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Altera / Cyclone IV E

EP4CE40F23I7N

F23 · I · Speed grade -7

FPGA.io Part Number FIO-900D532765BF036BInternal catalogue reference · manufacturer MPN remains unchanged

Lifecycle & ordering review: Exact-MPN ordering-table presence does not establish lifecycle status. Evidence and conditions ↓

Official datasheet · PDF ↗All technical documents ↓

Core fields reviewed 2026-09-27
Source links and conditions accompany each parameter.

EP4CE40F23I7N — technical feature overview
Technical schematicFPGA.io technical schematic for EP4CE40F23I7N. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
Altera logic elements
39600 LE
Block RAM capacity
1134 Kb
Altera embedded 18 × 18 multipliers
116 18 x 18 embedded multipliers
User I/O in this package
328 I/O

SOURCING REFERENCES

Price & delivery references

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PRODUCT OVERVIEW

About EP4CE40F23I7N

EP4CE40F23I7N is an FPGA in the Altera Cyclone IV E family, supplied in the F23 package. Its reviewed resources include 39,600 LE, 1,134 Kb of block RAM, 328 I/O for this device/package combination. This ordering code specifies speed grade -7 and I temperature grade. The selected device/package has 0 serial transceiver channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.

  • Altera logic elements39,600 LE
  • Block RAM capacity1,134 Kb
  • Altera embedded 18 × 18 multipliers116 18 x 18 embedded multipliers
  • User I/O in this package328 I/O
  • Package codeF23
  • Junction temperature (Tj)-40 to +100 °C
Review parameter sources and conditions ↓

Technical specifications

Core device/package/grade facts checked against official sources. Native resources are not cross-vendor equivalents. Detailed timing, design power and current supply status require project review.

Logic & memory

ParameterValueScope / evidence
Logic cellsNot confirmedunverified
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

6-input LUTsNot confirmedunverified
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

Block RAM capacity1134 KbdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

36 Kb block RAM blocksNot confirmedunverified
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

DSP slicesNot confirmedunverified
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

Native architecture resources

ParameterValueScope / evidence
Altera logic elements39600 LEdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Altera embedded 18 × 18 multipliers116 18 x 18 embedded multipliersdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Altera M9K blocks126 M9K blocksderivedCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Package & interfaces

ParameterValueScope / evidence
User I/O in this package328 I/Odevice-packageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

Serial transceivers in this package0 serial transceiver channelsdevice-packageCYIV-OVERVIEW-2-0 ↗PDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

Package codeF23device-packageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

FineLine BGA (FBGA); package-matrix code F484.

Package ball count484 ballspackageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Actual BGA terminal count.

Package body23 x 23 mmpackageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; Size (mm) row
Conditions

BGA package size from manufacturer matrix.

Ball pitch1 mmpackageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; Pitch (mm) row
Conditions

Ball pitch; source package-matrix pitch.

Package terminals / leads (vendor count)484 pinspackageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. BGA package: pin positions are physical balls.

Operating conditions

ParameterValueScope / evidence
Speed grade-7partCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

Junction temperature (Tj)-40 to +100 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Temperature gradeIpartCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Industrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Core voltage conditions1.15-1.25 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Nominal 1.20 V internal-logic supply for grade I7. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V.

Maximum application clockNot confirmedunverified
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Application powerNot confirmedunverified
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Minimum junction temperature-40 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Maximum junction temperature100 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Temperature referenceTjpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

Conditional temperature operationHistorical conditional extended rangepart-conditionalALTERA-EXTENDED-TEMPERATURE-SUPPORT ↗Cyclone IV FPGA Extended Industrial Temperature Offerings, EP4CE40 row, base ordering code EP4CE40F23I7; N suffix applicability note above table; timing-analysis and temperature-profile conditions preceding table
Conditions

Tj -40 to 125 °C, operating speed -8. Historical manufacturer support table requires extended-range timing analysis with an I7 target and -40/125 C temperature settings; operating speed grade is -8 and nominal supply is 1.2 V. Manufacturer confirmation of acceptable temperature profiles is required. Do not treat -7 at 125 C as unconditional.

Minimum core voltage1.15 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Nominal core voltage1.2 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Maximum core voltage1.25 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Supply & status

ParameterValueScope / evidence
Current lifecycleNot confirmedunverified
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Available stockNot confirmedunverified
Conditions

No stock observation; manufacturer order code is not inventory availability.

