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The MSOP-10 package is a 10-lead Mini Small Outline Package with a 3.0 mm × 3.0 mm body, a 0.50 mm lead pitch, and a

An MSOP package (Mini Small Outline Package) has a 3.0 mm × 3.0 mm body, stands 1.10 mm tall at most, and uses a 0.65

An LCC package, or leadless chip carrier, is a surface-mount IC package that connects to the board through metallized pads and edge castellations instead of

A J-lead package curls its leads back underneath the body, so most of the solder joint sits where you cannot see it. On a 44-pin

The HTSSOP-28 outline is standardized. Its thermal pad is not. Body size, lead pitch and lead span come from JEDEC MO-153-AET and match across vendors,

HTSSOP-38 is not one package. Two incompatible outlines ship under that name: a 9.7 mm × 4.4 mm body on 0.5 mm pitch, and a

The HTSSOP-20 package has no single thermal pad size. Texas Instruments exposes 2.96 mm × 2.96 mm at maximum material condition on PWP0020T. Renesas exposes

HTSSOP-24 is not one footprint. Texas Instruments publishes three separate 24-pin PowerPAD TSSOP drawings whose solder mask openings run from 2.44 mm × 3.42 mm

HTSSOP-16 is a 16-lead, 0.65 mm-pitch TSSOP body with an exposed thermal pad on the underside, built to Texas Instruments’ PWP0016A outline. It’s the standard

HTSSOP-14 is a 14-lead, 0.65 mm-pitch TSSOP body with an exposed thermal pad added to the underside, marketed by Texas Instruments as PWP0014A. The pad