An MSOP package (Mini Small Outline Package) has a 3.0 mm × 3.0 mm body, stands 1.10 mm tall at most, and uses a 0.65 mm lead pitch on the 8-pin version or 0.50 mm on the 10- and 16-pin versions. It is registered to JEDEC MO-187, and Texas Instruments sells the same footprint under the name VSSOP. This page gives the full dimensions, the pitch-by-pin-count rule, and how the MSOP compares to SOIC, SSOP, and TSSOP.

Key takeaways

• The MSOP body is 3.0 × 3.0 mm for 8 and 10 pins and 3.0 × 4.0 mm for 12 and 16 pins, about 4.9 mm wide including the gull-wing leads.
• Overall height is 1.10 mm maximum, roughly a third thinner than a standard SOIC at 1.5–1.75 mm.
• Pitch depends on pin count: 0.65 mm on the MSOP-8, and 0.50 mm on the MSOP-10 and MSOP-16.
• MSOP and VSSOP are the same package under two names; vendors also call it µMAX (Maxim) or micro SOIC (Analog Devices), so confirm the datasheet drawing.
• The exposed-pad version, TI’s DGN / HVSSOP (“MSOP-PowerPAD”), adds a thermal pad that lowers junction-to-ambient resistance sharply when soldered to copper.

MSOP dimensions and pitch at a glance

An MSOP (Mini Small Outline Package) measures 3.0 mm × 3.0 mm in body size for 8- and 10-pin parts, with a maximum height of 1.10 mm and a molded body about 0.85 mm thick. Lead pitch is 0.65 mm on the 8-pin version and 0.50 mm on the 10- and 16-pin versions, per JEDEC MO-187.

Symbol	Dimension	Value (mm)
A	Overall height (max)	1.10
A1	Standoff	0.00–0.15
A2	Molded body thickness	0.75–0.95 (0.85 nom)
b	Lead width	0.17–0.33
D	Body length	2.80–3.20 (3.00 nom)
E	Overall width incl. leads	4.65–5.15 (4.90 nom)
E1	Body width	2.80–3.20 (3.00 nom)
e	Lead pitch	0.50 BSC (10/16-pin); 0.65 BSC (8-pin)
L	Foot length	0.40–0.80 (0.60 nom)

Values follow Microchip’s 10-lead MSOP (MG) drawing, JEDEC MO-187 Variation BA, Rev E. The 8-pin MSOP (MO-187-AA) shares the 3.0 × 3.0 mm body but uses 0.65 mm pitch, per the Analog Devices RM-8 outline.

Pitch by pin count

The MSOP does not use a single pitch. The 8-pin part runs 0.65 mm, the same fine pitch as a TSSOP-8. The 10- and 16-pin parts tighten to 0.50 mm so the body can stay 3.0 mm wide while fitting more leads per side.

JEDEC files these as MO-187 variations: AA for the 0.65 mm 8-lead and BA for the 0.50 mm 10-lead. The 12- and 16-pin versions stretch the body to 3.0 × 4.0 mm. Read the drawing before you lay out copper, because a 10-pin footprint at 0.50 mm will not accept a 0.65 mm part.

The naming trap: MSOP, VSSOP, µMAX, micro SOIC

One footprint ships under several names, and a distributor listing and a datasheet do not always agree.

• Texas Instruments calls it VSSOP (very-thin shrink small outline package); the 8-pin code is DGK.
• The exposed-pad version is TI’s DGN, listed as HVSSOP or “MSOP-PowerPAD.”
• Analog Devices has used the term micro SOIC; its package drawings carry the RM prefix.
• Maxim’s term is µMAX (also µSOP).
• The former National Semiconductor line used MiniSO.

One correction worth stating: the MSOP has gull-wing leads, not bottom pads. Any listing that calls it “leadless” is describing a different package. Confirm the mechanical drawing before you commit a footprint, since a part may appear as both 8-MSOP and 8-VSSOP and is occasionally mis-tagged as TSSOP.

MSOP vs SOIC vs SSOP vs TSSOP

These four gull-wing packages trade board area against assembly ease. Use the table to place the MSOP against its neighbors, then the decision path below.

Attribute	MSOP / VSSOP	SOIC (D)	SSOP	TSSOP (PW)
Lead pitch	0.65 or 0.50 mm	1.27 mm	0.65 mm	0.65 or 0.50 mm
Body width	3.0 mm	3.9 mm	3.0/4.4/6.1 mm	3.0/4.4/6.1 mm
Overall height	≤1.10 mm	1.5–1.75 mm	1.65–1.85 mm	0.9–1.2 mm
Pin count	8–16	8–16	8–64	8–80
Lead style	Gull-wing	Gull-wing	Gull-wing	Gull-wing
Exposed-pad option	Yes (PowerPAD)	Some	Rare	Yes (HTSSOP)
Hand-solder	Feasible, fine-pitch	Easy	Fine-pitch	Fine-pitch, thin
Typical use	Compact analog/mixed-signal	Jelly-bean default	Higher pin count	Thin, dense

Decision path: choose SOIC when hand assembly and easy rework matter; MSOP or VSSOP to shrink an 8- to 10-pin analog part into a 3 mm body under 1.10 mm tall; TSSOP for a thinner profile or higher pin count; and the exposed-pad version whenever the die dissipates real power.

