FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems

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Review resource differences, package constraints and the fields that still need confirmation.

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Showing up to 40 search results plus your selected devices. Search the full catalogue above to find another MPN.

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Parameter / statusEP4CE10F17C8Cyclone IV EXC7A100T-1CSG324CArtix-7
Logic cellsUnconfirmed dataNot confirmed
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

101440 logic cellsDS180 ↗ · device
Conditions

Vendor logic-cell metric; not equivalent to another architecture's ALM count.

6-input LUTsUnconfirmed dataNot confirmed
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

63400 LUT6DS180 ↗ · derived
Conditions

15,850 slices × 4 LUT6 per slice. Derived from the device table and 7-series architecture.

Block RAM capacityDifferent414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

4860 KbDS180 ↗ · device
Conditions

AMD source unit retained: Kb is kilobits, not kilobytes.

36 Kb block RAM blocksUnconfirmed dataNot confirmed
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

135 blocksDS180 ↗ · device
Conditions

Each block is nominally 36 Kb.

DSP slicesUnconfirmed dataNot confirmed
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

240 DSP48E1DS180 ↗ · device
Conditions

Compare with the same DSP architecture; slice counts across vendors are not equivalent.

Altera logic elementsUnconfirmed data10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Not confirmed
Altera embedded 18 × 18 multipliersUnconfirmed data23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Not confirmed
Altera M9K blocksUnconfirmed data46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Not confirmed
User I/O in this packageDifferent179 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

210 I/OXMP101 ↗ · package
Conditions

Value belongs to this device/package combination.

Serial transceivers in this packageDifferent resource definitions0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

0 GTPXMP101 ↗ · package
Conditions

No GTP channels exposed in this selected device/package combination.

Package codeDifferentF17CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

FineLine BGA (FBGA); package-matrix code F256.

CSG324XMP101 ↗ · MPN
Package ball countDifferent256 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Actual BGA terminal count.

324 ballsUG475 ↗ · package
Package bodyDifferent17 x 17 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Size (mm) row
Conditions

BGA package size from manufacturer matrix.

15 × 15 mmUG475 ↗ · package
Ball pitchDifferent1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Pitch (mm) row
Conditions

Ball pitch; source package-matrix pitch.

0.8 mmUG475 ↗ · package
Package terminals / leads (vendor count)Unconfirmed data256 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. BGA package: pin positions are physical balls.

Not confirmed
Speed gradeDifferent-8CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

-1XMP101 ↗ · MPN
Conditions

Speed grade is not a single guaranteed application clock frequency.

Junction temperature (Tj)Same0 to +85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 to +85 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature.

Temperature gradeDifferentCCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Commercial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Commercial (C)XMP101 ↗ · MPN
Core voltage conditionsUnconfirmed data1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Nominal 1.20 V internal-logic supply for grade C8. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V.

Not confirmed
Conditions

Consult the family DC/AC data sheet for the applicable operating conditions.

Maximum application clockUnconfirmed dataNot confirmed
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Not confirmed
Conditions

Depends on the implemented design, timing constraints and speed grade.

Application powerUnconfirmed dataNot confirmed
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Not confirmed
Conditions

Requires design-specific power estimation and thermal analysis.

Minimum junction temperatureSame0 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Maximum junction temperatureSame85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

85 °CXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Temperature referenceSameTjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

TjXMP101 ↗ · grade
Conditions

Commercial junction-temperature range; do not treat this as ambient temperature. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Conditional temperature operationUnconfirmed dataNot confirmedNot confirmed
Minimum core voltageUnconfirmed data1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Nominal core voltageUnconfirmed data1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Maximum core voltageUnconfirmed data1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Current lifecycleUnconfirmed dataNot confirmed
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Not confirmed
Conditions

Confirm the current manufacturer lifecycle at quotation.

Available stockUnconfirmed dataNot confirmed
Conditions

No stock observation; manufacturer order code is not inventory availability.

Not confirmed
Conditions

Stock, lot traceability and delivery are confirmed during quotation.

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.