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PS5012-E12

PCIe/NVMe SSD controller with eight NAND channels.

FPGA.io Part Number FIO-A6B76053A831ED99Internal catalogue reference · manufacturer MPN remains unchanged

Technical reference · Base device — ordering suffix not specified · Checked 2026-09-28

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PS5012-E12 — technical feature overview — Technical schematicFPGA.io technical schematic for PS5012-E12. Values summarize the documented fields below; consult their source conditions. This is an abstract diagram, not a product photograph, package drawing or pinout. Parameter sources below ↓

DOCUMENTED FACTS

Technical parameters

4 source-linked fields

Values apply to the device and conditions identified in each source. Family maxima, package limits and full ordering-code specifications must not be treated as interchangeable.

Parameter	Documented value	Source & conditions
Host interface	PCIe 3.0 ×4, NVMe 1.3	PS5012-E12/E12S controller product brochure ↗Specifications table; E12 package row
NAND channels, up to	8	PS5012-E12/E12S controller product brochure ↗Specifications table; E12 package row
Flash transfer rate, up to	667 MT/s	PS5012-E12/E12S controller product brochure ↗Specifications table; E12 package row
Package	529-ball TFBGA, 16 × 16 mm	PS5012-E12/E12S controller product brochure ↗Specifications table; E12 package row

Official documents

PS5012-E12/E12S controller product brochureSpecifications table; E12 package rowPDF ↗Phison SSD solutionsPCIe 3.0 / PS5012-E12 controller rowWeb ↗

Ordering and board constraints

This reference identifies a base device. Package, speed grade, temperature, qualification and packing suffixes have not been inferred.

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Series & categories

NAND flash controllers →storage solutions →

COMPLETE PART IDENTITIES

Ordering numbers for PS5012-E12

0 documented codes

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Exact ordering code requires confirmation

The cited reference could not be retrieved as usable ordering evidence in this pass. This is an evidence limit, not a claim that no code exists. The existing device identity is retained; no suffix combinations, neighboring chips, boards or systems are substituted.

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