SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | EP4CE10F17C8Cyclone IV E | LFE5U-25F-6BG256CECP5 |
|---|---|---|
| Logic cellsUnconfirmed data | Not confirmedConditionsAltera LE count is logic_elements; no conversion to AMD logic cells. | Not confirmedConditionsNo architecture-neutral logic-cell count is established. The vendor's nominal LUT4 quantity is retained with its precision and source in lut4_nominal, not converted into AMD logic cells. |
| 6-input LUTsUnconfirmed data | Not confirmedConditionsCyclone IV uses four-input LUT LEs; no LUT6 equivalence. | Not confirmedConditionsECP5 uses LUT4 primitives. Wider logic functions can combine LUT4s, but that is not a source-defined native LUT6 count. |
| Block RAM capacityDifferent | 414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) rowConditionsOfficial embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes. | 1008 KbLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, Embedded Memory (kb) rowConditionsSource reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb. |
| 36 Kb block RAM blocksUnconfirmed data | Not confirmedConditionsExisting field means 36 Kb blocks; M9K count is separate in | Not confirmedConditionsThe generic field means 36 Kb blocks. ECP5 sysMEM EBR blocks are 18 Kb; sysmem_18kb_blocks retains their physical granularity. No artificial 36 Kb block count is supplied. |
| DSP slicesUnconfirmed data | Not confirmedConditionsExisting field means DSP slices. Native 18 x 18 embedded multipliers are separate. | Not confirmedConditionsThe generic application field denotes DSP slices. The directly printed native count is 18 x 18 multipliers, retained in embedded_18x18_multipliers; separately derived sysDSP slice/block counts retain their own native definitions. |
| Altera logic elementsUnconfirmed data | 10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core FabricConditionsNative Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells. | Not confirmed |
| Lattice LUT4s (nominal)Unconfirmed data | Not confirmed | 24000 LUT4 (nominal)LATTICE_ECP5_DS_02012_3_4 ↗ · derivedp. 12, Table 1.1, LFE5U-25 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1ConditionsManufacturer reports 24 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 25F as the count. |
| Altera embedded 18 × 18 multipliersUnconfirmed data | 23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core FabricConditionsOne 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices. | Not confirmed |
| Lattice 18 × 18 multipliersUnconfirmed data | Not confirmed | 28 18 x 18 multipliersLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7ConditionsDirectly printed multiplier count. One sysDSP slice supports two 18 x 18 multipliers (or four 9 x 9); one physical sysDSP block contains two slices (TN-02205-1.3 p. 6). This number is not a DSP-slice/block count and is not equivalent to AMD DSP48E1. |
| Altera M9K blocksUnconfirmed data | 46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core FabricConditionsOfficial embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity. | Not confirmed |
| Lattice 18 Kb sysMEM blocksUnconfirmed data | Not confirmed | 56 18 Kb sysMEM EBR blocksLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, sysMEM Blocks (18 kb) rowConditionsNative block granularity; keep separate from app's 36 Kb block field. |
| Lattice sysDSP slicesUnconfirmed data | Not confirmed | 14 sysDSP slicesLATTICE_ECP5_DS_02012_3_4 ↗ · derivedp. 12, Table 1.1, LFE5U-25 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7ConditionsDerived as multiplier count / 2. A slice has two 18 x 18 multipliers; this is distinct from logic/PFU slices. |
| Lattice sysDSP blocksUnconfirmed data | Not confirmed | 7 sysDSP blocksLATTICE_ECP5_DSP_TN_02205_1_3 ↗ · derivedp. 6, section 2 and Figure 2.1; count input from DS-02012-3.4 p. 12 Table 1.1ConditionsDerived as DS-02012 multiplier count / 4: two 18-bit multipliers per slice, two slices per block. A DSP block is not a DSP slice. |
| Lattice distributed RAMUnconfirmed data | Not confirmed | 194 KbLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, Distributed RAM Bits (kb) rowConditionsSeparate from EBR capacity; do not add to bram without changing that field's definition. |
| User I/O in this packageDifferent | 179 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; User I/O columnConditionsUser I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1. | 197 I/OLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 98, section 4.3.2 LFE5U, LFE5U-25 / 256 caBGA column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13ConditionsPackage-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals. |
| Serial transceivers in this packageDifferent resource definitions | 0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3ConditionsHigh-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels. | 0 SerDes channelsLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 12, Table 1.1, LFE5U-25 column / 256 caBGA package rowConditionsThe package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels. |
| Package codeDifferent | F17CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsFineLine BGA (FBGA); package-matrix code F256. | BG256LATTICE_ECP5_DS_02012_3_4 ↗ · MPN-packagep. 99 section 5.1 package legend; p. 100, section 5.2.1 Commercial, table data row 16 on this page, Part number columnConditionsBG256 is explicitly defined as 256-ball lead-free caBGA. The full MPN is independently established by the literal ordering row. |
