.
What does the numerical example establish for XC7K160T-1FBG484C?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
107 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
