SIDE-BY-SIDE REVIEW
Compare FPGA devices
Review resource differences, package constraints and the fields that still need confirmation.
Select devices (2–4)
| Parameter / status | EP4CE10E22I7NCyclone IV E | EP4CE22E22A7NCyclone IV E |
|---|---|---|
| Logic cellsUnconfirmed data | Not confirmedConditionsAltera LE count is logic_elements; no conversion to AMD logic cells. | Not confirmedConditionsAltera LE count is logic_elements; no conversion to AMD logic cells. |
| 6-input LUTsUnconfirmed data | Not confirmedConditionsCyclone IV uses four-input LUT LEs; no LUT6 equivalence. | Not confirmedConditionsCyclone IV uses four-input LUT LEs; no LUT6 equivalence. |
| Block RAM capacityDifferent | 414 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded memory (Kbits) rowConditionsOfficial embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes. | 594 KbCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE22 column; Embedded memory (Kbits) rowConditionsOfficial embedded memory Kbits including parity capacity. 1 Kb=1024 bits; not bytes. |
| 36 Kb block RAM blocksUnconfirmed data | Not confirmedConditionsExisting field means 36 Kb blocks; M9K count is separate in | Not confirmedConditionsExisting field means 36 Kb blocks; M9K count is separate in |
| DSP slicesUnconfirmed data | Not confirmedConditionsExisting field means DSP slices. Native 18 x 18 embedded multipliers are separate. | Not confirmedConditionsExisting field means DSP slices. Native 18 x 18 embedded multipliers are separate. |
| Altera logic elementsDifferent | 10320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Logic elements (LEs) row; PDF p. 22 FPGA Core FabricConditionsNative Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells. | 22320 LECYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE22 column; Logic elements (LEs) row; PDF p. 22 FPGA Core FabricConditionsNative Altera LE count, each with a four-input LUT and programmable register. Not AMD logic cells. |
| Altera embedded 18 × 18 multipliersDifferent | 23 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core FabricConditionsOne 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices. | 66 18 x 18 embedded multipliersCYIV-OVERVIEW-2-0 ↗ · devicePDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE22 column; Embedded 18 x 18 multipliers row; PDF p. 22 FPGA Core FabricConditionsOne 18 x 18 or two 9 x 9 multipliers per embedded multiplier block; not AMD DSP48 slices. |
| Altera M9K blocksDifferent | 46 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE10 column; PDF p. 22 FPGA Core FabricConditionsOfficial embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity. | 66 M9K blocksCYIV-OVERVIEW-2-0 ↗ · derivedPDF p. 17 / Volume 1 printed p. 1-3, Table 1-1, EP4CE22 column; PDF p. 22 FPGA Core FabricConditionsOfficial embedded-memory Kbits / 9 Kbits per M9K; includes parity capacity. |
| User I/O in this packageDifferent | 91 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, E144 columns; User I/O columnConditionsUser I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1. | 79 I/OCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE22 row, E144 columns; User I/O columnConditionsUser I/O includes general-purpose I/O, dedicated clock and dual-purpose configuration pins; excludes dedicated configuration pins. See Table 1-1 note 1. |
| Serial transceivers in this packageSame | 0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3ConditionsHigh-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels. | 0 serial transceiver channelsCYIV-OVERVIEW-2-0 ↗ · device-packagePDF p. 22 / Volume 1 p. 1-8, High-Speed Transceivers (Cyclone IV GX Devices Only); E package matrix Table 1-3ConditionsHigh-speed serial transceivers are GX-only. E-family GPIO LVDS/SERDES pairs do not become hard serial channels. |
| Package codeSame | E22CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsEnhanced Thin Quad Flat Pack (EQFP); package-matrix code E144. | E22CYIV-ORDERING-STANDALONE-2-0 ↗ · device-packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsEnhanced Thin Quad Flat Pack (EQFP); package-matrix code E144. |
| Package ball countUnconfirmed data | Not applicableConditionsEQFP has leads and an exposed ground pad. Use package_pins; do not call 144 leads balls. | Not applicableConditionsEQFP has leads and an exposed ground pad. Use package_pins; do not call 144 leads balls. |
| Package bodyUnconfirmed data | Not confirmedConditionsEQFP matrix lists 22 x 22 mm Size, but molded-body versus lead-inclusive extent has not been resolved with a mechanical drawing. Body dimensions remain null. | Not confirmedConditionsEQFP matrix lists 22 x 22 mm Size, but molded-body versus lead-inclusive extent has not been resolved with a mechanical drawing. Body dimensions remain null. |
| Ball pitchSame | 0.5 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE10 row, E144 columns; Pitch (mm) rowConditionsLead pitch; source package-matrix pitch. | 0.5 mmCYIV-OVERVIEW-2-0 ↗ · packagePDF p. 19 / Volume 1 printed p. 1-5, Table 1-3, EP4CE22 row, E144 columns; Pitch (mm) rowConditionsLead pitch; source package-matrix pitch. |
| Package terminals / leads (vendor count)Same | 144 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsManufacturer package pin count. EQFP144 leads; exposed ground pad is separately documented and not added to this count. | 144 pinsCYIV-ORDERING-STANDALONE-2-0 ↗ · packageStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsManufacturer package pin count. EQFP144 leads; exposed ground pad is separately documented and not added to this count. |
