FPGA.io Part NumberFIO-37F2FB8338038008Internal catalogue reference · manufacturer MPN remains unchanged
Lifecycle & ordering review: No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement. Evidence and conditions ↓
Core fields reviewed 2026-09-27 Source links and conditions accompany each parameter.
Technical schematicFPGA.io technical schematic for LFE5U-12F-6BG256C. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
LFE5U-12F-6BG256C is an FPGA in the Lattice Semiconductor ECP5 family, supplied in the BG256 package. Its reviewed resources include 12,000 LUT4 (nominal), 576 Kb of block RAM, 197 I/O for this device/package combination. This ordering code specifies speed grade -6 and Commercial (C) temperature grade. The selected device/package has 0 SerDes channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.
Core device/package/grade facts checked against official sources. Native resources are not cross-vendor equivalents. Detailed timing, design power and current supply status require project review.
Logic & memory
Parameter
Value
Scope / evidence
Logic cells
Not confirmed
unconfirmedConditions
No architecture-neutral logic-cell count is established. The vendor's nominal LUT4 quantity is retained with its precision and source in lut4_nominal, not converted into AMD logic cells.
6-input LUTs
Not confirmed
unconfirmedConditions
ECP5 uses LUT4 primitives. Wider logic functions can combine LUT4s, but that is not a source-defined native LUT6 count.
Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.
36 Kb block RAM blocks
Not confirmed
unconfirmedConditions
The generic field means 36 Kb blocks. ECP5 sysMEM EBR blocks are 18 Kb; sysmem_18kb_blocks retains their physical granularity. No artificial 36 Kb block count is supplied.
DSP slices
Not confirmed
unconfirmedConditions
The generic application field denotes DSP slices. The directly printed native count is 18 x 18 multipliers, retained in embedded_18x18_multipliers; separately derived sysDSP slice/block counts retain their own native definitions.
Native architecture resources
Parameter
Value
Scope / evidence
Lattice LUT4s (nominal)
12000 LUT4 (nominal)
derivedLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1Conditions
Manufacturer reports 12 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 12F as the count.
Lattice 18 × 18 multipliers
28 18 x 18 multipliers
deviceLATTICE_ECP5_DS_02012_3_4 ↗p. 12, Table 1.1, LFE5U-12 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7Conditions
Directly printed multiplier count. One sysDSP slice supports two 18 x 18 multipliers (or four 9 x 9); one physical sysDSP block contains two slices (TN-02205-1.3 p. 6). This number is not a DSP-slice/block count and is not equivalent to AMD DSP48E1.
The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.
Package code
BG256
MPN-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 99 section 5.1 package legend; p. 100, section 5.2.1 Commercial, table data row 4 on this page, Part number columnConditions
BG256 is explicitly defined as 256-ball lead-free caBGA. The full MPN is independently established by the literal ordering row.
Package ball count
256 balls
device-packageLATTICE_ECP5_DS_02012_3_4 ↗p. 98, section 4.3.2 LFE5U, LFE5U-12 / 256 caBGA column, Total Balls row; p. 100, section 5.2.1 Commercial, table data row 4 on this page, Pins and Package columnsConditions
Actual ball count explicitly printed in the pin-summary table and selected literal ordering row, independently checked against the package-drawing title; not inferred from suffix digits.
Nominal ball-to-ball pitch (BSC). Depopulated ball arrays still have this underlying pitch.
Package terminals / leads (vendor count)
Not confirmed
unconfirmed
Operating conditions
Parameter
Value
Scope / evidence
Speed grade
-6
MPNLATTICE_ECP5_DS_02012_3_4 ↗p. 100, section 5.2.1 Commercial, table data row 4 on this page, Grade column; p. 99 section 5.1 Speed legendConditions
Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.
Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.
Temperature grade
Commercial (C)
MPNLATTICE_ECP5_DS_02012_3_4 ↗p. 100, section 5.2.1 Commercial, table data row 4 on this page, Temp. column; p. 99 section 5.1 Grade legendConditions
The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.
Core voltage conditions
1.045 to 1.155 V
device-familyLATTICE_ECP5_DS_02012_3_4 ↗p. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columnsConditions
Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.
