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Parameter / statusEP4CE10F17C8Cyclone IV ELFE5U-25F-6BG256CECP5
Logic cellsUnconfirmed dataNot confirmed
Conditions

Altera LE count is logic_elements; no conversion to AMD logic cells.

Not confirmed
Conditions

No architecture-neutral logic-cell count is established. The vendor's nominal LUT4 quantity is retained with its precision and source in lut4_nominal, not converted into AMD logic cells.

6-input LUTsUnconfirmed dataNot confirmed
Conditions

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

Not confirmed
Conditions

ECP5 uses LUT4 primitives. Wider logic functions can combine LUT4s, but that is not a source-defined native LUT6 count.

Block RAM capacityDifferent414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) row
Conditions

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

1008 KbLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, Embedded Memory (kb) row
Conditions

Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.

36 Kb block RAM blocksUnconfirmed dataNot confirmed
Conditions

Existing field means 36 Kb blocks; M9K count is separate in

Not confirmed
Conditions

The generic field means 36 Kb blocks. ECP5 sysMEM EBR blocks are 18 Kb; sysmem_18kb_blocks retains their physical granularity. No artificial 36 Kb block count is supplied.

DSP slicesUnconfirmed dataNot confirmed
Conditions

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

Not confirmed
Conditions

The generic application field denotes DSP slices. The directly printed native count is 18 x 18 multipliers, retained in embedded_18x18_multipliers; separately derived sysDSP slice/block counts retain their own native definitions.

Altera logic elementsUnconfirmed data10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core Fabric
Conditions

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Not confirmed
Lattice LUT4s (nominal)Unconfirmed dataNot confirmed24000 LUT4 (nominal)LATTICE_ECP5_DS_02012_3_4 ↗ · derivedp. 12, Table 1.1, LFE5U-25 device column, LUTs (k) row; p. 16 section 2.2.1 and Table 2.1
Conditions

Manufacturer reports 24 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 25F as the count.

Altera embedded 18 × 18 multipliersUnconfirmed data23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core Fabric
Conditions

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Not confirmed
Lattice 18 × 18 multipliersUnconfirmed dataNot confirmed28 18 x 18 multipliersLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7
Conditions

Directly printed multiplier count. One sysDSP slice supports two 18 x 18 multipliers (or four 9 x 9); one physical sysDSP block contains two slices (TN-02205-1.3 p. 6). This number is not a DSP-slice/block count and is not equivalent to AMD DSP48E1.

Altera M9K blocksUnconfirmed data46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core Fabric
Conditions

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Not confirmed
Lattice 18 Kb sysMEM blocksUnconfirmed dataNot confirmed56 18 Kb sysMEM EBR blocksLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, sysMEM Blocks (18 kb) row
Conditions

Native block granularity; keep separate from app's 36 Kb block field.

Lattice sysDSP slicesUnconfirmed dataNot confirmed14 sysDSP slicesLATTICE_ECP5_DS_02012_3_4 ↗ · derivedp. 12, Table 1.1, LFE5U-25 device column, 18 x 18 Multipliers row; p. 29 section 2.9.2; p. 33 Table 2.7
Conditions

Derived as multiplier count / 2. A slice has two 18 x 18 multipliers; this is distinct from logic/PFU slices.

Lattice sysDSP blocksUnconfirmed dataNot confirmed7 sysDSP blocksLATTICE_ECP5_DSP_TN_02205_1_3 ↗ · derivedp. 6, section 2 and Figure 2.1; count input from DS-02012-3.4 p. 12 Table 1.1
Conditions

Derived as DS-02012 multiplier count / 4: two 18-bit multipliers per slice, two slices per block. A DSP block is not a DSP slice.

Lattice distributed RAMUnconfirmed dataNot confirmed194 KbLATTICE_ECP5_DS_02012_3_4 ↗ · devicep. 12, Table 1.1, LFE5U-25 device column, Distributed RAM Bits (kb) row
Conditions

Separate from EBR capacity; do not add to bram without changing that field's definition.

User I/O in this packageDifferent179 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; User I/O column
Conditions

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

197 I/OLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 98, section 4.3.2 LFE5U, LFE5U-25 / 256 caBGA column, Total Single-Ended User I/O row; Table 1.1 pp. 12-13
Conditions

Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.

Serial transceivers in this packageDifferent resource definitions0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3
Conditions

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

0 SerDes channelsLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 12, Table 1.1, LFE5U-25 column / 256 caBGA package row
Conditions

The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.

Package codeDifferentF17CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

FineLine BGA (FBGA); package-matrix code F256.

