Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for XC7K160T-3FBG484E. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
XC7K160T-3FBG484E is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FBG484 package. Its reviewed resources include 162,240 logic cells, 11,700 Kb of block RAM, 285 I/O for this device/package combination. This ordering code specifies speed grade -3 and Extended (E) temperature grade. The selected device/package has 4 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Core device, package and grade fields are linked to official documents. The full MPN is evidenced by a historical manufacturer listing; current lifecycle and availability require confirmation. Voltage, application timing and power are not fully characterized here.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operation
Not confirmed
unconfirmed
Minimum core voltage
Not confirmed
unconfirmed
Nominal core voltage
Not confirmed
unconfirmed
Maximum core voltage
Not confirmed
unconfirmed
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
unconfirmedConditions
Not verified in this review.
Available stock
Not confirmed
unconfirmedConditions
Not verified in this review.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Full ordering-number evidence: XCN20011 v1.0, p. 3, Table 5, left table block, data row 5, Replacement Part column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Isolate the extended -3 grade from package capacity
This extended-grade -3 row retains the FBG484 label of the commercial -1 comparison. Its rationale is therefore a timing and operating-condition requirement; read each current package connection row independently. If more buffering or logic is needed instead, review the larger Kintex row and its separate footprint and channel exposure.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 53 I/O remain in the count-only budget (81.4% allocated).
Planning diagram: assumed I/O allocation 232 I/O assumed allocation / 285 documented package I/O; 53 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
81.4% of the sourced package count allocated; 53 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 524,288 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 11,700 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7K160T-3FBG484E and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7K160T-3FBG484E
Lifecycle / ordering: Not verified in this review.
Speed grade: -3.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -3 in the literal MPN. Datasheet grade is -3. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +100 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 4 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 162,240 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 11,700 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K160T-1FBG484C
Temperature grade: Extended (E) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -3 → -1. Verify the applicable limits and design impact.
Lifecycle / ordering: Current lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Body dimensions: 23 x 23 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 285 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 4 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K160T row, FBG484 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 162,240 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 11,700 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K160T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Sources and conditions: XC7K410T-1FFG900C
Package: FBG484 → FFG900. Verify the applicable limits and design impact.
Temperature grade: Extended (E) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -3 → -1. Verify the applicable limits and design impact.
Lifecycle / ordering: Not verified in this review.
Speed grade: -1.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 16, Figure 2; Speed Grade legend · scope: MPN. Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Operating temperature (see basis/conditions): 0 to +85 °C.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature basis: Tj.Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics · revision 2.19 · p. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row · scope: grade. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 31 x 31 mm.7 Series FPGAs Packaging and Pinout Product Specification · revision 1.20 · p. 11, Table 1-1; p. 289, Figure 4-35, D/E dimensions · scope: package. Package body width x length; excludes PCB keep-out and component height.
Package user I/O: 500 I/O.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns · scope: device-package. Package-specific user I/O. HR + HP; excludes GT serial channels.
Package dedicated channels: 16 GTX.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 7, XC7K410T row, FFG900 columns; GTX column · scope: device-package. Number of channels exposed in this selected device/package; not device-family maximum.
Logic cells (AMD): 406,720 logic cells.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Logic Cells column · scope: device. Vendor metric; not comparable to another architecture's ALMs.
Embedded block memory: 28,620 Kb.7 Series FPGAs Data Sheet: Overview · revision 2.6.1 · p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) column · scope: device. Source unit retained: Kb means kilobits, not kilobytes.
Does changing -1 to -3 increase the number of user I/O?
Speed grade does not create package pins. Use the sourced device/package I/O rows in the comparison; timing and operating conditions need their own validation.
What does the numerical example establish for XC7K160T-3FBG484E?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
107 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Temperature grade: Extended (E) → Commercial (C). Verify the applicable limits and design impact.
Speed grade: -3 → -1. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
