FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems

SIDE-BY-SIDE REVIEW

Compare FPGA devices

Review resource differences, package constraints and the fields that still need confirmation.

Select devices (2–4)
Reviewed full part numbers

Showing up to 40 search results plus your selected devices. Search the full catalogue above to find another MPN.

Quote these devices ↗
Parameter / statusEP4CE6E22I8LNCyclone IV EXC7S15-1FTGB196CSpartan-7
Logic cellsUnconfirmed dataNot confirmed
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

12800 logic cellsDS180 ↗ · device
Conditions

Vendor logic-cell metric; not equivalent to another architecture's ALM count.

6-input LUTsUnconfirmed dataNot confirmed
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

8000 LUT6DS180 ↗ · derived
Conditions

2,000 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture.

Block RAM capacityDifferent270 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE6 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

360 KbDS180 ↗ · device
Conditions

AMD source unit retained: Kb is kilobits, not kilobytes.

36 Kb block RAM blocksUnconfirmed dataNot confirmed
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

10 blocksDS180 ↗ · device
Conditions

Each block is nominally 36 Kb.

DSP slicesUnconfirmed dataNot confirmed
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

20 DSP48E1DS180 ↗ · device
Conditions

Compare with the same DSP architecture; slice counts across vendors are not equivalent.

Altera logic elementsUnconfirmed data6272 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE6 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Not confirmed
Altera embedded 18 × 18 multipliersUnconfirmed data15 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE6 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Not confirmed
Altera M9K blocksUnconfirmed data30 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE6 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Not confirmed
User I/O in this packageDifferent91 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE6 row, E144 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

100 I/OXMP101 ↗ · package
Conditions

Value belongs to this device/package combination.

Serial transceivers in this packageDifferent resource definitions0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

0 GTPXMP101 ↗ · package
Conditions

No GTP channels exposed in this selected device/package combination.

Package codeDifferentE22CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Enhanced Thin Quad Flat Pack (EQFP); package-matrix code E144.

FTGB196XMP101 ↗ · MPN
Package ball countUnconfirmed dataNot applicable
Conditions

EQFP has leads and an exposed ground pad. Use package_pins; do not call 144 leads balls.

196 ballsUG475 ↗ · package
Package bodyUnconfirmed dataNot confirmed
Conditions

EQFP matrix lists 22 x 22 mm Size, but molded-body versus lead-inclusive extent has not been resolved with a mechanical drawing. Body dimensions remain null.

15 × 15 mmUG475 ↗ · package
Ball pitchDifferent0.5 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE6 row, E144 columns; Pitch (mm) row
Conditions

Lead pitch; source package-matrix pitch.

1 mmUG475 ↗ · package
Package terminals / leads (vendor count)Unconfirmed data144 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. EQFP144 leads; exposed ground pad is separately documented and not added to this count.

Not confirmed
Speed gradeDifferent-8LCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

-1XMP101 ↗ · MPN
Conditions

Speed grade is not a single guaranteed application clock frequency.

Junction temperature (Tj)Different-40 to +100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

0 to +85 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature.

Temperature gradeDifferentICYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Industrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Commercial (C)XMP101 ↗ · MPN
Core voltage conditionsUnconfirmed data0.97-1.03 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.0-V operation row and note 1 (I8L)
Conditions

Nominal 1.00 V internal-logic supply for grade I8L. L suffix low-voltage device; C8L/C9L/I8L supported at 1.0 V.

Not confirmed
Conditions

Consult the family DC/AC data sheet for the applicable operating conditions.

Maximum application clockUnconfirmed dataNot confirmed
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Not confirmed
Conditions

Depends on the implemented design, timing constraints and speed grade.

Application powerUnconfirmed dataNot confirmed
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Not confirmed
Conditions

Requires design-specific power estimation and thermal analysis.

Minimum junction temperatureDifferent-40 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

0 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Maximum junction temperatureDifferent100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

85 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Temperature referenceSameTjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

TjXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Conditional temperature operationUnconfirmed dataNot confirmedNot confirmed
Minimum core voltageUnconfirmed data0.97 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.0-V operation row and note 1 (I8L)
Conditions

Grade I8L, 1.0-V operation.

Not confirmed
Nominal core voltageUnconfirmed data1 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.0-V operation row and note 1 (I8L)
Conditions

Grade I8L, 1.0-V operation.

Not confirmed
Maximum core voltageUnconfirmed data1.03 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.0-V operation row and note 1 (I8L)
Conditions

Grade I8L, 1.0-V operation.

Not confirmed
Current lifecycleUnconfirmed dataNot confirmed
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Not confirmed
Conditions

Confirm the current manufacturer lifecycle at quotation.

Available stockUnconfirmed dataNot confirmed
Conditions

No stock observation; manufacturer order code is not inventory availability.

Not confirmed
Conditions

Stock, lot traceability and delivery are confirmed during quotation.

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.