Compare FPGA devices

Altera LE count is logic_elements; no conversion to AMD logic cells.

No architecture-neutral logic-cell count is established. The vendor's nominal LUT4 quantity is retained with its precision and source in lut4_nominal, not converted into AMD logic cells.

Cyclone IV uses four-input LUT LEs; no LUT6 equivalence.

ECP5 uses LUT4 primitives. Wider logic functions can combine LUT4s, but that is not a source-defined native LUT6 count.

Official embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes.

Source reports embedded memory in kb (kilobits), excluding the separate Distributed RAM Bits row; each EBR is 18 kb.

Existing field means 36 Kb blocks; M9K count is separate in

The generic field means 36 Kb blocks. ECP5 sysMEM EBR blocks are 18 Kb; sysmem_18kb_blocks retains their physical granularity. No artificial 36 Kb block count is supplied.

Existing field means DSP slices. Native 18 x 18 embedded multipliers are separate.

The generic application field denotes DSP slices. The directly printed native count is 18 x 18 multipliers, retained in embedded_18x18_multipliers; separately derived sysDSP slice/block counts retain their own native definitions.

Native Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells.

Manufacturer reports 12 k LUTs in Table 1.1, normalized as k x 1000 for the numeric field. Native primitive is LUT4 (p. 16). This is a nominal vendor figure, not a verified exact physical LUT count or an AMD logic-cell equivalent; do not use density code 12F as the count.

One 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices.

Directly printed multiplier count. One sysDSP slice supports two 18 x 18 multipliers (or four 9 x 9); one physical sysDSP block contains two slices (TN-02205-1.3 p. 6). This number is not a DSP-slice/block count and is not equivalent to AMD DSP48E1.

Official embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity.

Native block granularity; keep separate from app's 36 Kb block field.

Derived as multiplier count / 2. A slice has two 18 x 18 multipliers; this is distinct from logic/PFU slices.

Derived as DS-02012 multiplier count / 4: two 18-bit multipliers per slice, two slices per block. A DSP block is not a DSP slice.

Separate from EBR capacity; do not add to bram without changing that field's definition.

User I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1.

Package-specific single-ended user I/O total, excluding dedicated SerDes channels. General-purpose I/O totals do not equal total package terminals.

High-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels.

The package-specific SerDes Channels/I/O Count cell gives exposed channels. Table 2.14 counts duals (two channels per dual); the pin-summary SerDes row counts pins, not channels.

Enhanced Thin Quad Flat Pack (EQFP); package-matrix code E144.

TG144 is explicitly defined as 144-pin lead-free TQFP. The full MPN is independently established by the literal ordering row.

EQFP has leads and an exposed ground pad. Use package_pins; do not call 144 leads balls.

TG144 is a leaded TQFP with 144 pins, not a BGA. Its lead count is package_pins; the generic Total Balls heading in the pin-summary table is not evidence that TQFP leads are balls.

EQFP matrix lists 22 x 22 mm Size, but molded-body versus lead-inclusive extent has not been resolved with a mechanical drawing. Body dimensions remain null.

The TG144 mechanical package drawing has not been reviewed in this enrichment. Leave body dimensions unknown even though a family selection table includes a nominal package size.

Lead pitch; source package-matrix pitch.

The TG144 mechanical package drawing has not been reviewed in this enrichment; no mechanically verified pitch is supplied.

Manufacturer package pin count. EQFP144 leads; exposed ground pad is separately documented and not added to this count.

Explicit 144-pin TQFP definition and the selected full ordering row both establish actual pin count. This is neither a user-I/O count nor a count inferred from a numeric suffix.

Source speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax.

Literal ordering-row grade. Grades describe timing bins within this family, not a single application fMAX or a cross-vendor speed ranking. ECP5-5G ordering rows in this revision list only -8.

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

Recommended operating junction temperature Tj. This is not ambient Ta, storage temperature, or the absolute maximum junction rating.

Industrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately.

The grade is read from this exact literal full MPN's ordering row, then joined to its specified junction operating range.

Nominal 1.00 V internal-logic supply for grade I8L. L suffix low-voltage device; C8L/C9L/I8L supported at 1.0 V.

Lattice names the core rail VCC; stored under app vccint only as a generic core-voltage field. This is the recommended core range, not SerDes VCCA, VCCIO, an absolute maximum, or a full board power-supply specification.

Application-specific timing not reviewed. Use implementation constraints and timing analysis.

Application fMAX depends on implementation, path, loading, speed grade and operating conditions. No single application clock is established by the speed grade or PLL limit.

Design activity, voltage and temperature dependent; no single device power asserted.

Application power depends on design activity, resources, I/O, voltage and temperature; not determined from marketing/typical static-current figures.

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

Recommended operating junction-temperature minimum.

Industrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime.

Recommended operating junction-temperature maximum.

TJ, not TA.

Tj is explicitly stated by the manufacturer; no ambient range is established.

Grade I8L, 1.0-V operation.

Grade I8L, 1.0-V operation.

Grade I8L, 1.0-V operation.

Exact-MPN ordering-table presence does not establish lifecycle status.

No current official MPN lifecycle status was established. An ordering-table entry or live family webpage is not an Active-status statement.

No stock observation; manufacturer order code is not inventory availability.

No current stock/inventory evidence was obtained. The official ordering-table entry does not establish availability.