StarPower / 斯达半导体 / TECHNICAL REFERENCE
GD75HFY120C1S
Packaged half-bridge IGBT power module; not a bare chip.
FPGA.io Part Number FIO-D84D975F6325A8D2Internal catalogue reference · manufacturer MPN remains unchanged
Technical reference · Packaged semiconductor power module · Checked 2026-09-28
DOCUMENTED FACTS
Technical parameters
Values apply to the device and conditions identified in each source. Family maxima, package limits and full ordering-code specifications must not be treated as interchangeable.
| Parameter | Documented value | Source & conditions |
|---|---|---|
| Voltage class | 1200 V | GD75HFY120C1S product page ↗Technical specifications |
| Current class | 75 A | GD75HFY120C1S product page ↗Technical specifications |
| Topology | Half bridge | GD75HFY120C1S product page ↗Technical specifications |
| Package | C1 | GD75HFY120C1S product page ↗Technical specifications |
Official documents
GD75HFY120C1S product pageTechnical specificationsWeb ↗Ordering and board constraints
This reference identifies a packaged power module. Confirm the exact module identifier, terminal connections, isolation, cooling and mounting requirements before integration.
- Verify the module datasheet, isolated baseplate, mounting, gate-drive and cooling requirements before design-in.
- Confirm current availability and lifecycle for the complete code before procurement.
- Review pinout, electrical conditions and the exact document revision before PCB release.
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COMPLETE PART IDENTITIES
Ordering numbers for GD75HFY120C1S
These references belong to this device. Evidence labels distinguish reviewed specifications, public listings and manufacturer coding examples. Counts describe this site’s documented coverage, not stock or all configurations offered by the manufacturer.
Exact ordering code requires confirmation
The cited public material did not establish a literal complete ordering row in this pass. This is an evidence limit, not a claim that no code exists. The existing device identity is retained; no suffix combinations, neighboring chips, boards or systems are substituted.
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