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Microchip Technology / Chips & IP

Radiation-tolerant FPGAs

Specialist families require part-specific radiation, packaging and qualification review.

Product lines are representative. Stock, lifecycle, package and grade must be checked against the exact MPN.

Radiation-tolerant FPGAs — technical product-family map
Technical schematicFPGA.io technical schematic for Radiation-tolerant FPGAs. Product branches are shown as a navigation overview. This is an abstract diagram, not a product photograph, package drawing or pinout. Technical reference ↗
Product scopeChips & IP
Device references in this category8
Documented ordering codes136
Information checked2026-09-28

FROM FAMILY TO DEVICE

Chip models in Radiation-tolerant FPGAs

Documented device references

Base-device names are distinct from full ordering numbers. Each detail page identifies the product type, parameter scope and official source.

BASE DEVICE

RTPFS160ZT

Radiation-tolerant PolarFire SoC base device.

Logic elements
161 K LE
Total RAM
11.3 Mbits
18x18 MACC math blocks
498 blocks
0 ordering codesExact ordering-code evidence is still being collected.
Specifications & documents →

BASE DEVICE

RTPFS460ZT

Radiation-tolerant PolarFire SoC base device.

Logic elements
461 K LE
Total RAM
31.6 Mbits
18x18 MACC math blocks
1420 blocks
0 ordering codesExact ordering-code evidence is still being collected.
Specifications & documents →

8 device references

WITHIN THIS PRODUCT LINE

Series & subcategories

Radiation-tolerant FPGAs

RT PolarFire

Radiation-tolerant PolarFire family for space processing and high-speed connectivity; qualification is device and package specific.

1 device refs · 8 ordering codesExplore RT PolarFire →
Radiation-tolerant FPGAs

RTG4

Flash-based space FPGA family with hardened registers, protected memory and serial interfaces.

1 device refs · 36 ordering codesExplore RTG4 →

SELECTION CONTEXT

Working with Radiation-tolerant FPGAs

Define the required function

Specialist families require part-specific radiation, packaging and qualification review.

Use the requirements below to decide which specification limits your design. A family name alone is not a purchasing specification.

Check the integration boundary

Choose the complete device and ordering code before checking package pinout, power, electrical limits and operating grade. Keep family maxima separate from a selected device or package.

Open the manufacturer reference ↗

ENGINEERING DECISIONS

What to confirm before selection

Use these checks to define the requirement. Family names alone do not establish performance, package compatibility or current availability.

  1. Use the vendor-native logic, memory and DSP definitions; unlike resource units are not directly equivalent.
  2. Confirm package pinout, I/O bank voltages, configuration method and the supported tool release before layout.
  3. Review power sequencing, decoupling, BGA escape routing and programming access with the complete ordering number.
  4. Check the core, flash/RAM, peripherals, pin multiplexing and safety/security requirements together.
  5. Confirm debugger, IDE/compiler version, bootloader and in-circuit programming access for production.

Move from family to full ordering number

Identify the complete manufacturer part number, package, operating grade and electrical requirements. Reviewed FPGA specifications can then be compared at device level.

Send the exact project requirement →

Preparing a complete board?

Bring the BOM, schematic constraints, stack-up and assembly requirements into the project brief.

PCBA project preparation →

EVIDENCE & DEVELOPMENT

Documents for this product line

Start with the device table, then check electrical limits, ordering information and the applicable tool release.

More Microchip Technology development resources

These broader manufacturer resources do not establish support or compatibility for every device on this page.

PRACTICAL QUESTIONS

Radiation-tolerant FPGAs selection questions

How do I select a model within Radiation-tolerant FPGAs?

Start with the documented product scope: Specialist families require part-specific radiation, packaging and qualification review. Then compare the device-specific facts below with your required resources and interfaces. Open each model for its evidence and ordering constraints.

Is a base-device name enough to place an order?

A base-device identifier identifies the silicon or model, but may omit package, speed, temperature, qualification and packing options. Use the manufacturer ordering table to establish the complete code. Reference examples do not establish stock or an approved replacement.

Can the listed devices use the same PCB or development tools?

A shared family or manufacturer does not establish pin compatibility. Compare pinout, supply and I/O-bank voltages, configuration, timing, tool support and thermal limits before changing a board.

What should I include for sourcing or PCBA review?

Provide the exact part or board revision, quantity, delivery requirement, operating environment and traceability needs. For assembly, identify BOM readiness, PCB stack-up, programming access and the inspection or functional-test scope.

PREPARE A USEFUL INQUIRY

Build your selection brief.

Select the points you want our team to review. Your selections stay in this browser until you choose to submit the quotation form.

Open quotation form →

Sources & portfolio context

Microchip Technology Radiation-tolerant FPGAs reference ↗

Source review: 2026-09-28. This family guide does not assert stock or compatibility between devices.

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