SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | EP4CE40F23I7NCyclone IV E | XC7K160T-1FBG676CKintex-7 |
|---|---|---|
| Logic cellsUnconfirmed data | Not confirmedConditionsAltera LE count is logic_elements; no conversion to AMD logic cells. | 162240 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. |
| 6-input LUTsUnconfirmed data | Not confirmedConditionsCyclone IV uses four-input LUT LEs; no LUT6 equivalence. | 101400 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K160T row; note 1; p. 7 CLBs, Slices, and LUTsConditions25350 slices x 4 LUT6 per slice. |
| Block RAM capacityDifferent | 1134 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded memory (Kbits) rowConditionsOfficial embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes. | 11700 KbDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. |
| 36 Kb block RAM blocksUnconfirmed data | Not confirmedConditionsExisting field means 36 Kb blocks; M9K count is separate in | 325 blocksDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. |
| DSP slicesUnconfirmed data | Not confirmedConditionsExisting field means DSP slices. Native 18 x 18 embedded multipliers are separate. | 600 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K160T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. |
| Altera logic elementsUnconfirmed data | 39600 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Logic elements (LEs) row; PDF p. 22 FPGA Core FabricConditionsNative Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells. | Not confirmed |
| Altera embedded 18 × 18 multipliersUnconfirmed data | 116 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core FabricConditionsOne 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices. | Not confirmed |
| Altera M9K blocksUnconfirmed data | 126 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; PDF p. 22 FPGA Core FabricConditionsOfficial embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity. | Not confirmed |
| User I/O in this packageDifferent | 328 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; User I/O columnConditionsUser I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1. | 400 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG676 columnsConditionsPackage-specific user I/O. HR + HP; excludes GT serial channels. |
| Serial transceivers in this packageDifferent resource definitions | 0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3ConditionsHigh-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels. | 8 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG676 columns; GTX columnConditionsNumber of channels exposed in this selected device/package; not device-family maximum. |
| Package codeDifferent | F23CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsFineLine BGA (FBGA); package-matrix code F484. | FBG676UG475 ↗ · packagep. 268, Figure 4-14 titleConditionsExact package token; does not establish any full orderable MPN. |
| Package ball countDifferent | 484 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsActual BGA terminal count. | 676 ballsUG475 ↗ · packagep. 268, Figure 4-14; full 26 x 26 bottom-view matrix; Kintex equivalent p. 279 Figure 4-25Conditionsfull 26 x 26 bottom-view matrix; Kintex equivalent p. 279 Figure 4-25 |
| Package bodyDifferent | 23 x 23 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; Size (mm) rowConditionsBGA package size from manufacturer matrix. | 27 x 27 mmUG475 ↗ · packagep. 11, Table 1-1; p. 268, Figure 4-14, D/E dimensionsConditionsPackage body width x length; excludes PCB keep-out and component height. |
| Ball pitchSame | 1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F484 columns; Pitch (mm) rowConditionsBall pitch; source package-matrix pitch. | 1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 268, Figure 4-14, e dimensionConditionsBall-to-ball pitch. |
| Package terminals / leads (vendor count)Unconfirmed data | 484 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsManufacturer package pin count. BGA package: pin positions are physical balls. | Not confirmed |
| Speed gradeDifferent | -7CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsSource speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax. | -1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit. |
| Junction temperature (Tj)Different | -40 to +100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | 0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Temperature gradeDifferent | ICYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsIndustrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately. | Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row |
| Core voltage conditionsUnconfirmed data | 1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsNominal 1.20 V internal-logic supply for grade I7. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V. | Not confirmedConditionsNot verified in this review. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsApplication-specific timing not reviewed. Use implementation constraints and timing analysis. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Application powerUnconfirmed data | Not confirmedConditionsDesign activity, voltage and temperature dependent; no single device power asserted. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Minimum junction temperatureDifferent | -40 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | 0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Maximum junction temperatureDifferent | 100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | 85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Temperature referenceSame | TjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsTJ, not TA. | TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Conditional temperature operationUnconfirmed data | Historical conditional extended rangeALTERA-EXTENDED-TEMPERATURE-SUPPORT ↗ · part-conditionalCyclone IV FPGA Extended Industrial Temperature Offerings, EP4CE40 row, base ordering code EP4CE40F23I7; N suffix applicability note above table; timing-analysis and temperature-profile conditions preceding tableConditionsTj -40 to 125 °C, operating speed -8. Historical manufacturer support table requires extended-range timing analysis with an I7 target and -40/125 C temperature settings; operating speed grade is -8 and nominal supply is 1.2 V. Manufacturer confirmation of acceptable temperature profiles is required. Do not treat -7 at 125 C as unconditional. | Not confirmed |
| Minimum core voltageUnconfirmed data | 1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | Not confirmed |
| Nominal core voltageUnconfirmed data | 1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | Not confirmed |
| Maximum core voltageUnconfirmed data | 1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsExact-MPN ordering-table presence does not establish lifecycle status. | Not confirmedConditionsNot verified in this review. |
| Available stockUnconfirmed data | Not confirmedConditionsNo stock observation; manufacturer order code is not inventory availability. | Not confirmedConditionsNot verified in this review. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.