Maximum application clock
Not confirmed
unconfirmedConditions
Application fMAX depends on implementation, path, loading, speed grade and operating conditions. No single application clock is established by the speed grade or PLL limit.
Application power
Not confirmed
unconfirmedConditions
Application power depends on design activity, resources, I/O, voltage and temperature; not determined from marketing/typical static-current figures.
Full ordering-number evidence: p. 100, section 5.2.1 Commercial, table data row 4 on this page, Part number column.
Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.
DEVICE & PACKAGE DECISION
Check BG256 parallel connectivity before choosing a denser compact ECP5
This commercial BG256 option is a candidate for a modest native LUT4 design with parallel connections. The denser MG285 comparison illustrates why density alone does not predict I/O exposure or routing pitch. Use each exact package's sourced dedicated-channel value before planning serial links.
Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.
Result: 37 I/O remain in the count-only budget (81.2% allocated).
Planning diagram: assumed I/O allocation 160 I/O assumed allocation / 197 documented package I/O; 37 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
81.2% of the sourced package count allocated; 37 I/O unallocated.
Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.
Result: Allocate at least 32,768 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 576 Kb.
Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.
Public device and ordering comparisons
Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.
LFE5U-12F-6BG256C and already-public screening candidates
Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.
Sources and conditions: LFE5U-12F-6BG256C
Lifecycle / ordering: No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.
Package: BG256.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 99 section 5.1 package legend; p. 100, section 5.2.1 Commercial, table data row 4 on this page, Part number column · scope: MPN-package. BG256 is explicitly defined as 256-ball lead-free caBGA. The full MPN is independently established by the literal ordering row.
Speed grade: -6.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 100, section 5.2.1 Commercial, table data row 4 on this page, Grade column; p. 99 section 5.1 Speed legend · scope: MPN. Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.
Grade: Commercial (C).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 100, section 5.2.1 Commercial, table data row 4 on this page, Temp. column; p. 99 section 5.1 Grade legend · scope: MPN. The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.
Operating temperature (see basis/conditions): 0 to +85 °C.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row · scope: grade. Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.
Temperature basis: Tj.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row · scope: grade. Tj is explicitly stated by the manufacturer; no ambient range is established.
Body dimensions: 14 x 14 mm.Package Diagrams · revision FPGA-DS-02053-8.8 · p. 99, section 94, 256-Ball caBGA drawing, D/E dimension · scope: package. Package body width x length, basic dimension (BSC), not PCB footprint/keep-out or height. Cross-checked against DS-02012 Table 1.1.
Pitch: 0.8 mm.Package Diagrams · revision FPGA-DS-02053-8.8 · p. 99, section 94, 256-Ball caBGA drawing, e dimension · scope: package. Nominal ball-to-ball pitch (BSC). Depopulated ball arrays still have this underlying pitch.
Package user I/O: 197 I/O.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 98, section 4.3.2 LFE5U, LFE5U-12 / 256 caBGA column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13 · scope: device-package. Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.
Package dedicated channels: 0 SerDes channels.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-12 column / 256 caBGA package row · scope: device-package. The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.
Nominal LUT4 (Lattice): 12,000 LUT4 (nominal).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-12 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1 · scope: derived. Manufacturer reports 12 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 12F as the count.
Embedded block memory: 576 Kb.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-12 device column, Embedded Memory (kb) row · scope: device. Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.
Core rail reference: 1.045 to 1.155 V.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columns · scope: device-family. Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.
Sources and conditions: LFE5U-25F-6MG285C
Package: BG256 → MG285. Verify the applicable limits and design impact.
Lifecycle / ordering: No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.
Package: MG285.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 99 section 5.1 package legend; p. 100, section 5.2.1 Commercial, table data row 19 on this page, Part number column · scope: MPN-package. MG285 is explicitly defined as 285-ball lead-free csfBGA. The full MPN is independently established by the literal ordering row.
Speed grade: -6.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 100, section 5.2.1 Commercial, table data row 19 on this page, Grade column; p. 99 section 5.1 Speed legend · scope: MPN. Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.
Grade: Commercial (C).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 100, section 5.2.1 Commercial, table data row 19 on this page, Temp. column; p. 99 section 5.1 Grade legend · scope: MPN. The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.
