SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | EP4CE10F17C8Cyclone IV E | XC7A100T-1CSG324CArtix-7 |
|---|---|---|
| Logic cellsUnconfirmed data | Not confirmedConditionsAltera LE count is logic_elements; no conversion to AMD logic cells. | 101440 logic cellsDS180 ↗ · deviceConditionsVendor logic-cell metric; not equivalent to another architecture's ALM count. |
| 6-input LUTsUnconfirmed data | Not confirmedConditionsCyclone IV uses four-input LUT LEs; no LUT6 equivalence. | 63400 LUT6DS180 ↗ · derivedConditions15,850 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture. |
| Block RAM capacityDifferent | 414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) rowConditionsOfficial embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes. | 4860 KbDS180 ↗ · deviceConditionsAMD source unit retained: Kb is kilobits, not kilobytes. |
| 36 Kb block RAM blocksUnconfirmed data | Not confirmedConditionsExisting field means 36 Kb blocks; M9K count is separate in | 135 blocksDS180 ↗ · deviceConditionsEach block is nominally 36 Kb. |
| DSP slicesUnconfirmed data | Not confirmedConditionsExisting field means DSP slices. Native 18 x 18 embedded multipliers are separate. | 240 DSP48E1DS180 ↗ · deviceConditionsCompare with the same DSP architecture; slice counts across vendors are not equivalent. |
| Altera logic elementsUnconfirmed data | 10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core FabricConditionsNative Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells. | Not confirmed |
| Altera embedded 18 × 18 multipliersUnconfirmed data | 23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core FabricConditionsOne 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices. | Not confirmed |
| Altera M9K blocksUnconfirmed data | 46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core FabricConditionsOfficial embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity. | Not confirmed |
| User I/O in this packageDifferent | 179 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; User I/O columnConditionsUser I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1. | 210 I/OXMP101 ↗ · packageConditionsValue belongs to this device/package combination. |
| Serial transceivers in this packageDifferent resource definitions | 0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3ConditionsHigh-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels. | 0 GTPXMP101 ↗ · packageConditionsNo GTP channels exposed in this selected device/package combination. |
| Package codeDifferent | F17CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsFineLine BGA (FBGA); package-matrix code F256. | CSG324XMP101 ↗ · MPN |
| Package ball countDifferent | 256 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsActual BGA terminal count. | 324 ballsUG475 ↗ · package |
| Package bodyDifferent | 17 x 17 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Size (mm) rowConditionsBGA package size from manufacturer matrix. | 15 × 15 mmUG475 ↗ · package |
| Ball pitchDifferent | 1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Pitch (mm) rowConditionsBall pitch; source package-matrix pitch. | 0.8 mmUG475 ↗ · package |
| Package terminals / leads (vendor count)Unconfirmed data | 256 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsManufacturer package pin count. BGA package: pin positions are physical balls. | Not confirmed |
| Speed gradeDifferent | -8CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsSource speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax. | -1XMP101 ↗ · MPNConditionsSpeed grade is not a single guaranteed application clock frequency. |
| Junction temperature (Tj)Same | 0 to +85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 0 to +85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. |
| Temperature gradeDifferent | CCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsCommercial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately. | Commercial (C)XMP101 ↗ · MPN |
| Core voltage conditionsUnconfirmed data | 1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsNominal 1.20 V internal-logic supply for grade C8. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V. | Not confirmedConditionsConsult the family DC/AC data sheet for the applicable operating conditions. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsApplication-specific timing not reviewed. Use implementation constraints and timing analysis. | Not confirmedConditionsDepends on the implemented design, timing constraints and speed grade. |
| Application powerUnconfirmed data | Not confirmedConditionsDesign activity, voltage and temperature dependent; no single device power asserted. | Not confirmedConditionsRequires design-specific power estimation and thermal analysis. |
| Minimum junction temperatureSame | 0 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 0 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Maximum junction temperatureSame | 85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 85 °CXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Temperature referenceSame | TjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsTJ, not TA. | TjXMP101 ↗ · gradeConditionsCommercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Conditional temperature operationUnconfirmed data | Not confirmed | Not confirmed |
| Minimum core voltageUnconfirmed data | 1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Nominal core voltageUnconfirmed data | 1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Maximum core voltageUnconfirmed data | 1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsExact-MPN ordering-table presence does not establish lifecycle status. | Not confirmedConditionsConfirm the current manufacturer lifecycle at quotation. |
| Available stockUnconfirmed data | Not confirmedConditionsNo stock observation; manufacturer order code is not inventory availability. | Not confirmedConditionsStock, lot traceability and delivery are confirmed during quotation. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.