SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | XC7A100T-1CSG324CArtix-7 | XC7K160T-1FBG484CKintex-7 |
|---|---|---|
| Logic cellsDifferent | 101440 logic cellsDS180 ↗ · deviceConditionsVendor logic-cell metric; not equivalent to another architecture's ALM count. | 162240 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. |
| 6-input LUTsDifferent | 63400 LUT6DS180 ↗ · derivedConditions15,850 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture. | 101400 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K160T row; note 1; p. 7 CLBs, Slices, and LUTsConditions25350 slices x 4 LUT6 per slice. |
| Block RAM capacityDifferent | 4860 KbDS180 ↗ · deviceConditionsAMD source unit retained: Kb is kilobits, not kilobytes. | 11700 KbDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. |
| 36 Kb block RAM blocksDifferent | 135 blocksDS180 ↗ · deviceConditionsEach block is nominally 36 Kb. | 325 blocksDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. |
| DSP slicesDifferent | 240 DSP48E1DS180 ↗ · deviceConditionsCompare with the same DSP architecture; slice counts across vendors are not equivalent. | 600 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K160T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. |
| User I/O in this packageDifferent | 210 I/OXMP101 ↗ · packageConditionsValue belongs to this device/package combination. | 285 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG484 columnsConditionsPackage-specific user I/O. HR + HP; excludes GT serial channels. |
| Serial transceivers in this packageDifferent resource definitions | 0 GTPXMP101 ↗ · packageConditionsNo GTP channels exposed in this selected device/package combination. | 4 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K160T row, FBG484 columns; GTX columnConditionsNumber of channels exposed in this selected device/package; not device-family maximum. |
| Package codeDifferent | CSG324XMP101 ↗ · MPN | FBG484UG475 ↗ · packagep. 266, Figure 4-12 titleConditionsExact package token; does not establish any full orderable MPN. |
| Package ball countDifferent | 324 ballsUG475 ↗ · package | 484 ballsUG475 ↗ · packagep. 266, Figure 4-12; full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22Conditionsfull 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22 |
| Package bodyDifferent | 15 × 15 mmUG475 ↗ · package | 23 x 23 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensionsConditionsPackage body width x length; excludes PCB keep-out and component height. |
| Ball pitchDifferent | 0.8 mmUG475 ↗ · package | 1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, e dimensionConditionsBall-to-ball pitch. |
| Package terminals / leads (vendor count)Unconfirmed data | Not confirmed | Not confirmedConditionsNot verified in this bounded review. |
| Speed gradeSame | -1XMP101 ↗ · MPNConditionsSpeed grade is not a single guaranteed application clock frequency. | -1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit. |
| Junction temperature (Tj)Same | 0 to +85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. | 0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Temperature gradeSame | Commercial (C)XMP101 ↗ · MPN | Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row |
| Core voltage conditionsUnconfirmed data | Not confirmedConditionsConsult the family DC/AC data sheet for the applicable operating conditions. | Not confirmedConditionsNot verified in this bounded review. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsDepends on the implemented design, timing constraints and speed grade. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Application powerUnconfirmed data | Not confirmedConditionsRequires design-specific power estimation and thermal analysis. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Minimum junction temperatureSame | 0 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | 0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row |
| Maximum junction temperatureSame | 85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | 85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row |
| Temperature referenceSame | TjXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. | TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Conditional temperature operationUnconfirmed data | Not confirmed | Not confirmedConditionsNot verified in this bounded review. |
| Minimum core voltageUnconfirmed data | Not confirmed | Not confirmedConditionsNot verified in this bounded review. |
| Nominal core voltageUnconfirmed data | Not confirmed | Not confirmedConditionsNot verified in this bounded review. |
| Maximum core voltageUnconfirmed data | Not confirmed | Not confirmedConditionsNot verified in this bounded review. |
| Current lifecycleUnconfirmed data | Not confirmedConditionsConfirm the current manufacturer lifecycle at quotation. | Not confirmedConditionsCurrent lifecycle not verified. Do not apply the V-package discontinuation notice to its G-package replacement. |
| Available stockUnconfirmed data | Not confirmedConditionsStock, lot traceability and delivery are confirmed during quotation. | Not confirmedConditionsNo inventory, stock, price or lead-time evidence was reviewed. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.