MANUFACTURER REFERENCES

Official documents & PDF datasheets

Use the electrical data sheet together with the device overview and package/pinout information.

Data sheet / device referenceCyclone IV Device Handbook, Volume 3, Chapter 1: Cyclone IV Device DatasheetPDF pp. 450-451; printed pp. 1-4 through 1-5; Table 1-3 Recommended Operating Conditions for Cyclone IV E Devices, both parts and notes. · Rev CYIV-53001-2.1 · 2016-12Official manufacturer PDF ↗Data sheet / device referenceCyclone IV Device Handbook, Volume 1, Chapter 1: Cyclone IV FPGA Device Family OverviewPDF pp. 15-27; printed pp. 1-1 through 1-13. Tables 1-1, 1-3; FPGA Core Fabric; Figure 1-3. · Rev CYIV-51001-2.0 · 2016-03Official manufacturer PDF ↗Data sheet / device referenceCyclone IV FPGA Device Family Overview - standalone chapterp. 12 / printed p. 1-12, Figure 1-3, package and grade decoding. Ordinary industrial range is separate from conditional extended-temperature operation. · Rev CYIV-51001-2.0 · 2016-03Official manufacturer PDF ↗Selection & orderingExtended Temperature Device SupportExtended Industrial Temperature Range Devices; Cyclone IV FPGA Extended Industrial Temperature Offerings; preceding Quartus timing-analysis instructions and acceptable-temperature-profile condition.Official manufacturer webpage, indexed content ↗Selection & orderingCyclone IV E EP4CE40-F23 - supported Ordering Part NumbersOrdering Part Number column; entire visible table; literal ordering strings extracted from DOM link text.Official manufacturer ordering table ↗

Full ordering-number evidence: Ordering Part Number column, data row 13, literal EP4CE40F23I7N.

Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.

ENGINEERING SELECTION

What these specifications mean for your design

Use the documented resources of EP4CE40F23I7N to frame a design review. The guidance below interprets the source data; it does not establish achieved system performance.

Logic implementation

39,600 LE

Use this native resource count for an initial budget. LUT, logic-cell and logic-element definitions differ; synthesize your HDL in the target toolchain to establish fit and timing.

Manufacturer evidence ↗ Conditions ↓

Buffers and local storage

1,134 Kb

Budget sample buffers, FIFOs and coefficient storage in bits, then check memory block geometry, port widths, clocking and reserved capacity. External memory needs a separate interface review.

Manufacturer evidence ↗ Conditions ↓

Arithmetic and signal processing

116 18 x 18 embedded multipliers

Map the required multiply/accumulate operations, operand widths and pipeline stages to the documented DSP architecture. A resource count does not establish throughput.

Manufacturer evidence ↗ Conditions ↓

Board connections

328 I/O

This count applies to the selected device/package. Budget required signals and spare capacity, then check bank voltages, differential pairs, dedicated pins and configuration use in the pinout guide.

Manufacturer evidence ↗ Conditions ↓

High-speed serial planning

0 serial transceiver channels

No dedicated serial transceiver channels are documented for this device/package. Do not assume another package’s transceiver capability applies; evaluate a different documented part or a separate interface device.

Manufacturer evidence ↗ Conditions ↓

PCB and assembly planning

F23

Check the official footprint, pin/ball map, pitch, escape routing, power/ground distribution and assembly constraints. Package name or ball count alone does not prove pin compatibility.

Manufacturer evidence ↗ Conditions ↓

Operating environment

-40 to +100 °C

Check whether this range is specified at junction or ambient, together with the source conditions. Estimate power and cooling for your design before selecting the temperature grade.

Manufacturer evidence ↗ Conditions ↓

Application paths to evaluate

These are engineering evaluation directions based on documented resources, not verified reference designs or application certifications.

Control and interface logic

Evaluate state machines, parallel interfaces and I/O expansion against the documented I/O budget, bank standards and timing. Select external level shifting or interface devices where required.

Build a resource budget →

Buffered signal processing

Evaluate filters, sample buffering and pipelined arithmetic using the documented DSP and block RAM resources. Validate precision, memory bandwidth, clock closure and application power in the actual implementation.

Build a resource budget →

Achievable clock frequency, power consumption and interface performance depend on the implemented design, operating conditions and timing closure. Use the applicable electrical data sheet and vendor analysis tools.

