SIDE-BY-SIDE REVIEW

Compare FPGA devices

Review resource differences, package constraints and the fields that still need confirmation.

Select devices (2–4)

Parameter / status	XC7A200T-2FBV676IArtix-7	XC7A200T-1FBG484IArtix-7
Logic cellsSame	215360 logic cellsDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.	215360 logic cellsDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Logic Cells column Conditions Vendor metric; not comparable to another architecture's ALMs.
6-input LUTsSame	134600 LUT6DS180 ↗ · derivedp. 3, Table 4, XC7A200T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 33650 slices x 4 LUT6 per slice.	134600 LUT6DS180 ↗ · derivedp. 3, Table 4, XC7A200T row; note 1; p. 7 CLBs, Slices, and LUTs Conditions 33650 slices x 4 LUT6 per slice.
Block RAM capacitySame	13140 KbDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.	13140 KbDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM Max (Kb) column Conditions Source unit retained: Kb means kilobits, not kilobytes.
36 Kb block RAM blocksSame	365 blocksDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.	365 blocksDS180 ↗ · devicep. 3, Table 4, XC7A200T row; Block RAM 36 Kb column; note 3 Conditions Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.
DSP slicesSame	740 DSP48E1DS180 ↗ · devicep. 3, Table 4, XC7A200T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.	740 DSP48E1DS180 ↗ · devicep. 3, Table 4, XC7A200T row; DSP Slices column; note 2 Conditions DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.
User I/O in this packageDifferent	400 I/OUG475 ↗ · device-packagep. 16, Table 1-8, XC7A200T row, FBG676/FBV676 shared column Conditions HR user I/O only; excludes serial transceiver channels.	285 I/ODS180 ↗ · device-packagep. 3, Table 5, XC7A200T row, FBG484 columns Conditions Package-specific user I/O. HR I/O; excludes serial transceiver channels.
Serial transceivers in this packageDifferent resource definitions	8 GTP channelsUG475 ↗ · device-packagep. 12, Table 1-3, XC7A200T row, FBG676/FBV676 shared column Conditions Channels bonded out in this exact device/package; a blank or dash is never read as zero.	4 GTPDS180 ↗ · device-packagep. 3, Table 5, XC7A200T row, FBG484 columns; GTP column Conditions Number of channels exposed in this selected device/package; not device-family maximum.
Package codeDifferent	FBV676UG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, title Conditions Exact V-package token printed in the shared drawing and historical MPN; not renamed to its replacement package.	FBG484UG475 ↗ · packagep. 266, Figure 4-12 title Conditions Exact package token; does not establish any full orderable MPN.
Package ball countDifferent	676 ballsUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing; full 26 x 26 bottom-view matrix Conditions full 26 x 26 bottom-view matrix	484 ballsUG475 ↗ · packagep. 266, Figure 4-12; full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22 Conditions full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22
Package bodyDifferent	27 x 27 mmUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, D/E dimensions Conditions Package body width x length, not die dimensions, height or PCB keep-out.	23 x 23 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions Conditions Package body width x length; excludes PCB keep-out and component height.
Ball pitchSame	1 mmUG475 ↗ · packagep. 268, Figure 4-14, shared FBG676/FBV676 drawing, e dimension Conditions Ball-to-ball pitch.	1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, e dimension Conditions Ball-to-ball pitch.
Package terminals / leads (vendor count)Unconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed
Speed gradeDifferent	-2DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend Conditions Retain original ordering code -2 in the literal MPN. Datasheet grade is -2. This is not a single application clock limit.	-1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend Conditions Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.
Junction temperature (Tj)Same	-40 to +100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.	-40 to +100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.
Temperature gradeSame	Industrial (I)DS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	Industrial (I)DS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row
Core voltage conditionsUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed Conditions Not verified in this review.
Maximum application clockUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Application powerUnconfirmed data	Not confirmed Conditions Depends on the application, implementation and operating conditions.	Not confirmed Conditions Depends on the application, implementation and operating conditions.
Minimum junction temperatureSame	-40 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	-40 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Maximum junction temperatureSame	100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row	100 °CDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Temperature referenceSame	TjDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.	TjDS181 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Industrial (I) row Conditions Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.
Conditional temperature operationUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed
Minimum core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed
Nominal core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed
Maximum core voltageUnconfirmed data	Not confirmed Conditions Not verified in this bounded review.	Not confirmed
Current lifecycleUnconfirmed data	Not confirmed Conditions This exact V-package MPN is listed in XCN20011 as an affected discontinued product. The current lifecycle field is not refreshed from a current source.	Not confirmed Conditions Not verified in this review.
Available stockUnconfirmed data	Not confirmed Conditions No inventory, stock, price or lead-time evidence was reviewed.	Not confirmed Conditions Not verified in this review.

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.