FPGA COMPONENTS & BOARD MANUFACTURING For research, development & industrial systems

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Parameter / statusEP4CE10F17C8Cyclone IV EXC7K70T-1FBG484CKintex-7
Logic cellsUnconfirmed dataNot confirmed
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

65600 logic cellsDS180 ↗ · devicep. 4, Table 6, XC7K70T row; Logic Cells column
Conditions

Vendor metric; not comparable to another architecture's ALMs.

6-input LUTsUnconfirmed dataNot confirmed
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

41000 LUT6DS180 ↗ · derivedp. 4, Table 6, XC7K70T row; note 1; p. 7 CLBs, Slices, and LUTs
Conditions

10250 slices x 4 LUT6 per slice.

Block RAM capacityDifferent414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

4860 KbDS180 ↗ · devicep. 4, Table 6, XC7K70T row; Block RAM Max (Kb) column
Conditions

Source unit retained: Kb means kilobits, not kilobytes.

36 Kb block RAM blocksUnconfirmed dataNot confirmed
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

135 blocksDS180 ↗ · devicep. 4, Table 6, XC7K70T row; Block RAM 36 Kb column; note 3
Conditions

Each fundamental block is 36 Kb; may be configured as two 18 Kb blocks.

DSP slicesUnconfirmed dataNot confirmed
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

240 DSP48E1DS180 ↗ · devicep. 4, Table 6, XC7K70T row; DSP Slices column; note 2
Conditions

DSP48E1 architecture; counts must not be treated as cross-vendor equivalent.

Altera logic elementsUnconfirmed data10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Not confirmed
Altera embedded 18 × 18 multipliersUnconfirmed data23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Not confirmed
Altera M9K blocksUnconfirmed data46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Not confirmed
User I/O in this packageDifferent179 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

285 I/ODS180 ↗ · device-packagep. 4, Table 7, XC7K70T row, FBG484 columns
Conditions

Package-specific user I/O. HR + HP; excludes GT serial channels.

Serial transceivers in this packageDifferent resource definitions0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

4 GTXDS180 ↗ · device-packagep. 4, Table 7, XC7K70T row, FBG484 columns; GTX column
Conditions

Number of channels exposed in this selected device/package; not device-family maximum.

Package codeDifferentF17CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

FineLine BGA (FBGA); package-matrix code F256.

FBG484UG475 ↗ · packagep. 266, Figure 4-12 title
Conditions

Exact package token; does not establish any full orderable MPN.

Package ball countDifferent256 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Actual BGA terminal count.

484 ballsUG475 ↗ · packagep. 266, Figure 4-12; full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22
Conditions

full 22 x 22 bottom-view matrix; Kintex equivalent p. 276 Figure 4-22

Package bodyDifferent17 x 17 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Size (mm) row
Conditions

BGA package size from manufacturer matrix.

23 x 23 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, D/E dimensions
Conditions

Package body width x length; excludes PCB keep-out and component height.

Ball pitchSame1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Pitch (mm) row
Conditions

Ball pitch; source package-matrix pitch.

1 mmUG475 ↗ · packagep. 11, Table 1-1; p. 266, Figure 4-12, e dimension
Conditions

Ball-to-ball pitch.

Package terminals / leads (vendor count)Unconfirmed data256 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. BGA package: pin positions are physical balls.

Not confirmed
Speed gradeDifferent-8CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

-1DS180 ↗ · MPNp. 16, Figure 2; Speed Grade legend
Conditions

Retain original ordering code -1 in the literal MPN. Datasheet grade is -1. This is not a single application clock limit.

Junction temperature (Tj)Same0 to +85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 to +85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Conditions

Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available.

Temperature gradeDifferentCCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Commercial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Commercial (C)DS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Core voltage conditionsUnconfirmed data1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Nominal 1.20 V internal-logic supply for grade C8. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V.

Not confirmed
Conditions

Not verified in this review.

Maximum application clockUnconfirmed dataNot confirmed
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Not confirmed
Conditions

Depends on the application, implementation and operating conditions.

Application powerUnconfirmed dataNot confirmed
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Not confirmed
Conditions

Depends on the application, implementation and operating conditions.

Minimum junction temperatureSame0 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Conditions

Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Maximum junction temperatureSame85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

85 °CDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Conditions

Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Temperature referenceSameTjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

TjDS182 ↗ · gradep. 3, Table 2 Recommended Operating Conditions (continued); Tj Commercial (C) row
Conditions

Junction temperature Tj, not ambient temperature. Apply only to a literal MPN with the corresponding grade; not a claim all grades are available. Expressed from the same reviewed junction-temperature range; not an additional measurement.

Conditional temperature operationUnconfirmed dataNot confirmedNot confirmed
Minimum core voltageUnconfirmed data1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Nominal core voltageUnconfirmed data1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Maximum core voltageUnconfirmed data1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Current lifecycleUnconfirmed dataNot confirmed
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Not confirmed
Conditions

Not verified in this review.

Available stockUnconfirmed dataNot confirmed
Conditions

No stock observation; manufacturer order code is not inventory availability.

Not confirmed
Conditions

Not verified in this review.

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.