Before placing this part on a board

  1. Use the full ordering number. Check the package pinout, power banks, speed grade and temperature range together.
  2. Complete timing and power analysis. A resource table cannot predict achievable frequency or application power.
  3. Define the manufacturing scope. Share the BGA footprint, stack-up, assembly requirements and test plan with your PCBA request.
Plan assembly for your FPGA board →

FROM SELECTION TO A BOARD

Design resources & implementation options

Plan I/O and banks →Record the signal count, bank allocation and configuration pins against this package.Prepare the power plan →List required rails and sequencing. Obtain design-specific current estimates from the vendor tools.Review the footprint and escape →Use the manufacturer pinout and dimensions to prepare a routing and assembly discussion.Boards, software and IP →Find the manufacturer’s development resources, then confirm the exact device and tool-version support.PCB fabrication review →Discuss stack-up, impedance, materials and the board’s fabrication requirements.Chip supply + PCBA quotation →Include your BOM, board revision, quantity, programming and inspection/test requirements.
When to evaluate another implementation

For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.

Explore semiconductor brands and product categories →

ENGINEERING SHORTLIST

Screen candidates for your design

Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.

130 full MPNs meet the entered numeric constraints. Showing 5 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.

Compare these two

39600 LE · F23 · A

Differences and compatibility checks
  • Temperature grade: I → A. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

Lattice Semiconductor

LFE5U-85F-6BG756C

Compare these two

84000 LUT4 (nominal) · BG756 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: F23 → BG756. Verify the applicable limits and design impact.
  • Temperature grade: I → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -6. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

Lattice Semiconductor

LFE5UM-85F-6BG756C

Compare these two

84000 LUT4 (nominal) · BG756 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: F23 → BG756. Verify the applicable limits and design impact.
  • Temperature grade: I → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -6. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

AMD / Xilinx

XC7K160T-1FBG676C

Compare these two

162240 logic cells · FBG676 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: F23 → FBG676. Verify the applicable limits and design impact.
  • Temperature grade: I → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -1. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

AMD / Xilinx

XC7A200T-1FBG676C

Compare these two

215360 logic cells · FBG676 · Commercial (C)

Differences and compatibility checks
  • Different family or manufacturer: review native logic/DSP architecture, HDL/IP portability and toolchain.
  • Package: F23 → FBG676. Verify the applicable limits and design impact.
  • Temperature grade: I → Commercial (C). Verify the applicable limits and design impact.
  • Speed grade: -7 → -1. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

Numeric screening is not replacement approval.

Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.

Request a board and sourcing review →

DEVICE & PROCUREMENT QUESTIONS

EP4CE40F23I7N FAQ

What is EP4CE40F23I7N?

EP4CE40F23I7N is an FPGA in the Altera Cyclone IV E family, supplied in the F23 package. Its reviewed resources include 39,600 LE, 1,134 Kb of block RAM, 328 I/O for this device/package combination. This ordering code specifies speed grade -7 and I temperature grade. The selected device/package has 0 serial transceiver channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.

Which package and grade does EP4CE40F23I7N specify?

The reviewed package is F23 and the temperature grade is I. The documented operating range is -40 to +100 °C. Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. Match the complete suffix when preparing a BOM.

Where can I find the official EP4CE40F23I7N datasheet?

Use the manufacturer-hosted PDF and documentation links in Official documents on this page. The electrical data sheet, resource overview and package/pinout guide serve different purposes; check the relevant revision and tables together.

Is EP4CE40F23I7N in stock, and can I request a better price?

FPGA.io confirms price, available quantity, lot requirements and lead time through a quotation. Supplier references are separate from FPGA.io stock. Send your required quantity and delivery date; an optional target unit price helps us assess a price-review request. A lower price is not guaranteed.

Can another FPGA replace EP4CE40F23I7N?

A similar resource count does not establish compatibility. Compare package pinout, I/O-bank voltages, configuration, timing, temperature grade and tool support. The candidate screen is a starting point for engineering review, not replacement approval.

Can FPGA.io supply EP4CE40F23I7N with PCB assembly?

Yes, you can request chip sourcing with PCBA project review. Include the board revision, quantity, BOM readiness, programming and inspection/test requirements. The manufacturing scope and delivery are confirmed for the specific project.

ENGINEERING RESOURCES

Move from a part to a design review.

Prepare the exact-device evidence, I/O assumptions and manufacturing scope before committing to a board.

Read an exact ordering code →Download the I/O & power worksheet →Prepare an engineering question →