Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for XC7S15-1FTGB196C. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
XC7S15-1FTGB196C is an FPGA in the AMD / Xilinx Spartan-7 family, supplied in the FTGB196 package. Its reviewed resources include 12,800 logic cells, 360 Kb of block RAM, 100 I/O for this device/package combination. This ordering code specifies speed grade -1 and Commercial (C) temperature grade. The selected device/package has 0 GTP channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Screen a small controller by connectivity and implementation fit
Use these checks to prepare a design review or a sourcing request for XC7S15-1FTGB196C. The evidence rows describe the device; the actions are engineering guidance, not completed validation.
Test the interface type before the logic estimate
User I/O in this package
100 I/O
Serial transceivers in this package
0 GTP
Check: A small parallel controller should start with a signal inventory. A requirement for a dedicated high-speed transceiver must be checked against this exact package's channel row, not against a different 7-series family.
Prepare: A list of parallel, clock, configuration and serial interface requirements with no assumed dedicated lanes.
Evidence and conditions
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. No GTP channels exposed in this selected device/package combination.
Map the controller and buffers to actual resources
Logic cells
12,800 logic cells
Block RAM capacity
360 Kb
Check: Synthesize the state machines, bus bridges and buffering for the selected device. Budget memory width/depth and ports, rather than converting logic-cell count into a promise of system complexity.
Prepare: A utilization report and a buffer allocation showing block geometry and required overhead.
Evidence and conditions
DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. Vendor logic-cell metric; not equivalent to another architecture's ALM count.
DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. AMD source unit retained: Kb is kilobits, not kilobytes.
Review the FTGB196 assembly and temperature limits
Package code
FTGB196
Ball pitch
1 mm
Junction temperature (Tj)
0 to +85 °C
Temperature reference
Tj
Check: Check the official ball map and package drawing, configuration connections and bank supplies. Evaluate the commercial temperature range using its documented basis and the board's thermal conditions.
Prepare: An exact-package schematic review and an assembly brief for the intended board revision.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature.
XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Before accepting a quotation
Keep FTGB196C and speed grade -1 visible on the request; do not shorten the order to Spartan-7 15K.
Confirm available quantity, price breaks, shipping date and what source/lot evidence accompanies the offer.
For a combined PCBA request, specify who supplies the programming image, what programming records are needed and the agreed board test scope.
Availability, price, shipment date and evidence deliverables require confirmation for the actual offer. No supplier stock or replacement qualification is established by this page.
Choose the sourcing or redesign route
Small controller fits: source the exact approved part and retain the implementation and programming records.
Resources do not fit: compare a larger device using synthesis results, then review its package connections.
Interface type does not fit: consider a device with the required dedicated interface or an external interface architecture; assess the board change.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operation
Not confirmed
unconfirmed
Minimum core voltage
Not confirmed
unconfirmed
Nominal core voltage
Not confirmed
unconfirmed
Maximum core voltage
Not confirmed
unconfirmed
Supply & status
Parameter
Value
Scope / evidence
Current lifecycle
Not confirmed
supplyConditions
Confirm the current manufacturer lifecycle at quotation.
Available stock
Not confirmed
supplyConditions
Stock, lot traceability and delivery are confirmed during quotation.
MANUFACTURER REFERENCES
Official documents & PDF datasheets
Use the electrical data sheet together with the device overview and package/pinout information.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Budget a small parallel controller before moving up within 7 series
Use this FTGB196 commercial part as a starting point for a modest parallel controller or FIFO design. Its native resource and package I/O limits should be checked together. The public Artix-7 row below is a cross-subfamily 7-series screening comparison for growth; it changes device resources, package and footprint, so it requires a new design review.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 36 I/O remain in the count-only budget (64% allocated).
Planning diagram: assumed I/O allocation 64 I/O assumed allocation / 100 documented package I/O; 36 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
64% of the sourced package count allocated; 36 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 16,384 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 360 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
XC7S15-1FTGB196C and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: XC7S15-1FTGB196C
Lifecycle / ordering: Confirm the current manufacturer lifecycle at quotation.
Speed grade: -1.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: MPN. Speed grade is not a single guaranteed application clock frequency.
Operating temperature (see basis/conditions): 0 to +85 °C.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature.
Temperature basis: Tj.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 15 × 15 mm.UG475 — Packaging and Pinout · Package overview and device/package combinations · scope: package.
Package user I/O: 100 I/O.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
Package dedicated channels: 0 GTP.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. No GTP channels exposed in this selected device/package combination.
Logic cells (AMD): 12,800 logic cells.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. Vendor logic-cell metric; not equivalent to another architecture's ALM count.
Embedded block memory: 360 Kb.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. AMD source unit retained: Kb is kilobits, not kilobytes.
Sources and conditions: XC7A100T-1CSG324C
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Package: FTGB196 → CSG324. Verify the applicable limits and design impact.
Lifecycle / ordering: Confirm the current manufacturer lifecycle at quotation.
Speed grade: -1.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: MPN. Speed grade is not a single guaranteed application clock frequency.
Operating temperature (see basis/conditions): 0 to +85 °C.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature.
Temperature basis: Tj.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: grade. Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Body dimensions: 15 × 15 mm.UG475 — Packaging and Pinout · Package overview and device/package combinations · scope: package.
Package user I/O: 210 I/O.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. Value belongs to this device/package combination.
Package dedicated channels: 0 GTP.XMP101 — 7 Series Product Selection Guide · Spartan-7 and Artix-7 device/package tables; ordering information · scope: package. No GTP channels exposed in this selected device/package combination.
Logic cells (AMD): 101,440 logic cells.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. Vendor logic-cell metric; not equivalent to another architecture's ALM count.
Embedded block memory: 4,860 Kb.DS180 — 7 Series FPGAs Overview · Device resource tables; Spartan-7 and Artix-7 · scope: device. AMD source unit retained: Kb is kilobits, not kilobytes.
Practical questions for this selection
Would moving to the Artix-7 comparison preserve this board?
No compatibility is established. This comparison spans Spartan-7 and Artix-7 within 7 series. Review HDL/IP support, package pinout, bank voltages, configuration, footprint and timing before considering a redesign.
What does the numerical example establish for XC7S15-1FTGB196C?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
403 full MPNs meet the entered numeric constraints. Showing 6 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Package: FTGB196 → FBG484. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
