FPGA.io Part NumberFIO-13133EFB46E6A5C3Internal catalogue reference · manufacturer MPN remains unchanged
Lifecycle & ordering review: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source. Evidence and conditions ↓
Core fields reviewed 2026-09-28 Source links and conditions accompany each parameter.
Technical schematicBase-device resource diagram for XC7K325T. Not an exact-package photograph or pinout; package, I/O and grade limits for XC7K325T-2FFV900I appear in the sourced specifications below. Parameter sources below ↓
XC7K325T-2FFV900I is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FFV900 package. Its reviewed resources include 326,080 logic cells, 16,020 Kb of block RAM, 500 I/O for this device/package combination. This ordering code specifies speed grade -2 and Industrial (I) temperature grade. The selected device/package has 16 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Historical V-package product affected by the 2020 XCN20011 discontinuation notice. Exact MPN, device resources, exact package, package-specific I/O/transceivers, speed interpretation and junction-temperature grade have official evidence. Current supply, voltage, application clock and power are not characterized.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Conditional temperature operation
Not confirmed
unconfirmedConditions
Not verified in this bounded review.
Minimum core voltage
Not confirmed
unconfirmedConditions
Not verified in this bounded review.
Nominal core voltage
Not confirmed
unconfirmedConditions
Not verified in this bounded review.
Maximum core voltage
Not confirmed
unconfirmedConditions
Not verified in this bounded review.
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
unconfirmedConditions
This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.
Available stock
Not confirmed
unconfirmedConditions
No inventory, stock, price or lead-time evidence was reviewed.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Full ordering-number evidence: XCN20011 v1.0, p. 3, Table 5, right block, data row 2, Part Number column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Validate the FFV900 -2 implementation independently of the FBV900 option
This industrial -2 choice changes package code and timing bin relative to the public FBV900 -1 row. Use the comparison to identify the matching core density and the differing package/grade conditions, then inspect bank and clock pin details in the official pinout. Keep the exact V-package notice attached to the BOM review.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 52 I/O remain in the count-only budget (89.6% allocated).
Planning diagram: assumed I/O allocation 448 I/O assumed allocation / 500 documented package I/O; 52 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
89.6% of the sourced package count allocated; 52 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 1,048,576 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 16,020 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7K325T-2FFV900I and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7K325T-2FFV900I
Lifecycle / ordering: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.
Package: FFV900.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 289, Figure 4-35, shared FFG900/FFV900 drawing, title · scope: package. Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.
Speed grade: -2.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.
Operating temperature (see basis/conditions): -40 to +100 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 289, Figure 4-35, shared FFG900/FFV900 drawing, D/E dimensions · scope: package. Package body width x length, not die dimensions, height or PCB keep-out.
Package user I/O: 500 I/O.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 18, Table 1-9, XC7K325T row, FFG900/FFV900 shared column · scope: device-package. 350 HR + 150 HP = 500; transceiver channels are separate.
Package dedicated channels: 16 GTX channels.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 13, Table 1-4, XC7K325T row, FFG900/FFV900 shared column · scope: device-package. Channels bonded out in this exact device/package; a blank or dash is never read as zero.
Logic cells (AMD): 326,080 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 16,020 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K325T-1FBV900I
Package: FFV900 → FBV900. Verify the applicable limits and design impact.
Speed grade: -2 → -1. Verify the applicable limits and design impact.
Lifecycle / ordering: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.
Package: FBV900.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 284, Figure 4-30, shared FBG900/FBV900 drawing, title · scope: package. Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): -40 to +100 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 284, Figure 4-30, shared FBG900/FBV900 drawing, D/E dimensions · scope: package. Package body width x length, not die dimensions, height or PCB keep-out.
Package user I/O: 500 I/O.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 18, Table 1-9, XC7K325T row, FBG900/FBV900 shared column · scope: device-package. 350 HR + 150 HP = 500; transceiver channels are separate.
Package dedicated channels: 16 GTX channels.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 13, Table 1-4, XC7K325T row, FBG900/FBV900 shared column · scope: device-package. Channels bonded out in this exact device/package; a blank or dash is never read as zero.
Logic cells (AMD): 326,080 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 16,020 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K325T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K410T-1FFG900C
Package: FFV900 → FFG900. Verify the applicable limits and design impact.
Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -2 → -1. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 289, Figure 4-35, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 500 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 16 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 406,720 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 28,620 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Exact identity evidence:XCN20011 — Product Discontinuation Notice for Selective FFV, FBV and SBV Device Packages · XCN20011 v1.0, p. 3, Table 5, right block, data row 2, Part Number column · Historical manufacturer discontinuation listing (2020-09-28), Part Number column. This V-package MPN is affected by the notice; no present stock or availability is asserted.
Practical questions for this selection
Does matching the industrial grade settle replacement qualification?
It only matches one ordering attribute. Package pinout, electrical limits, timing, configuration and implementation support still need explicit checks, and the affected historical ordering code needs lifecycle review.
What does the numerical example establish for XC7K325T-2FFV900I?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
21 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Package: FFV900 → FBG900. Verify the applicable limits and design impact.
Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -2 → -1. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
