FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems

Altera / Cyclone IV E

EP4CE40F29I7

F29 · I · Speed grade -7

FPGA.io Part Number FIO-EDBEA1AC16DB3A89Internal catalogue reference · manufacturer MPN remains unchanged

Lifecycle & ordering review: Exact-MPN ordering-table presence does not establish lifecycle status. Evidence and conditions ↓

Core fields reviewed 2026-09-27
Source links and conditions accompany each parameter.

EP4CE40F29I7 — technical feature overview
Technical schematicFPGA.io technical schematic for EP4CE40F29I7. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓
Altera logic elements
39600 LE
Block RAM capacity
1134 Kb
Altera embedded 18 × 18 multipliers
116 18 x 18 embedded multipliers
User I/O in this package
532 I/O

SOURCING REFERENCES

Price & delivery references

Get Price & Lead Time ↗

No verified supplier stock or price is currently displayed here. Request a quotation for your quantity and required delivery date.

Check this exact MPN at external distributors

Search links do not establish stock, price or an authorized distribution relationship. Check the full code, package and grade at the source.

PRODUCT OVERVIEW

About EP4CE40F29I7

EP4CE40F29I7 is an FPGA in the Altera Cyclone IV E family, supplied in the F29 package. Its reviewed resources include 39,600 LE, 1,134 Kb of block RAM, 532 I/O for this device/package combination. This ordering code specifies speed grade -7 and I temperature grade. The selected device/package has 0 serial transceiver channels; check this package-level limit before planning serial interfaces. Use the linked manufacturer data sheets for electrical limits, pin assignments and timing. FPGA.io can review the complete part number for chip sourcing or a combined sourcing and PCBA project.

  • Altera logic elements39,600 LE
  • Block RAM capacity1,134 Kb
  • Altera embedded 18 × 18 multipliers116 18 x 18 embedded multipliers
  • User I/O in this package532 I/O
  • Package codeF29
  • Junction temperature (Tj)-40 to +100 °C
Review parameter sources and conditions ↓

Technical specifications

Core device/package/grade facts checked against official sources. Native resources are not cross-vendor equivalents. Detailed timing, design power and current supply status require project review.

Logic & memory

ParameterValueScope / evidence
Logic cellsNot confirmedunverified
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

6-input LUTsNot confirmedunverified
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

Block RAM capacity1134 KbdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

36 Kb block RAM blocksNot confirmedunverified
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

DSP slicesNot confirmedunverified
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

Native architecture resources

ParameterValueScope / evidence
Altera logic elements39600 LEdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Altera embedded 18 × 18 multipliers116 18 x 18 embedded multipliersdeviceCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Altera M9K blocks126 M9K blocksderivedCYIV-OVERVIEW-2-0 ↗PDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE40 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Package & interfaces

ParameterValueScope / evidence
User I/O in this package532 I/Odevice-packageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F780 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

Serial transceivers in this package0 serial transceiver channelsdevice-packageCYIV-OVERVIEW-2-0 ↗PDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

Package codeF29device-packageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

FineLine BGA (FBGA); package-matrix code F780.

Package ball count780 ballspackageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Actual BGA terminal count.

Package body29 x 29 mmpackageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F780 columns; Size (mm) row
Conditions

BGA package size from manufacturer matrix.

Ball pitch1 mmpackageCYIV-OVERVIEW-2-0 ↗PDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE40 row, F780 columns; Pitch (mm) row
Conditions

Ball pitch; source package-matrix pitch.

Package terminals / leads (vendor count)780 pinspackageCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. BGA package: pin positions are physical balls.

Operating conditions

ParameterValueScope / evidence
Speed grade-7partCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

Junction temperature (Tj)-40 to +100 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Temperature gradeIpartCYIV-ORDERING-STANDALONE-2-0 ↗Standalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Industrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Core voltage conditions1.15-1.25 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Nominal 1.20 V internal-logic supply for grade I7. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V.

Maximum application clockNot confirmedunverified
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Application powerNot confirmedunverified
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Minimum junction temperature-40 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Maximum junction temperature100 °CpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation.

Temperature referenceTjpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

Conditional temperature operationHistorical conditional extended rangepart-conditionalALTERA-EXTENDED-TEMPERATURE-SUPPORT ↗Cyclone IV FPGA Extended Industrial Temperature Offerings, EP4CE40 row, base ordering code EP4CE40F29I7; N suffix applicability note above table; timing-analysis and temperature-profile conditions preceding table
Conditions

Tj -40 to 125 °C, operating speed -8. Historical manufacturer support table requires extended-range timing analysis with an I7 target and -40/125 C temperature settings; operating speed grade is -8 and nominal supply is 1.2 V. Manufacturer confirmation of acceptable temperature profiles is required. Do not treat -7 at 125 C as unconditional.