BG256LATTICE_ECP5_DS_02012_3_4 ↗ · MPN-packagep. 99 section 5.1 package legend; p. 100, section 5.2.1 Commercial, table data row 16 on this page, Part number column
Conditions

BG256 is explicitly defined as 256-ball lead-free caBGA. The full MPN is independently established by the literal ordering row.

Package ball countSame256 ballsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Actual BGA terminal count.

256 ballsLATTICE_ECP5_DS_02012_3_4 ↗ · device-packagep. 98, section 4.3.2 LFE5U, LFE5U-25 / 256 caBGA column, Total Balls row; p. 100, section 5.2.1 Commercial, table data row 16 on this page, Pins and Package columns
Conditions

Actual ball count explicitly printed in the pin-summary table and selected literal ordering row, independently checked against the package-drawing title; not inferred from suffix digits.

Package bodyDifferent17 x 17 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Size (mm) row
Conditions

BGA package size from manufacturer matrix.

14 x 14 mmLATTICE_PACKAGE_DS_02053_8_8 ↗ · packagep. 99, section 94, 256-Ball caBGA drawing, D/E dimension
Conditions

Package body width x length, basic dimension (BSC), not PCB footprint/keep-out or height. Cross-checked against DS-02012 Table 1.1.

Ball pitchDifferent1 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, F256 columns; Pitch (mm) row
Conditions

Ball pitch; source package-matrix pitch.

0.8 mmLATTICE_PACKAGE_DS_02053_8_8 ↗ · packagep. 99, section 94, 256-Ball caBGA drawing, e dimension
Conditions

Nominal ball-to-ball pitch (BSC). Depopulated ball arrays still have this underlying pitch.

Package terminals / leads (vendor count)Unconfirmed data256 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Manufacturer package pin count. BGA package: pin positions are physical balls.

Not confirmed
Speed gradeDifferent-8CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

-6LATTICE_ECP5_DS_02012_3_4 ↗ · MPNp. 100, section 5.2.1 Commercial, table data row 16 on this page, Grade column; p. 99 section 5.1 Speed legend
Conditions

Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.

Junction temperature (Tj)Same0 to +85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 to +85 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row
Conditions

Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.

Temperature gradeDifferentCCYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering table
Conditions

Commercial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

Commercial (C)LATTICE_ECP5_DS_02012_3_4 ↗ · MPNp. 100, section 5.2.1 Commercial, table data row 16 on this page, Temp. column; p. 99 section 5.1 Grade legend
Conditions

The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.

Core voltage conditionsDifferent1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Nominal 1.20 V internal-logic supply for grade C8. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V.

1.045 to 1.155 VLATTICE_ECP5_DS_02012_3_4 ↗ · device-familyp. 51, Table 3.2, VCC Core Supply Voltage / ECP5 row, Min and Max columns
Conditions

Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.

Maximum application clockUnconfirmed dataNot confirmed
Conditions

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Not confirmed
Conditions

Application fMAX depends on implementation, path, loading, speed grade and operating conditions. No single application clock is established by the speed grade or PLL limit.

Application powerUnconfirmed dataNot confirmed
Conditions

Design activity, voltage and temperature dependent; no single device power asserted.

Not confirmed
Conditions

Application power depends on design activity, resources, I/O, voltage and temperature; not determined from marketing/typical static-current figures.

Minimum junction temperatureSame0 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

0 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row, Min column
Conditions

Recommended operating junction-temperature minimum.

Maximum junction temperatureSame85 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

Commercial recommended operating junction-temperature range (TJ), not ambient temperature.

85 °CLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row, Max column
Conditions

Recommended operating junction-temperature maximum.

Temperature referenceSameTjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For commercial use; grade mapping: standalone overview p. 12, Figure 1-3
Conditions

TJ, not TA.

TjLATTICE_ECP5_DS_02012_3_4 ↗ · gradep. 51, Table 3.2, tJCOM Junction Temperature, Commercial Operation row
Conditions

Tj is explicitly stated by the manufacturer; no ambient range is established.

Conditional temperature operationUnconfirmed dataNot confirmedNot confirmed
Minimum core voltageUnconfirmed data1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Nominal core voltageUnconfirmed data1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Maximum core voltageUnconfirmed data1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (C8)
Conditions

Grade C8, 1.2-V operation.

Not confirmed
Current lifecycleUnconfirmed dataNot confirmed
Conditions

Exact-MPN ordering-table presence does not establish lifecycle status.

Not confirmed
Conditions

No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.

Available stockUnconfirmed dataNot confirmed
Conditions

No stock observation; manufacturer order code is not inventory availability.

Not confirmed
Conditions

No current stock/inventory evidence was obtained. The official ordering-table entry does not establish availability.

Comparison is not replacement approval.

Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.