AMD / Xilinx / Kintex-7
FBV676 · Extended (E) · Speed grade -3
FPGA.io Part Number FIO-BDD87BC142EAB75CInternal catalogue reference · manufacturer MPN remains unchanged
Lifecycle & ordering review: This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source. Evidence and conditions ↓
Core fields reviewed 2026-09-28
Source links and conditions accompany each parameter.
SOURCING REFERENCES
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PRODUCT OVERVIEW
XC7K410T-3FBV676E is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FBV676 package. Its reviewed resources include 406,720 logic cells, 28,620 Kb of block RAM, 400 I/O for this device/package combination. This ordering code specifies speed grade -3 and Extended (E) temperature grade. The selected device/package has 8 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Historical V-package product affected by the 2020 XCN20011 discontinuation notice. Exact MPN, device resources, exact package, package-specific I/O/transceivers, speed interpretation and junction-temperature grade have official evidence. Current supply, voltage, application clock and power are not characterized.
| Parameter | Value | Scope / evidence |
|---|---|---|
| Logic cells | 406720 logic cells | deviceDS180 ↗p. 4, Table 6, XC7K410T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. |
| 6-input LUTs | 254200 LUT6 | derivedDS180 ↗p. 4, Table 6, XC7K410T row; note 1; p. 7 CLBs, Slices, and LUTsConditions63550 slices x 4 LUT6 per slice. |
| Block RAM capacity | 28620 Kb | deviceDS180 ↗p. 4, Table 6, XC7K410T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. |
| 36 Kb block RAM blocks | 795 blocks | deviceDS180 ↗p. 4, Table 6, XC7K410T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. |
| DSP slices | 1540 DSP48E1 | deviceDS180 ↗p. 4, Table 6, XC7K410T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. |
| Parameter | Value | Scope / evidence |
|---|---|---|
| User I/O in this package | 400 I/O | device-packageUG475 ↗p. 18, Table 1-9, XC7K410T row, FBG676/FBV676 shared columnConditions250 HR + 150 HP = 400; transceiver channels are separate. |
| Serial transceivers in this package | 8 GTX channels | device-packageUG475 ↗p. 13, Table 1-4, XC7K410T row, FBG676/FBV676 shared columnConditionsChannels bonded out in this exact device/package; a blank or dash is never read as zero. |
| Package code | FBV676 | packageUG475 ↗p. 279, Figure 4-25, shared FBG676/FBV676 drawing, titleConditionsExact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package. |
| Package ball count | 676 balls | packageUG475 ↗p. 279, Figure 4-25, shared FBG676/FBV676 drawing; full 26 x 26 bottom-view matrixConditionsfull 26 x 26 bottom-view matrix |
| Package body | 27 x 27 mm | packageUG475 ↗p. 279, Figure 4-25, shared FBG676/FBV676 drawing, D/E dimensionsConditionsPackage body width x length, not die dimensions, height or PCB keep-out. |
| Ball pitch | 1 mm | packageUG475 ↗p. 279, Figure 4-25, shared FBG676/FBV676 drawing, e dimensionConditionsBall-to-ball pitch. |
| Package terminals / leads (vendor count) | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Parameter | Value | Scope / evidence |
|---|---|---|
| Speed grade | -3 | MPNDS180 ↗p. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -3 in the literal MPN. Datasheet grade is -3. This is not a single application clock limit. |
| Junction temperature (Tj) | 0 to +100 °C | gradeDS182 ↗p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Temperature grade | Extended (E) | gradeDS182 ↗p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row |
| Core voltage conditions | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Maximum application clock | Not confirmed | unconfirmedConditionsDepends on the application, implementation and operating conditions. |
| Application power | Not confirmed | unconfirmedConditionsDepends on the application, implementation and operating conditions. |
| Minimum junction temperature | 0 °C | gradeDS182 ↗p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row |
| Maximum junction temperature | 100 °C | gradeDS182 ↗p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row |
| Temperature reference | Tj | gradeDS182 ↗p. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Conditional temperature operation | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Minimum core voltage | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Nominal core voltage | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Maximum core voltage | Not confirmed | unconfirmedConditionsNot verified in this bounded review. |
| Parameter | Value | Scope / evidence |
|---|---|---|
| Current lifecycle | Not confirmed | unconfirmedConditionsThis exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source. |
| Available stock | Not confirmed | unconfirmedConditionsNo inventory, stock, price or lead-time evidence was reviewed. |
MANUFACTURER REFERENCES
Use the electrical data sheet together with the device overview and package/pinout information.
