FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems

Lattice Semiconductor / ECP5

LFE5U-12F-7TG144I

TG144 · Industrial (I) · Speed grade -7

FPGA.io Part Number FIO-8077D983936B6B01Internal catalogue reference · manufacturer MPN remains unchanged

Lifecycle & ordering review: No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement. Evidence and conditions ↓

Core fields reviewed 2026-09-27
Source links and conditions accompany each parameter.

LFE5U-12F-7TG144I — technical feature overview
Technical schematicFPGA.io technical schematic for LFE5U-12F-7TG144I. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
Lattice LUT4s (nominal)
12000 LUT4 (nominal)
Block RAM capacity
576 Kb
Lattice 18 × 18 multipliers
28 18 x 18 multipliers
User I/O in this package
98 I/O

SOURCING REFERENCES

Price & delivery references

Get Price & Lead Time ↗

No verified supplier stock or price is currently displayed here. Request a quotation for your quantity and required delivery date.

Check this exact MPN at external distributors

Search links do not establish stock, price or an authorized distribution relationship. Check the full code, package and grade at the source.

PRODUCT OVERVIEW

About LFE5U-12F-7TG144I

LFE5U-12F-7TG144I is an FPGA in the Lattice Semiconductor ECP5 family, supplied in the TG144 package. Its reviewed resources include 12,000 LUT4 (nominal), 576 Kb of block RAM, 98 I/O for this device/package combination. This ordering code specifies speed grade -7 and Industrial (I) temperature grade. The selected device/package has 0 SerDes channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.

  • Lattice LUT4s (nominal)12,000 LUT4 (nominal)
  • Block RAM capacity576 Kb
  • Lattice 18 × 18 multipliers28 18 x 18 multipliers
  • User I/O in this package98 I/O
  • Package codeTG144
  • Junction temperature (Tj)-40 to +100 °C
Review parameter sources and conditions ↓

Technical specifications

Core device/package/grade facts checked against official sources. Native resources are not cross-vendor equivalents. Detailed timing, design power and current supply status require project review.

Logic & memory

ParameterValueScope / evidence
Logic cellsNot confirmedunconfirmed
Conditions

No architecture-neutral logic-cell count is established. The vendor's nominal LUT4 quantity is retained with its precision and source in lut4_nominal, not converted into AMD logic cells.

6-input LUTsNot confirmedunconfirmed
Conditions

ECP5 uses LUT4 primitives. Wider logic functions can combine LUT4s, but that is not a source-defined native LUT6 count.

Block RAM capacity576 KbdeviceLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, Embedded Memory (kb) row
Conditions

Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.

36 Kb block RAM blocksNot confirmedunconfirmed
Conditions

The generic field means 36 Kb blocks. ECP5 sysMEM EBR blocks are 18 Kb; sysmem_18kb_blocks retains their physical granularity. No artificial 36 Kb block count is supplied.

DSP slicesNot confirmedunconfirmed
Conditions

The generic application field denotes DSP slices. The directly printed native count is 18 x 18 multipliers, retained in embedded_18x18_multipliers; separately derived sysDSP slice/block counts retain their own native definitions.

Native architecture resources

ParameterValueScope / evidence
Lattice LUT4s (nominal)12000 LUT4 (nominal)derivedLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1
Conditions

Manufacturer reports 12 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 12F as the count.

Lattice 18 × 18 multipliers28 18 x 18 multipliersdeviceLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7
Conditions

Directly printed multiplier count. One sysDSP slice supports two 18 x 18 multipliers (or four 9 x 9); one physical sysDSP block contains two slices (TN-02205-1.3 p. 6). This number is not a DSP-slice/block count and is not equivalent to AMD DSP48E1.

Lattice 18 Kb sysMEM blocks32 18 Kb sysMEM EBR blocksdeviceLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, sysMEM Blocks (18 kb) row
Conditions

Native block granularity; keep separate from app's 36 Kb block field.

Lattice sysDSP slices14 sysDSP slicesderivedLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7
Conditions

Derived as multiplier count / 2. A slice has two 18 x 18 multipliers; this is distinct from logic/PFU slices.

Lattice sysDSP blocks7 sysDSP blocksderivedLATTICE_ECP5_DSP_TN_02205_1_3 ↗p. 6, section 2 and Figure 2.1; count input from DS-02012-3.4 p. 12 Table 1.1
Conditions

Derived as DS-02012 multiplier count / 4: two 18-bit multipliers per slice, two slices per block. A DSP block is not a DSP slice.

Lattice distributed RAM97 KbdeviceLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, Distributed RAM Bits (kb) row
Conditions

Separate from EBR capacity; do not add to bram without changing that field's definition.

Package & interfaces

ParameterValueScope / evidence
User I/O in this package98 I/Odevice-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 98, section 4.3.2 LFE5U, LFE5U-12 / 144 TQFP column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13
Conditions

Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.

Serial transceivers in this package0 SerDes channelsdevice-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 column / 144 TQFP package row
Conditions

The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.