| Speed gradeSame | -7CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsSource speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax. | -7CYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsSource speed grade; retain L because it distinguishes low-voltage grades. Not a universal Fmax. |
| Junction temperature (Tj)Different | -40 to +100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | -40 to +125 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For automotive use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsAutomotive temperature grade recommended operating junction-temperature range (TJ), not ambient temperature. A suffix temperature range does not independently establish AEC-Q qualification or application suitability. |
| Temperature gradeDifferent | ICYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsIndustrial; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately. | ACYIV-ORDERING-STANDALONE-2-0 ↗ · partStandalone overview PDF p. 12 / printed p. 1-12, Figure 1-3; mapped only after exact MPN existence in ordering tableConditionsAutomotive temperature grade; temperature grade does not independently establish certification. I7 conditional extended operation is recorded separately. |
| Core voltage conditionsSame | 1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsNominal 1.20 V internal-logic supply for grade I7. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V. | 1.15-1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (A7)ConditionsNominal 1.20 V internal-logic supply for grade A7. Standard-voltage C6/C7/C8/I7/A7 grades supported at 1.2 V. |
| Maximum application clockUnconfirmed data | Not confirmedConditionsApplication-specific timing not reviewed. Use implementation constraints and timing analysis. | Not confirmedConditionsApplication-specific timing not reviewed. Use implementation constraints and timing analysis. |
| Application powerUnconfirmed data | Not confirmedConditionsDesign activity, voltage and temperature dependent; no single device power asserted. | Not confirmedConditionsDesign activity, voltage and temperature dependent; no single device power asserted. |
| Minimum junction temperatureSame | -40 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | -40 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For automotive use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsAutomotive temperature grade recommended operating junction-temperature range (TJ), not ambient temperature. A suffix temperature range does not independently establish AEC-Q qualification or application suitability. |
| Maximum junction temperatureDifferent | 100 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsIndustrial recommended operating junction-temperature range (TJ), not ambient temperature. This normalized range is ordinary industrial operation, not the maximum temperature under every conditional operating regime. See Conditional temperature operation below when present; the baseline limits apply to ordinary rated operation. | 125 °CCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For automotive use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsAutomotive temperature grade recommended operating junction-temperature range (TJ), not ambient temperature. A suffix temperature range does not independently establish AEC-Q qualification or application suitability. |
| Temperature referenceSame | TjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For industrial use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsTJ, not TA. | TjCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF p. 450 / Volume 3 printed p. 1-4, Table 1-3, TJ, For automotive use; grade mapping: standalone overview p. 12, Figure 1-3ConditionsTJ, not TA. |
| Conditional temperature operationUnconfirmed data | Historical conditional extended rangeALTERA-EXTENDED-TEMPERATURE-SUPPORT ↗ · part-conditionalCyclone IV FPGA Extended Industrial Temperature Offerings, EP4CE10 row, base ordering code EP4CE10E22I7; N suffix applicability note above table; timing-analysis and temperature-profile conditions preceding tableConditionsTj -40 to 125 °C, operating speed -8. Historical manufacturer support table requires extended-range timing analysis with an I7 target and -40/125 C temperature settings; operating speed grade is -8 and nominal supply is 1.2 V. Manufacturer confirmation of acceptable temperature profiles is required. Do not treat -7 at 125 C as unconditional. | Not confirmed |
| Minimum core voltageSame | 1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | 1.15 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (A7)ConditionsGrade A7, 1.2-V operation. |
| Nominal core voltageSame | 1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | 1.2 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (A7)ConditionsGrade A7, 1.2-V operation. |
| Maximum core voltageSame | 1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (I7)ConditionsGrade I7, 1.2-V operation. | 1.25 VCYIV-DATASHEET-2-1 ↗ · partCombined handbook PDF pp. 450-451 / Volume 3 printed pp. 1-4 to 1-5, Table 1-3 VCCINT 1.2-V operation row and note 1 (A7)ConditionsGrade A7, 1.2-V operation. |
| Current lifecycleUnconfirmed data | Not confirmedConditionsExact-MPN ordering-table presence does not establish lifecycle status. | Not confirmedConditionsExact-MPN ordering-table presence does not establish lifecycle status. |
| Available stockUnconfirmed data | Not confirmedConditionsNo stock observation; manufacturer order code is not inventory availability. | Not confirmedConditionsNo stock observation; manufacturer order code is not inventory availability. |
Check pinout, bank voltages, configuration, tool support, timing, thermal design and lifecycle before changing a part. Different vendors’ logic and DSP counts need architecture-specific interpretation.