SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | XC7A200T-2FBV676IArtix-7 | XC7A100T-1CSG324CArtix-7 |
|---|---|---|
| Logic cellsDifferent | 215360 logic cellsDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. | 101440 logic cellsDS180 ↗ · deviceConditionsVendor logic-cell metric; not equivalent to another architecture's ALM count. |
| 6-input LUTsDifferent | 134600 LUT6DS180 ↗ · derivedp. 3, Table 4, XC7A200T row; note 1; p. 7 CLBs, Slices, and LUTsConditions33650 slices x 4 LUT6 per slice. | 63400 LUT6DS180 ↗ · derivedConditions15,850 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture. |
| Block RAM capacityDifferent | 13140 KbDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. | 4860 KbDS180 ↗ · deviceConditionsAMD source unit retained: Kb is kilobits, not kilobytes. |
| 36 Kb block RAM blocksDifferent | 365 blocksDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. | 135 blocksDS180 ↗ · deviceConditionsEach block is nominally 36 Kb. |
| DSP slicesDifferent | 740 DSP48E1DS180 ↗ · devicep. 3, Table 4, XC7A200T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. | 240 DSP48E1DS180 ↗ · deviceConditionsCompare with the same DSP architecture; slice counts across vendors are not equivalent. |
| User I/O in this packageDifferent | 400 I/OUG475 ↗ · device-packagep. 16, Table 1-8, XC7A200T row, FBG676/FBV676 shared columnConditionsHR user I/O only; excludes serial transceiver channels. | 210 I/OXMP101 ↗ · packageConditionsValue belongs to this device/package combination. |
| Serial transceivers in this packageDifferent resource definitions | 8 GTP channelsUG475 ↗ · device-packagep. 12, Table 1-3, XC7A200T row, FBG676/FBV676 shared columnConditionsChannels bonded out in this exact device/package; a blank or dash is never read as zero. | 0 GTPXMP101 ↗ · packageConditionsNo GTP channels exposed in this selected device/package combination. |
| Package codeDifferent | FBV676UG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, titleConditionsExact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package. | CSG324XMP101 ↗ · MPN |
| Package ball countDifferent | 676 ballsUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing; full 26 x 26 bottom-view matrixConditionsfull 26 x 26 bottom-view matrix | 324 ballsUG475 ↗ · package |
| Package bodyDifferent | 27 x 27 mmUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, D/E dimensionsConditionsPackage body width x length, not die dimensions, height or PCB keep-out. | 15 × 15 mmUG475 ↗ · package |
| Ball pitchDifferent | 1 mmUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, e dimensionConditionsBall-to-ball pitch. | 0.8 mmUG475 ↗ · package |
| Package terminals / leads (vendor count)Unconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Speed gradeDifferent | -2DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit. | -1XMP101 ↗ · MPNConditionsSpeed grade is not a single guaranteed application clock frequency. |
| Junction temperature (Tj)Different | -40 to +100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. | 0 to +85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. |
| Temperature gradeDifferent | Industrial (I)DS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row | Commercial (C)XMP101 ↗ · MPN |
| Core voltage conditionsUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmedConditionsConsult the family DC/AC data sheet for the applicable operating conditions. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsDepends on the application, implementation and operating conditions. | Not confirmedConditionsDepends on the implemented design, timing constraints and speed grade. |
| Application powerUnconfirmed data | Not confirmedConditionsDepends on the application, implementation and operating conditions. | Not confirmedConditionsRequires design-specific power estimation and thermal analysis. |
| Minimum junction temperatureDifferent | -40 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row | 0 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Maximum junction temperatureDifferent | 100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row | 85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Temperature referenceSame | TjDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. | TjXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Conditional temperature operationUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Minimum core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Nominal core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Maximum core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsThis exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source. | Not confirmedConditionsConfirm the current manufacturer lifecycle at quotation. |
| Available stockUnconfirmed data | Not confirmedConditionsNo inventory, stock, price or lead-time evidence was reviewed. | Not confirmedConditionsStock, lot traceability and delivery are confirmed during quotation. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.