Minimum core voltage1.15 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Nominal core voltage1.2 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Maximum core voltage1.25 VpartCYIV-DATASHEET-2-1 ↗Combined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)
Conditions

Grade I7, 1.2-V operation.

Supply & status

ParameterValueScope / evidence
Current lifecycleNot confirmedunverified
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Available stockNot confirmedunverified
Conditions

No stock observation; manufacturer order code is not inventory availability.

MANUFACTURER REFERENCES

Official documents & PDF datasheets

Use the electrical data sheet together with the device overview and package/pinout information.

Data sheet / device referenceCyclone IV Device Handbook, Volume 3, Chapter 1: Cyclone IV Device DatasheetPDF pp. 450-451; printed pp. 1-4 through 1-5; Table 1-3 Recommended Operating Conditions for Cyclone IV E Devices, both parts and notes. · Rev CYIV-53001-2.1 · 2016-12Official manufacturer PDF ↗Data sheet / device referenceCyclone IV Device Handbook, Volume 1, Chapter 1: Cyclone IV FPGA Device Family OverviewPDF pp. 15-27; printed pp. 1-1 through 1-13. Tables 1-1, 1-3; FPGA Core Fabric; Figure 1-3. · Rev CYIV-51001-2.0 · 2016-03Official manufacturer PDF ↗Data sheet / device referenceCyclone IV FPGA Device Family Overview - standalone chapterp. 12 / printed p. 1-12, Figure 1-3, package and grade decoding. Ordinary industrial range is separate from conditional extended-temperature operation. · Rev CYIV-51001-2.0 · 2016-03Official manufacturer PDF ↗Selection & orderingExtended Temperature Device SupportExtended Industrial Temperature Range Devices; Cyclone IV FPGA Extended Industrial Temperature Offerings; preceding Quartus timing-analysis instructions and acceptable-temperature-profile condition.Official manufacturer webpage, indexed content ↗Selection & orderingCyclone IV E EP4CE40-F29 - supported Ordering Part NumbersOrdering Part Number column; entire visible table; literal ordering strings extracted from DOM link text.Official manufacturer ordering table ↗

Full ordering-number evidence: Ordering Part Number column, data row 11, literal EP4CE40F29I7.

Manufacturer documents may be revised. Verify the current revision and applicable device/package/grade before releasing a design.

DEVICE & PACKAGE DECISION

Justify the larger F29 core with a measured logic or memory requirement

For this exact non-N ordering identity, the F29 comparison with EP4CE30 is useful when deciding whether extra native LE and embedded memory justify a core change. The package I/O count alone does not motivate that move. Preserve the full recorded code in the BOM and verify packing and ordering details rather than adding a suffix by convention.

Engineering screening guidance using reviewed catalogue evidence. Examples are hypothetical and advisory; validate your actual design and the exact ordering code.

Hypothetical example: Parallel signal budget

Assumed inputs: 12 interfaces × 32 single-ended signals + 48 control signals + 32 reserved signals.

Calculation: 12 × 32 + 48 + 32 = 464 I/O.

Result: 68 I/O remain in the count-only budget (87.2% allocated).

Planning diagram: assumed I/O allocation
464 I/O assumed allocation / 532 documented package I/O; 68 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.
I/O budget for 464 allocated signals464 I/O assumed allocation / 532 documented package I/O; 68 I/O unallocated. Count-only planning diagram, not a pinout or bank assignment.

87.2% of the sourced package count allocated; 68 I/O unallocated.

Each signal consumes one single-ended user I/O in this example. Dedicated serial lanes are separate. Bank voltage, differential pairing, clocks, configuration use and actual pin allocation can reduce usable capacity. Reserved signals here are an assumed design allowance, not manufacturer-reserved pins.

Hypothetical example: Sample-buffer payload

Assumed inputs: 4 channels × 4096 samples/channel × 16 bits/sample.

Calculation: 4 × 4096 × 16 = 262,144 payload bits.

Result: Allocate at least 262,144 payload bits before adding memory overhead. The current reviewed embedded-memory reference is 1,134 Kb.

Payload arithmetic only. The source Kb/kb unit is retained; this example does not choose a decimal/binary conversion or claim a percentage fit. Round each buffer to the native memory-block geometry and check port width, depth, ECC/parity, dual-port use and implementation reports.

Public device and ordering comparisons

Compare exact package and grade conditions below. These are screening references; matching names, dimensions or resource counts do not establish pin compatibility or replacement approval.

