SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | XC7K160T-3FBV484EKintex-7 | XC7K355T-2FFG901CKintex-7 |
|---|---|---|
| Logic cellsDifferent | 162240 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. | 356160 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K355T row; Logic Cells columnConditionsVendor metric; not comparable to another architecture's ALMs. |
| 6-input LUTsDifferent | 101400 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K160T row; note 1; p. 7 CLBs, Slices, and LUTsConditions25350 slices x 4 LUT6 per slice. | 222600 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K355T row; note 1; p. 7 CLBs, Slices, and LUTsConditions55650 slices x 4 LUT6 per slice. |
| Block RAM capacityDifferent | 11700 KbDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. | 25740 KbDS180 ↗ · devicep. 4, Table 6, XC7K355T row; Block RAM Max (Kb) columnConditionsSource unit retained: Kb means kilobits, not kilobytes. |
| 36 Kb block RAM blocksDifferent | 325 blocksDS180 ↗ · devicep. 4, Table 6, XC7K160T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. | 715 blocksDS180 ↗ · devicep. 4, Table 6, XC7K355T row; Block RAM 36 Kb column; note 3ConditionsEach fundamental block is 36 Kb; may be configured as two 18 Kb blocks. |
| DSP slicesDifferent | 600 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K160T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. | 1440 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K355T row; DSP Slices column; note 2ConditionsDSP48E1 architecture; counts must not be treated as cross-vendor equivalent. |
| User I/O in this packageDifferent | 285 I/OUG475 ↗ · device-packagep. 18, Table 1-9, XC7K160T row, FBG484/FBV484 shared columnConditions185 HR + 100 HP = 285; transceiver channels are separate. | 300 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K355T row, FFG901 columnsConditionsPackage-specific user I/O. HR + HP; excludes GT serial channels. |
| Serial transceivers in this packageDifferent resource definitions | 4 GTX channelsUG475 ↗ · device-packagep. 13, Table 1-4, XC7K160T row, FBG484/FBV484 shared columnConditionsChannels bonded out in this exact device/package; a blank or dash is never read as zero. | 24 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K355T row, FFG901 columns; GTX columnConditionsNumber of channels exposed in this selected device/package; not device-family maximum. |
| Package codeDifferent | FBV484UG475 ↗ · packagep. 276, Figure 4-22, shared FBG484/FBV484 drawing, titleConditionsExact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package. | FFG901UG475 ↗ · packagep. 289, Figure 4-35 titleConditionsExact package token; does not establish any full orderable MPN. |
| Package ball countDifferent | 484 ballsUG475 ↗ · packagep. 276, Figure 4-22, shared FBG484/FBV484 drawing; full 22 x 22 bottom-view matrix; M cell says 26 and is not usedConditionsfull 22 x 22 bottom-view matrix; M cell says 26 and is not used | 900 ballsUG475 ↗ · packagep. 289, Figure 4-35; note 4: actual solder ball count = 900ConditionsOfficial mechanical note gives 900 actual solder balls; 901 is the package designator, not the ball count. |
| Package bodyDifferent | 23 x 23 mmUG475 ↗ · packagep. 276, Figure 4-22, shared FBG484/FBV484 drawing, D/E dimensionsConditionsPackage body width x length, not die dimensions, height or PCB keep-out. | 31 x 31 mmUG475 ↗ · packagep. 11, Table 1-1; p. 289, Figure 4-35, D/E dimensionsConditionsPackage body width x length; excludes PCB keep-out and component height. |
| Ball pitchSame | 1 mmUG475 ↗ · packagep. 276, Figure 4-22, shared FBG484/FBV484 drawing, e dimensionConditionsBall-to-ball pitch. | 1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 289, Figure 4-35, e dimensionConditionsBall-to-ball pitch. |
| Package terminals / leads (vendor count)Unconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Speed gradeDifferent | -3DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -3 in the literal MPN. Datasheet grade is -3. This is not a single application clock limit. | -2DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legendConditionsRetain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit. |
| Junction temperature (Tj)Different | 0 to +100 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. | 0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. |
| Temperature gradeDifferent | Extended (E)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row | Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row |
| Core voltage conditionsUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmedConditionsNot verified in this review. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsDepends on the application, implementation and operating conditions. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Application powerUnconfirmed data | Not confirmedConditionsDepends on the application, implementation and operating conditions. | Not confirmedConditionsDepends on the application, implementation and operating conditions. |
| Minimum junction temperatureSame | 0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row | 0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Maximum junction temperatureDifferent | 100 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) row | 85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Temperature referenceSame | TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Extended (E) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. | TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) rowConditionsJunction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement. |
| Conditional temperature operationUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Minimum core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Nominal core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Maximum core voltageUnconfirmed data | Not confirmedConditionsNot verified in this bounded review. | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsThis exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source. | Not confirmedConditionsNot verified in this review. |
| Available stockUnconfirmed data | Not confirmedConditionsNo inventory, stock, price or lead-time evidence was reviewed. | Not confirmedConditionsNot verified in this review. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.