| Package ball countSame | 256 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsActual BGA terminal count. | 256 ballsLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 98, section 4.3.2 LFE5U, LFE5U-25 / 256 caBGA column, Total Balls row; p. 100, section 5.2.1 Commercial, table data row 16 on this page, Pins and Package columnsConditionsActual ball count explicitly printed in the pin-summary table and selected literal ordering row, independently checked against the package-drawing title; not inferred from suffix digits. |
| Package bodyDifferent | 17 x 17 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Size (mm) rowConditionsBGA package size from manufacturer matrix. | 14 x 14 mmLATTICE_PACKAGE_DS_02053_8_8 ↗ · packagep. 99, section 94, 256-Ball caBGA drawing, D/E dimensionConditionsPackage body width x length, basic dimension (BSC), not PCB footprint/keep-out or height. Cross-checked against DS-02012 Table 1.1. |
| Ball pitchDifferent | 1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Pitch (mm) rowConditionsBall pitch; source package-matrix pitch. | 0.8 mmLATTICE_PACKAGE_DS_02053_8_8 ↗ · packagep. 99, section 94, 256-Ball caBGA drawing, e dimensionConditionsNominal ball-to-ball pitch (BSC). Depopulated ball arrays still have this underlying pitch. |
| Package terminals / leads (vendor count)Unconfirmed data | 256 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsManufacturer package pin count. BGA package: pin positions are physical balls. | Not confirmed |
| Speed gradeDifferent | -8CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsSource speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax. | -6LATTICE_ECP5_DS_02012_3_4 ↗ · MPNp. 100, section 5.2.1 Commercial, table data row 16 on this page, Grade column; p. 99 section 5.1 Speed legendConditionsLiteral ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8. |
| Junction temperature (Tj)Same | 0 to +85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 0 to +85 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation rowConditionsRecommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating. |
| Temperature gradeDifferent | CCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsCommercial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately. | Commercial (C)LATTICE_ECP5_DS_02012_3_4 ↗ · MPNp. 100, section 5.2.1 Commercial, table data row 16 on this page, Temp. column; p. 99 section 5.1 Grade legendConditionsThe grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range. |
| Core voltage conditionsDifferent | 1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsNominal 1.20 V internal-logic supply for grade C8. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V. | 1.045 to 1.155 VLATTICE_ECP5_DS_02012_3_4 ↗ · device-familyp. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columnsConditionsLattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsApplication-specific timing not reviewed. Use implementation constraints and timing analysis. | Not confirmedConditionsApplication fMAX depends on implementation, path, loading, speed grade and operating conditions. No single application clock is established by the speed grade or PLL limit. |
| Application powerUnconfirmed data | Not confirmedConditionsDesign activity, voltage and temperature dependent; no single device power asserted. | Not confirmedConditionsApplication power depends on design activity, resources, I/O, voltage and temperature; not determined from marketing/typical static-current figures. |
| Minimum junction temperatureSame | 0 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 0 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row, Min columnConditionsRecommended operating junction-temperature minimum. |
| Maximum junction temperatureSame | 85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsCommercial recommended operating junction-temperature range (TJ), not ambient temperature. | 85 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row, Max columnConditionsRecommended operating junction-temperature maximum. |
| Temperature referenceSame | TjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsTJ, not TA. | TjLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation rowConditionsTj is explicitly stated by the manufacturer; no ambient range is established. |
| Conditional temperature operationUnconfirmed data | Not confirmed | Not confirmed |
| Minimum core voltageUnconfirmed data | 1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Nominal core voltageUnconfirmed data | 1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Maximum core voltageUnconfirmed data | 1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)ConditionsGrade C8, 1.2-V operation. | Not confirmed |
| Current lifecycleUnconfirmed data | Not confirmedConditionsExact-MPN ordering-table presence does not establish lifecycle status. | Not confirmedConditionsNo current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement. |
| Available stockUnconfirmed data | Not confirmedConditionsNo stock observation; manufacturer order code is not inventory availability. | Not confirmedConditionsNo current stock/inventory evidence was obtained. The official ordering-table entry does not establish availability. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.