EP4CE40F29I7 and already-public screening candidates
Condition / resourceEP4CE40F29I7 (selected)cyclone-iv-e / EP4CE40EP4CE30F29I7Ncyclone-iv-e / EP4CE30EP4CE15F23I7Ncyclone-iv-e / EP4CE15
PackageF29 [source]F29 [source]F23 [source]
Speed grade-7 [source]-7 [source]-7 [source]
GradeI [source]I [source]I [source]
Operating temperature (see basis/conditions)-40 to +100 °C [source]-40 to +100 °C [source]-40 to +100 °C [source]
Temperature basisTj [source]Tj [source]Tj [source]
Body dimensions29 x 29 mm [source]29 x 29 mm [source]23 x 23 mm [source]
Pitch1 mm [source]1 mm [source]1 mm [source]
Package user I/O532 I/O [source]532 I/O [source]343 I/O [source]
Package dedicated channels0 serial transceiver channels [source]0 serial transceiver channels [source]0 serial transceiver channels [source]
Logic elements (Altera)39,600 LE [source]28,848 LE [source]15,408 LE [source]
Embedded block memory1,134 Kb [source]594 Kb [source]504 Kb [source]
Core rail reference1.15-1.25 V [source]1.15-1.25 V [source]1.15-1.25 V [source]

Native LUT4, LE and logic-cell metrics remain separate. Temperature is not converted to ambient; source notes define the operating basis. A family maximum is never substituted for package I/O or channels. No clock, power or stock figure is inferred.

Sources and conditions: EP4CE40F29I7

Lifecycle / ordering: Exact-MPN ordering-table presence does not establish lifecycle status.

Sources and conditions: EP4CE30F29I7N

Package and grade labels match; pinout, electrical limits, timing and configuration compatibility still require verification.

Lifecycle / ordering: Exact-MPN ordering-table presence does not establish lifecycle status.

Sources and conditions: EP4CE15F23I7N

Package: F29 → F23. Verify the applicable limits and design impact.

Lifecycle / ordering: Exact-MPN ordering-table presence does not establish lifecycle status.

Exact identity evidence: Cyclone IV E EP4CE40-F29 - supported Ordering Part Numbers · Ordering Part Number column, data row 11, literal EP4CE40F29I7 · manufacturer ordering table, checked 2026-09-27

Practical questions for this selection

Can I append N to this recorded ordering code automatically?

Keep the exact independently evidenced MPN. A suffix change creates a different ordering identity; confirm its literal manufacturer listing and packing or material details instead of normalizing it by habit.

What does the numerical example establish for EP4CE40F29I7?

It establishes arithmetic under the explicitly hypothetical inputs shown here. It is not a tool result, synthesis report, timing closure, pin-assignment validation or application qualification. Replace the assumptions with your signal list and memory geometry, then validate in the vendor tools.

Selection guide updated (UTC). Manufacturer-document revisions are listed separately.

Before placing this part on a board

  1. Use the full ordering number. Check the package pinout, power banks, speed grade and temperature range together.
  2. Complete timing and power analysis. A resource table cannot predict achievable frequency or application power.
  3. Define the manufacturing scope. Share the BGA footprint, stack-up, assembly requirements and test plan with your PCBA request.
Plan assembly for your FPGA board →

FROM SELECTION TO A BOARD

Design resources & implementation options

When to evaluate another implementation

For software-heavy control with limited parallel I/O, assess an MCU or processor against the same latency, interface and power requirements. For wide parallel datapaths or custom timing, compare FPGA architectures using a mapped design. For early prototyping, an evaluation board may reduce initial hardware work; verify its exact device, accessible interfaces and production suitability.

Explore semiconductor brands and product categories →

ENGINEERING SHORTLIST

Screen candidates for your design

Start with this package’s I/O, block RAM and serial channel counts, or enter your actual requirements. Native resource requirements apply only to the selected architecture.

13 full MPNs meet the entered numeric constraints. Showing 1 device representatives, at most two per manufacturer, ordered by smallest excess resources. Temperature and package variants still need selection.

39600 LE · F29 · C

Differences and compatibility checks
  • Temperature grade: I → C. Verify the applicable limits and design impact.
  • Speed grade: -7 → -6. Verify the applicable limits and design impact.

Numeric matches do not establish pin compatibility, protocol support, lifecycle or supply availability.

Numeric screening is not replacement approval.

Logic and DSP mapping, pinout, bank voltages, temperature, timing, protocol support and toolchain remain engineering checks. Serial channel quantity does not verify data rate or protocol support. Cross-brand candidates generally require board and HDL review.

Request a board and sourcing review →