SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | XC7S15-1FTGB196CSpartan-7 | XC7A100T-1CSG324CArtix-7 |
|---|---|---|
| Logic cellsDifferent | 12800 logic cellsDS180 ↗ · deviceConditionsVendor logic-cell metric; not equivalent to another architecture's ALM count. | 101440 logic cellsDS180 ↗ · deviceConditionsVendor logic-cell metric; not equivalent to another architecture's ALM count. |
| 6-input LUTsDifferent | 8000 LUT6DS180 ↗ · derivedConditions2,000 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture. | 63400 LUT6DS180 ↗ · derivedConditions15,850 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture. |
| Block RAM capacityDifferent | 360 KbDS180 ↗ · deviceConditionsAMD source unit retained: Kb is kilobits, not kilobytes. | 4860 KbDS180 ↗ · deviceConditionsAMD source unit retained: Kb is kilobits, not kilobytes. |
| 36 Kb block RAM blocksDifferent | 10 blocksDS180 ↗ · deviceConditionsEach block is nominally 36 Kb. | 135 blocksDS180 ↗ · deviceConditionsEach block is nominally 36 Kb. |
| DSP slicesDifferent | 20 DSP48E1DS180 ↗ · deviceConditionsCompare with the same DSP architecture; slice counts across vendors are not equivalent. | 240 DSP48E1DS180 ↗ · deviceConditionsCompare with the same DSP architecture; slice counts across vendors are not equivalent. |
| User I/O in this packageDifferent | 100 I/OXMP101 ↗ · packageConditionsValue belongs to this device/package combination. | 210 I/OXMP101 ↗ · packageConditionsValue belongs to this device/package combination. |
| Serial transceivers in this packageSame | 0 GTPXMP101 ↗ · packageConditionsNo GTP channels exposed in this selected device/package combination. | 0 GTPXMP101 ↗ · packageConditionsNo GTP channels exposed in this selected device/package combination. |
| Package codeDifferent | FTGB196XMP101 ↗ · MPN | CSG324XMP101 ↗ · MPN |
| Package ball countDifferent | 196 ballsUG475 ↗ · package | 324 ballsUG475 ↗ · package |
| Package bodySame | 15 × 15 mmUG475 ↗ · package | 15 × 15 mmUG475 ↗ · package |
| Ball pitchDifferent | 1 mmUG475 ↗ · package | 0.8 mmUG475 ↗ · package |
| Package terminals / leads (vendor count)Unconfirmed data | Not confirmed | Not confirmed |
| Speed gradeSame | -1XMP101 ↗ · MPNConditionsSpeed grade is not a single guaranteed application clock frequency. | -1XMP101 ↗ · MPNConditionsSpeed grade is not a single guaranteed application clock frequency. |
| Junction temperature (Tj)Same | 0 to +85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. | 0 to +85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. |
| Temperature gradeSame | Commercial (C)XMP101 ↗ · MPN | Commercial (C)XMP101 ↗ · MPN |
| Core voltage conditionsUnconfirmed data | Not confirmedConditionsConsult the family DC/AC data sheet for the applicable operating conditions. | Not confirmedConditionsConsult the family DC/AC data sheet for the applicable operating conditions. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsDepends on the implemented design, timing constraints and speed grade. | Not confirmedConditionsDepends on the implemented design, timing constraints and speed grade. |
| Application powerUnconfirmed data | Not confirmedConditionsRequires design-specific power estimation and thermal analysis. | Not confirmedConditionsRequires design-specific power estimation and thermal analysis. |
| Minimum junction temperatureSame | 0 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | 0 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Maximum junction temperatureSame | 85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | 85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Temperature referenceSame | TjXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | TjXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Conditional temperature operationUnconfirmed data | Not confirmed | Not confirmed |
| Minimum core voltageUnconfirmed data | Not confirmed | Not confirmed |
| Nominal core voltageUnconfirmed data | Not confirmed | Not confirmed |
| Maximum core voltageUnconfirmed data | Not confirmed | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsConfirm the current manufacturer lifecycle at quotation. | Not confirmedConditionsConfirm the current manufacturer lifecycle at quotation. |
| Available stockUnconfirmed data | Not confirmedConditionsStock, lot traceability and delivery are confirmed during quotation. | Not confirmedConditionsStock, lot traceability and delivery are confirmed during quotation. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.