Package codeTG144MPN-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 99 section 5.1 package legend; p. 102, section 5.2.2 Industrial, table data row 2 on this page, Part number column
Conditions

TG144 is explicitly defined as 144-pin lead-free TQFP. The full MPN is independently established by the literal ordering row.

Package ball countNot applicablenot-applicableLATTICE_ECP5_DS_02012_3_4 ↗p. 99 section 5.1 TG144 legend; p. 102, section 5.2.2 Industrial, table data row 2 on this page, Part number column
Conditions

TG144 is a leaded TQFP with 144 pins, not a BGA. Its lead count is package_pins; the generic Total Balls heading in the pin-summary table is not evidence that TQFP leads are balls.

Package bodyNot confirmedunconfirmed
Conditions

The TG144 mechanical package drawing has not been reviewed in this enrichment. Leave body dimensions unknown even though a family selection table includes a nominal package size.

Ball pitchNot confirmedunconfirmed
Conditions

The TG144 mechanical package drawing has not been reviewed in this enrichment; no mechanically verified pitch is supplied.

Package terminals / leads (vendor count)144 pinsMPN-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 99 section 5.1, TG144 = 144-pin TQFP; p. 102, section 5.2.2 Industrial, table data row 2 on this page, Pins and Package columns
Conditions

Explicit 144-pin TQFP definition and the selected full ordering row both establish actual pin count. This is neither a user-I/O count nor a count inferred from a numeric suffix.

Operating conditions

ParameterValueScope / evidence
Speed grade-7MPNLATTICE_ECP5_DS_02012_3_4 ↗p. 102, section 5.2.2 Industrial, table data row 2 on this page, Grade column; p. 99 section 5.1 Speed legend
Conditions

Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.

Junction temperature (Tj)-40 to +100 °CgradeLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row
Conditions

Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.

Temperature gradeIndustrial (I)MPNLATTICE_ECP5_DS_02012_3_4 ↗p. 102, section 5.2.2 Industrial, table data row 2 on this page, Temp. column; p. 99 section 5.1 Grade legend
Conditions

The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.

Core voltage conditions1.045 to 1.155 Vdevice-familyLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columns
Conditions

Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.

Maximum application clockNot confirmedunconfirmed
Conditions

Application fMAX depends on implementation, path, loading, speed grade and operating conditions. No single application clock is established by the speed grade or PLL limit.

Application powerNot confirmedunconfirmed
Conditions

Application power depends on design activity, resources, I/O, voltage and temperature; not determined from marketing/typical static-current figures.

Minimum junction temperature-40 °CgradeLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row, Min column
Conditions

Recommended operating junction-temperature minimum.

Maximum junction temperature100 °CgradeLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row, Max column
Conditions

Recommended operating junction-temperature maximum.

Temperature referenceTjgradeLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row
Conditions

Tj is explicitly stated by the manufacturer; no ambient range is established.

Conditional temperature operationNot confirmedunconfirmed
Minimum core voltageNot confirmedunconfirmed
Nominal core voltageNot confirmedunconfirmed
Maximum core voltageNot confirmedunconfirmed

Supply & status

ParameterValueScope / evidence
Current lifecycleNot confirmedunconfirmed
Conditions

No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.

Available stockNot confirmedunconfirmed
Conditions

No current stock/inventory evidence was obtained. The official ordering-table entry does not establish availability.

MANUFACTURER REFERENCES

Official documents & PDF datasheets

Use the electrical data sheet together with the device overview and package/pinout information.

Data sheet / device referenceECP5 and ECP5-5G Family Data Sheetpp. 12-13 Table 1.1; p. 16 Table 2.1; p. 29 section 2.9.2; p. 47 Table 2.14; p. 51 Table 3.2; pp. 96-98 section 4.3; p. 99 section 5.1; pp. 100-103 section 5.2 · Rev FPGA-DS-02012-3.4 · 2025-09Official manufacturer PDF ↗Selection & orderingECP5 and ECP5-5G sysDSP User Guidep. 6 section 2, sysDSP Overview and Figure 2.1 · Rev FPGA-TN-02205-1.3 · 2024-09Official manufacturer PDF ↗

Full ordering-number evidence: p. 102, section 5.2.2 Industrial, table data row 2 on this page, Part number column.

Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.

ENGINEERING SELECTION

What these specifications mean for your design

Use the documented resources of LFE5U-12F-7TG144I to frame a design review. The guidance below interprets the source data; it does not establish achieved system performance.

Logic implementation

12,000 LUT4 (nominal)

Use this native resource count for an initial budget. LUT, logic-cell and logic-element definitions differ; synthesize your HDL in the target toolchain to establish fit and timing.

Manufacturer evidence ↗ Conditions ↓

Buffers and local storage

576 Kb

Budget sample buffers, FIFOs and coefficient storage in bits, then check memory block geometry, port widths, clocking and reserved capacity. External memory needs a separate interface review.

Manufacturer evidence ↗ Conditions ↓

Arithmetic and signal processing

28 18 x 18 multipliers

Map the required multiply/accumulate operations, operand widths and pipeline stages to the documented DSP architecture. A resource count does not establish throughput.

