SIDE-BY-SIDE REVIEW

Compare FPGA devices

Review resource differences, package constraints and the fields that still need confirmation.

Select devices (2–4)

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.

Parameter / status	XC7K325T-2FFV900IKintex-7	XC7K160T-1FBG484CKintex-7
Logic cellsDifferent	326080 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.	162240 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.
6-input LUTsDifferent	203800 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K325T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 50950 slices x 4 LUT6 per slice.	101400 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K160T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 25350 slices x 4 LUT6 per slice.
Block RAM capacityDifferent	16020 KbDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.	11700 KbDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.
36 Kb block RAM blocksDifferent	445 blocksDS180 ↗ · devicep. 4, Table 6, XC7K325T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.	325 blocksDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.
DSP slicesDifferent	840 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K325T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.	600 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K160T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.
User I/O in this packageDifferent	500 I/OUG475 ↗ · device-packagep. 18, Table 1-9, XC7K325T row, FFG900/FFV900 shared column Conditions 350 HR + 150 HP = 500; transceiver channels are separate.	285 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG484 columns Conditions Package-specific user I/O. HR + HP; excludes GT serial channels.
Serial transceivers in this packageDifferent resource definitions	16 GTX channelsUG475 ↗ · device-packagep. 13, Table 1-4, XC7K325T row, FFG900/FFV900 shared column Conditions Channels bonded out in this exact device/package; a blank or dash is never read as zero.	4 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG484 columns; GTX column Conditions Number of channels exposed in this selected device/package; not device-family maximum.
Package codeDifferent	FFV900UG475 ↗ · packagep. 289, Figure 4-35, shared FFG900/FFV900 drawing, title Conditions Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.	FBG484UG475 ↗ · packagep. 266, Figure 4-12 title Conditions Exact package token; does not establish any full orderable MPN.
Package ball countDifferent	900 ballsUG475 ↗ · packagep. 289, Figure 4-35, shared FFG900/FFV900 drawing; note 4: actual solder ball count = 900 Conditions note 4: actual solder ball count = 900	484 ballsUG475 ↗ · packagep. 266, Figure 4-12; full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22 Conditions full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22
Package bodyDifferent	31 x 31 mmUG475 ↗ · packagep. 289, Figure 4-35, shared FFG900/FFV900 drawing, D/E dimensions Conditions Package body width x length, not die dimensions, height or PCB keep-out.	23 x 23 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions Conditions Package body width x length; excludes PCB keep-out and component height.
Ball pitchSame	1 mmUG475 ↗ · packagep. 289, Figure 4-35, shared FFG900/FFV900 drawing, e dimension Conditions Ball-to-ball pitch.	1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, e dimension Conditions Ball-to-ball pitch.
Package terminals / leads (vendor count)Unconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Speed gradeDifferent	-2DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend Conditions Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.	-1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend Conditions Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Junction temperature (Tj)Different	-40 to +100 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.	0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature gradeDifferent	Industrial (I)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Core voltage conditionsUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Maximum application clockUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Application powerUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Minimum junction temperatureDifferent	-40 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Maximum junction temperatureDifferent	100 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Temperature referenceSame	TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.	TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Conditional temperature operationUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Minimum core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Nominal core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Maximum core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this bounded review.
Current lifecycleUnconfirmed data	Not confirmed Conditions This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.	Not confirmed Conditions Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement.
Available stockUnconfirmed data	Not confirmed Conditions No inventory, stock, price or lead-time evidence was reviewed.	Not confirmed Conditions No inventory, stock, price or lead-time evidence was reviewed.