Cambricon / 寒武纪 / TECHNICAL REFERENCE
MLU220
Cambricon's Siyuan 220 edge AI SoC. The launch release explicitly separates MLU220 silicon from its M.2 accelerator card.
FPGA.io Part Number FIO-8D91C36D2828A06FInternal catalogue reference · manufacturer MPN remains unchanged
Technical reference · Base device — ordering suffix not specified · Checked 2026-09-28
DOCUMENTED FACTS
Technical parameters
Values apply to the device and conditions identified in each source. Family maxima, package limits and full ordering-code specifications must not be treated as interchangeable.
| Parameter | Documented value | Source & conditions |
|---|---|---|
| Architecture | MLUv02 | Cambricon launches Siyuan 220 edge AI chip ↗思元220芯片 architecture paragraph |
| Peak integer compute | Up to 32 TOPS INT4 | Cambricon launches Siyuan 220 edge AI chip ↗思元220芯片 architecture paragraph |
| Configurable fixed-point widths | 16, 8 and 4 bits | Cambricon launches Siyuan 220 edge AI chip ↗思元220芯片 fixed-point computation paragraph |
| Process technology | TSMC 16 nm | Cambricon launches Siyuan 220 edge AI chip ↗AI SoC edge-accelerator description |
Official documents
Cambricon launches Siyuan 220 edge AI chip20 November 2019; chip architecture and SoC descriptionsWeb ↗Ordering and board constraints
This reference identifies a base device. Package, speed grade, temperature, qualification and packing suffixes have not been inferred.
- The MLU220-M.2 board has separate throughput and power limits; do not substitute its specifications for the chip.
- Validate quantization, operator support and the exact NeuWare/software release for the target model.
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- Review pinout, electrical conditions and the exact document revision before PCB release.
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COMPLETE PART IDENTITIES
Ordering numbers for MLU220
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Exact ordering code requires confirmation
The cited public material did not establish a literal complete ordering row in this pass. This is an evidence limit, not a claim that no code exists. The existing device identity is retained; no suffix combinations, neighboring chips, boards or systems are substituted.
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