Primary data sheetDS182 — Kintex-7 DC and AC Switching CharacteristicsElectrical operating conditions and speed-grade timing tables; select the applicable grade. · Rev 2.19 · 2021-03-26Official PDF ↗Data sheet / device reference7 Series FPGAs Data Sheet: Overviewpp. 2-4, Tables 2-7; p. 7 CLBs, Slices, and LUTs; p. 16 Figures 1-2 · Rev 2.6.1 · 2020-09-08Official manufacturer documentation ↗Data sheet / device referenceKintex-7 FPGAs Data Sheet: DC and AC Switching Characteristicsp. 3, Table 2, Temperature; p. 1 introduction; p. 41 Table 35 DSP48E1 · Rev 2.19 · 2021-03-26Official manufacturer documentation ↗Package & pinout7 Series FPGAs Packaging and Pinout Product Specificationpp. 10-18 package/transceiver/I/O tables; pp. 255-291 mechanical drawings · Rev 1.20 · 2024-03-13Official manufacturer documentation ↗Package & pinoutXCN20011 — Product Discontinuation Notice for Selective FFV, FBV and SBV Device PackagesTables 1–6, pp. 1–5; both Part Number and Replacement Part columns · Rev v1.0 · 2020-09-28Official manufacturer PDF ↗Full ordering-number evidence: XCN20011 v1.0, p. 3, Table 5, right block, data row 12, Part Number column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
ENGINEERING SELECTION
Use the documented resources of XC7K410T-3FBV676E to frame a design review. The guidance below interprets the source data; it does not establish achieved system performance.
406,720 logic cells
Use this native resource count for an initial budget. LUT, logic-cell and logic-element definitions differ; synthesize your HDL in the target toolchain to establish fit and timing.
Manufacturer evidence ↗ Conditions ↓28,620 Kb
Budget sample buffers, FIFOs and coefficient storage in bits, then check memory block geometry, port widths, clocking and reserved capacity. External memory needs a separate interface review.
Manufacturer evidence ↗ Conditions ↓1,540 DSP48E1
Map the required multiply/accumulate operations, operand widths and pipeline stages to the documented DSP architecture. A resource count does not establish throughput.
Manufacturer evidence ↗ Conditions ↓400 I/O
This count applies to the selected device/package. Budget required signals and spare capacity, then check bank voltages, differential pairs, dedicated pins and configuration use in the pinout guide.
Manufacturer evidence ↗ Conditions ↓8 GTX channels
Channel count is only a starting point. Confirm lane availability, reference clocks, electrical limits, line rate, protocol IP and licensing for the exact device/package and speed grade.
Manufacturer evidence ↗ Conditions ↓FBV676
Check the official footprint, pin/ball map, pitch, escape routing, power/ground distribution and assembly constraints. Package name or ball count alone does not prove pin compatibility.
Manufacturer evidence ↗ Conditions ↓0 to +100 °C
Check whether this range is specified at junction or ambient, together with the source conditions. Estimate power and cooling for your design before selecting the temperature grade.
Manufacturer evidence ↗ Conditions ↓These are engineering evaluation directions based on documented resources, not verified reference designs or application certifications.
Evaluate state machines, parallel interfaces and I/O expansion against the documented I/O budget, bank standards and timing. Select external level shifting or interface devices where required.
Build a resource budget →Evaluate filters, sample buffering and pipelined arithmetic using the documented DSP and block RAM resources. Validate precision, memory bandwidth, clock closure and application power in the actual implementation.
Build a resource budget →Evaluate a lane and clock budget using the documented channels. Protocol support, achievable line rate and IP availability must be confirmed separately; channel count alone does not qualify an interface.
Build a resource budget →Achievable clock frequency, power consumption and interface performance depend on the implemented design, operating conditions and timing closure. Use the applicable electrical data sheet and vendor analysis tools.
FROM SELECTION TO A BOARD
ENGINEERING SHORTLIST
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
30 full MPNs meet the entered numeric constraints. Showing 2 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
AMD / Xilinx
406720 logic cells · FBG676 · Commercial (C)
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
AMD / Xilinx
416960 logic cells · FFG1156 · Commercial (C)
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
Request a board and sourcing review →DEVICE & PROCUREMENT QUESTIONS
XC7K410T-3FBV676E is an FPGA in the AMD / Xilinx Kintex-7 family, supplied in the FBV676 package. Its reviewed resources include 406,720 logic cells, 28,620 Kb of block RAM, 400 I/O for this device/package combination. This ordering code specifies speed grade -3 and Extended (E) temperature grade. The selected device/package has 8 GTX channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
The reviewed package is FBV676 and the temperature grade is Extended (E). The documented operating range is 0 to +100 °C. Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Match the complete suffix when preparing a BOM.
Use the manufacturer-hosted PDF and documentation links in Official documents on this page. The electrical data sheet, resource overview and package/pinout guide serve different purposes; check the relevant revision and tables together.
FPGA.io confirms price, available quantity, lot requirements and lead time through a quotation. Supplier references are separate from FPGA.io stock. Send your required quantity and delivery date; an optional target unit price helps us assess a price-review request. A lower price is not guaranteed.
A similar resource count does not establish compatibility. Compare package pinout, I/O-bank voltages, configuration, timing, temperature grade and tool support. The candidate screen is a starting point for engineering review, not replacement approval.
Yes, you can request chip sourcing with PCBA project review. Include the board revision, quantity, BOM readiness, programming and inspection/test requirements. The manufacturing scope and delivery are confirmed for the specific project.
CONTINUE YOUR SELECTION
Review other documented choices in this family. Package, grade and pinout may differ; these are comparison candidates, not approved replacements.
285 I/O · 11,700 Kb
Compare these parts →400 I/O · 16,020 Kb
Compare these parts →300 I/O · 25,740 Kb
Compare these parts →ENGINEERING RESOURCES
Prepare the exact-device evidence, I/O assumptions and manufacturing scope before committing to a board.