Operating temperature (see basis/conditions): 0 to +85 °C.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row · scope: grade. Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.
Temperature basis: Tj.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row · scope: grade. Tj is explicitly stated by the manufacturer; no ambient range is established.
Body dimensions: 10 x 10 mm.Package Diagrams · revision FPGA-DS-02053-8.8 · p. 112, section 107, 285-Ball csfBGA drawing, D/E dimension · scope: package. Package body width x length, basic dimension (BSC), not PCB footprint/keep-out or height. Cross-checked against DS-02012 Table 1.1.
Pitch: 0.5 mm.Package Diagrams · revision FPGA-DS-02053-8.8 · p. 112, section 107, 285-Ball csfBGA drawing, e dimension · scope: package. Nominal ball-to-ball pitch (BSC). Depopulated ball arrays still have this underlying pitch.
Package user I/O: 118 I/O.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 98, section 4.3.2 LFE5U, LFE5U-25 / 285 csfBGA column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13 · scope: device-package. Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.
Package dedicated channels: 0 SerDes channels.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-25 column / 285 csfBGA package row · scope: device-package. The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.
Nominal LUT4 (Lattice): 24,000 LUT4 (nominal).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-25 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1 · scope: derived. Manufacturer reports 24 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 25F as the count.
Embedded block memory: 1,008 Kb.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-25 device column, Embedded Memory (kb) row · scope: device. Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.
Core rail reference: 1.045 to 1.155 V.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columns · scope: device-family. Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.
Sources and conditions: LFE5U-45F-6TG144I
Package: BG256 → TG144. Verify the applicable limits and design impact.
Temperature grade: Commercial (C) → Industrial (I). Verify the applicable limits and design impact.
Lifecycle / ordering: No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.
Package: TG144.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 99 section 5.1 package legend; p. 102, section 5.2.2 Industrial, table data row 25 on this page, Part number column · scope: MPN-package. TG144 is explicitly defined as 144-pin lead-free TQFP. The full MPN is independently established by the literal ordering row.
Speed grade: -6.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 102, section 5.2.2 Industrial, table data row 25 on this page, Grade column; p. 99 section 5.1 Speed legend · scope: MPN. Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.
Grade: Industrial (I).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 102, section 5.2.2 Industrial, table data row 25 on this page, Temp. column; p. 99 section 5.1 Grade legend · scope: MPN. The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.
Operating temperature (see basis/conditions): -40 to +100 °C.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row · scope: grade. Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.
Temperature basis: Tj.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, tJIND Junction Temperature, Industrial Operation row · scope: grade. Tj is explicitly stated by the manufacturer; no ambient range is established.
Package user I/O: 98 I/O.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 98, section 4.3.2 LFE5U, LFE5U-45 / 144 TQFP column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13 · scope: device-package. Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.
Package dedicated channels: 0 SerDes channels.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-45 column / 144 TQFP package row · scope: device-package. The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.
Nominal LUT4 (Lattice): 44,000 LUT4 (nominal).ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-45 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1 · scope: derived. Manufacturer reports 44 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 45F as the count.
Embedded block memory: 1,944 Kb.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 12, Table 1.1, LFE5U-45 device column, Embedded Memory (kb) row · scope: device. Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.
Core rail reference: 1.045 to 1.155 V.ECP5 and ECP5-5G Family Data Sheet · revision FPGA-DS-02012-3.4 · p. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columns · scope: device-family. Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.
Exact identity evidence:ECP5 and ECP5-5G Family Data Sheet · p. 100, section 5.2.1 Commercial, table data row 4 on this page, Part number column · literal manufacturer ordering-table listing; not a current stock or lifecycle claim
Practical questions for this selection
Does MG285 provide more I/O because its terminal count is higher?
No. Compare the device/package user I/O rows, not total terminals. Power, ground, dedicated functions and package allocation prevent terminal count from serving as a user-I/O budget.
What does the numerical example establish for LFE5U-12F-6BG256C?
It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.
For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.
Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.
285 full MPNs meet the entered numeric constraints. Showing 6 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.
Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
Package: BG256 → FBG484. Verify the applicable limits and design impact.
Speed grade: -6 → -1. Verify the applicable limits and design impact.
Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.
Numeric screening is not replacement approval.
Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.
