FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems
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MANUFACTURER / PRODUCT & DEVELOPMENT GUIDE

Ceva

Ceva licenses processing, AI and wireless-connectivity IP for integration into semiconductor designs.

IP licensing: these are designs integrated into an ASIC or SoC, not standard packaged-chip MPNs.

Explore the portfolio ↓Discuss a requirement ↗
Semiconductor IPRF & wirelessAI accelerators
Product & resource entries
7
Portfolio groups
1
Reviewed FPGA MPNs
0
Source review

0 device refs · 0 ordering codes Counts cover published site records, including subcategories. They do not describe stock or the manufacturer’s complete catalogue.

PRODUCT ARCHITECTURE

Product families & categories

Source-reviewed category map
Portfolio scope & source review

Official Ceva DSP and wireless product pages reviewed. DSP, AI, wireless and sensing IP are distinct; Ceva-Waves and SensPro are named platforms. Configurations and licenses require vendor engagement.

Chips & IPProduct lines3 main entries · 0 device refs · 0 ordering codes
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3 matching product lines · browse subseries within each family

Product lines

AI

AI is a product-line reference within Ceva. Use the manufacturer source to confirm the exact device or deliverable and its current support status.

0 device refs · 0 ordering codesExplore AI →

DEVELOPMENT ECOSYSTEM

Development resources

Use the manufacturer’s current device-support list and release documentation to confirm compatibility.

FROM SELECTION TO PRODUCTION

Turn a product choice into a board requirement.

Confirm the exact device, then connect sourcing, board preparation and assembly review in one project.

Discuss an integration project ↗Plan a PCBA project →

Engineering checkpoints

  • Confirm licensing, target process or host architecture, integration deliverables and verification responsibilities.
  • An IP licence is not a packaged IC; distinguish design-service, licence and silicon procurement scopes.
  • Match frequency band, modulation/protocol, RF performance, antenna interface and regional certification needs.
  • Account for controlled impedance, matching networks, shielding and calibration in the board plan.
  • Validate the target model, precision, compiler/runtime and memory bandwidth on supported hardware.
Use our engineering worksheets →

TRACEABLE INFORMATION

Sources & identity

Official Ceva DSP and wireless product pages reviewed. DSP, AI, wireless and sensing IP are distinct; Ceva-Waves and SensPro are named platforms. Configurations and licenses require vendor engagement.

Checked 2026-09-28. Manufacturer names and images belong to their owners. Listing does not imply stock or an authorized distribution relationship.

Also searchable as: CEVA

Official and identified references

Each product page links its own portfolio evidence. Exact device specifications and lifecycle notices take precedence over family-level summaries.

Suggest a missing product line or correction →

ENGINEERING RESOURCES

Move from a part to a design review.

Prepare the exact-device evidence, I/O assumptions and manufacturing scope before committing to a board.

Read an exact ordering code →Download the I/O & power worksheet →Prepare an engineering question →