MSOP-PowerPAD and thermal performance

A plain MSOP is a poor heat path; the plastic body carries most of the heat out through the leads. The exposed-pad version fixes that. TI’s DGN package, which it labels HVSSOP or MSOP-PowerPAD, exposes the lead frame on the underside so the die pad can solder to a copper pour.

The numbers show the gap. On the TPS2061C power switch, TI gives the DGN junction-to-ambient resistance as about 141 °C/W with the pad not soldered and no extra copper, for the 0.5-A and 1-A parts; soldering the pad to copper with vias drops it well below that. In a separate TI application note, the HVSSOP version of the OPA2828 ran on average 48.1 °C cooler per watt than a package without the pad. The pad is electrically isolated and is usually tied to the ground plane through a via array under the part.

Footprint, soldering, and design notes

The 0.50 mm pitch on the 10- and 16-pin MSOP is fine-pitch territory. Use a stencil and reflow for production; hand-soldering is possible with a fine tip, flux, and magnification, but solder bridging is the common defect.

• Pin 1 sits in the index area marked by a dot or bevel; place it correctly, since the footprint is symmetric.
• Match paste apertures to the land; over-paste at 0.50 mm bridges easily.
• The molded body is thin, about 0.85 mm, so it has low thermal mass; do not overheat it during rework.
• Plastic MSOPs carry a J-STD-020 Moisture Sensitivity Level; bake per the reel label before reflow.

Real parts and lifecycle

The MSOP is a mainstream analog and mixed-signal package, so sourcing is usually easy. The TI TPS2061C power-distribution switch ships in both DGN (MSOP-PowerPAD) and DGK (VSSOP); the OPA2828 precision op amp uses the HVSSOP (DGN); and a large share of Maxim parts use the µMAX 8-pin body. Because MSOP overlaps with VSSOP and sits next to TSSOP, most functions have a second source in a nearby package. Before committing, confirm the exact variant — 8- versus 10-lead, 0.65 versus 0.50 mm, pad versus no pad — on the live datasheet, since parametric tables and distributor tags disagree often enough to cause a footprint error.

Frequently asked questions

What are the dimensions of an MSOP package?

An 8- or 10-pin MSOP has a 3.0 mm × 3.0 mm body, about 4.9 mm wide including the gull-wing leads, and stands 1.10 mm tall at most, with a molded thickness near 0.85 mm. The 12- and 16-pin versions grow to a 3.0 mm × 4.0 mm body, per JEDEC MO-187.

What is the pitch of an MSOP-8?

The MSOP-8 uses a 0.65 mm lead pitch, the same as a TSSOP-8. The 10- and 16-pin MSOP tighten to 0.50 mm to fit more leads on the 3.0 mm body. JEDEC lists these as MO-187 variations AA (0.65 mm) and BA (0.50 mm).

Is MSOP the same as VSSOP?

Yes. VSSOP (very-thin shrink small outline package) is Texas Instruments’ name for the MSOP footprint. The exposed-pad version is TI’s DGN, labeled HVSSOP or MSOP-PowerPAD. Confirm the drawing, since a distributor may list one part under either name.

Is MSOP the same as TSSOP?

No, though they overlap. Both use 0.65 mm and 0.50 mm pitches with gull-wing leads, but the MSOP body is fixed near 3.0 mm wide, while TSSOP bodies come in 3.0, 4.4, and 6.1 mm and reach far higher pin counts. TSSOP is also defined by its thin profile.

Can you hand-solder an MSOP?

Yes, with care. An 0.65 mm MSOP-8 solders by hand with a fine-tip iron, flux, and magnification. The 0.50 mm 10- and 16-pin parts bridge easily; drag-soldering or a stencil and hot air work better. Reflow with a stencil is the production method.

What is MSOP-PowerPAD (the exposed-pad version)?

It is an MSOP with the lead frame exposed on the underside as a thermal pad. Soldered to a copper pour with vias, it moves heat from the die into the board and sharply lowers junction-to-ambient resistance. TI names it DGN or HVSSOP; the pad is electrically isolated and usually tied to ground.

What to do next

Specify an MSOP, or its VSSOP twin, when you need to fit an 8- to 16-pin analog or mixed-signal part into a 3.0 mm body under 1.10 mm tall and the pitch — 0.65 mm at 8 pins, 0.50 mm at 10 and above — is within your assembly capability. Move to SOIC if hand rework dominates, to TSSOP for a thinner or higher-pin body, and to the PowerPAD version whenever the die needs the thermal pad. Whatever the base part number says, order against the exact package variant on the datasheet drawing, not the distributor’s category label.