Manufacturer evidence ↗ Conditions ↓

Board connections

98 I/O

This count applies to the selected device/package. Budget required signals and spare capacity, then check bank voltages, differential pairs, dedicated pins and configuration use in the pinout guide.

Manufacturer evidence ↗ Conditions ↓

High-speed serial planning

0 SerDes channels

No dedicated serial transceiver channels are documented for this device/package. Do not assume another package’s transceiver capability applies; evaluate a different documented part or a separate interface device.

Manufacturer evidence ↗ Conditions ↓

PCB and assembly planning

TG144

Check the official footprint, pin/ball map, pitch, escape routing, power/ground distribution and assembly constraints. Package name or ball count alone does not prove pin compatibility.

Manufacturer evidence ↗ Conditions ↓

Operating environment

-40 to +100 °C

Check whether this range is specified at junction or ambient, together with the source conditions. Estimate power and cooling for your design before selecting the temperature grade.

Manufacturer evidence ↗ Conditions ↓

Application paths to evaluate

These are engineering evaluation directions based on documented resources, not verified reference designs or application certifications.

Control and interface logic

Evaluate state machines, parallel interfaces and I/O expansion against the documented I/O budget, bank standards and timing. Select external level shifting or interface devices where required.

Build a resource budget →

Buffered signal processing

Evaluate filters, sample buffering and pipelined arithmetic using the documented DSP and block RAM resources. Validate precision, memory bandwidth, clock closure and application power in the actual implementation.

Build a resource budget →

Achievable clock frequency, power consumption and interface performance depend on the implemented design, operating conditions and timing closure. Use the applicable electrical data sheet and vendor analysis tools.

Before placing this part on a board

  1. Use the full ordering number. Check the package pinout, power banks, speed grade and temperature range together.
  2. Complete timing and power analysis. A resource table cannot predict achievable frequency or application power.
  3. Define the manufacturing scope. Share the BGA footprint, stack-up, assembly requirements and test plan with your PCBA request.
Plan assembly for your FPGA board →

FROM SELECTION TO A BOARD

Design resources & implementation options

When to evaluate another implementation

For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.

Explore semiconductor brands and product categories →

ENGINEERING SHORTLIST

Screen candidates for your design

Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.

370 full MPNs meet the entered numeric constraints. Showing 6 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.

12000 LUT4 (nominal) · TG144 · Commercial (C)

Differences and compatibility checks
  • Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -6. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

22320 LE · F17 · A

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: TG144 → F17. Verify the applicable limits and design impact.
  • Temperature grade: Industrial (I) → A. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

24000 LUT4 (nominal) · TG144 · Commercial (C)

Differences and compatibility checks
  • Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -6. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

28848 LE · F19 · A

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: TG144 → F19. Verify the applicable limits and design impact.
  • Temperature grade: Industrial (I) → A. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

101440 logic cells · CSG324 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: TG144 → CSG324. Verify the applicable limits and design impact.
  • Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -1. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

65600 logic cells · FBG484 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: TG144 → FBG484. Verify the applicable limits and design impact.
  • Temperature grade: Industrial (I) → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -1. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

Numeric screening is not replacement approval.

Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.

Request a board and sourcing review →

DEVICE & PROCUREMENT QUESTIONS

LFE5U-12F-7TG144I FAQ

What is LFE5U-12F-7TG144I?

LFE5U-12F-7TG144I is an FPGA in the Lattice Semiconductor ECP5 family, supplied in the TG144 package. Its reviewed resources include 12,000 LUT4 (nominal), 576 Kb of block RAM, 98 I/O for this device/package combination. This ordering code specifies speed grade -7 and Industrial (I) temperature grade. The selected device/package has 0 SerDes channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.

Which package and grade does LFE5U-12F-7TG144I specify?

The reviewed package is TG144 and the temperature grade is Industrial (I). The documented operating range is -40 to +100 °C. Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating. Match the complete suffix when preparing a BOM.

Where can I find the official LFE5U-12F-7TG144I datasheet?

Use the manufacturer-hosted PDF and documentation links in Official documents on this page. The electrical data sheet, resource overview and package/pinout guide serve different purposes; check the relevant revision and tables together.

Is LFE5U-12F-7TG144I in stock, and can I request a better price?

FPGA.io confirms price, available quantity, lot requirements and lead time through a quotation. Supplier references are separate from FPGA.io stock. Send your required quantity and delivery date; an optional target unit price helps us assess a price-review request. A lower price is not guaranteed.

Can another FPGA replace LFE5U-12F-7TG144I?

A similar resource count does not establish compatibility. Compare package pinout, I/O-bank voltages, configuration, timing, temperature grade and tool support. The candidate screen is a starting point for engineering review, not replacement approval.

Can FPGA.io supply LFE5U-12F-7TG144I with PCB assembly?

Yes, you can request chip sourcing with PCBA project review. Include the board revision, quantity, BOM readiness, programming and inspection/test requirements. The manufacturing scope and delivery are confirmed for the specific project.