AMD / Xilinx / Chips & IP
Client processors combining CPU, graphics, and dedicated AI capabilities for compatible local AI applications.
Product lines are representative. Stock, lifecycle, package and grade must be checked against the exact MPN.
FROM FAMILY TO DEVICE
Base-device names are distinct from full ordering numbers. Each detail page identifies the product type, parameter scope and official source.
BASE DEVICE
Ryzen AI 300 processor with heterogeneous Zen 5 CPU cores.
1 device reference
No model matches this search. Clear the filter or send the exact part number for review.
Browse the full AMD / Xilinx product map →
WITHIN THIS PRODUCT LINE
Ryzen AI 400 is a manufacturer-named product family or series. Check the exact device, documentation, tool support and lifecycle before design-in.
0 device refs · 0 ordering codesExplore Ryzen AI 400 →Ryzen AI 300 is a manufacturer-named product family or series. Check the exact device, documentation, tool support and lifecycle before design-in.
1 device refs · 1 ordering codesExplore Ryzen AI 300 →Ryzen AI Max is a manufacturer-named product family or series. Check the exact device, documentation, tool support and lifecycle before design-in.
0 device refs · 0 ordering codesExplore Ryzen AI Max →SELECTION CONTEXT
Client processors combining CPU, graphics, and dedicated AI capabilities for compatible local AI applications.
Use the requirements below to decide which specification limits your design. A family name alone is not a purchasing specification.
Choose the complete device and ordering code before checking package pinout, power, electrical limits and operating grade. Keep family maxima separate from a selected device or package.
Open the manufacturer reference ↗ENGINEERING DECISIONS
Use these checks to define the requirement. Family names alone do not establish performance, package compatibility or current availability.
Identify the complete manufacturer part number, package, operating grade and electrical requirements. Reviewed FPGA specifications can then be compared at device level.
Browse reviewed FPGA device data →Bring the BOM, schematic constraints, stack-up and assembly requirements into the project brief.
PCBA project preparation →EVIDENCE & DEVELOPMENT
Start with the device table, then check electrical limits, ordering information and the applicable tool release.
Compare FPGA architecture generations and find automotive, defense, and space-grade branches.
Official resource and package tables for 7 Series device selection.
Official UltraScale device and package comparison tables.
Check the precise resource, package, and connectivity combinations in UltraScale+ FPGAs.
Task-oriented documentation entry points for architecture, design, verification, and implementation.
Discover additional AMD and partner boards by device family.
Official guide to VCK190, VMK180, VPK180, VPK120, VHK158, VEK280, and VEK385 platforms.
K24-based motor-control and DSP development platform.
K26-based entry point for vision application development.
K26-based robotics and industrial development platform.
Separate Ryzen AI Embedded-based platform for autonomous robotics.
Application-specific cards and solutions for telecommunications acceleration.
Space-grade product information; qualification and radiation requirements need exact-device review.
Soft-processor resources for embedding control software in programmable logic.
Current deployment guidance, board targets, and links to legacy DPU documentation.
Check device and feature entitlements, including the licensing changes introduced with 2026.1.
AMD's official discontinuation notice for the Versal HBM lineage.
XCN23009 covers specified XC9500XL, CoolRunner, Spartan II, and Spartan 3 product families.
Read AMD's family-level longevity statements and the explicit exclusions for integrated-HBM devices.
Search official support answers, knowledge-base articles, and community discussions.
These broader manufacturer resources do not establish support or compatibility for every device on this page.
PRACTICAL QUESTIONS
Start with the documented product scope: Client processors combining CPU, graphics, and dedicated AI capabilities for compatible local AI applications. Then compare the device-specific facts below with your required resources and interfaces. Open each model for its evidence and ordering constraints.
A base-device identifier identifies the silicon or model, but may omit package, speed, temperature, qualification and packing options. Use the manufacturer ordering table to establish the complete code. Reference examples do not establish stock or an approved replacement.
A shared family or manufacturer does not establish pin compatibility. Compare pinout, supply and I/O-bank voltages, configuration, timing, tool support and thermal limits before changing a board.
Provide the exact part or board revision, quantity, delivery requirement, operating environment and traceability needs. For assembly, identify BOM readiness, PCB stack-up, programming access and the inspection or functional-test scope.
PREPARE A USEFUL INQUIRY
Select the points you want our team to review. Your selections stay in this browser until you choose to submit the quotation form.
Open quotation form →AMD / Xilinx Ryzen AI processors reference ↗
Source review: 2026-09-28. This family guide does not assert stock or compatibility between devices.
← Complete AMD / Xilinx product map