The MSOP-10 package is a 10-lead Mini Small Outline Package with a 3.0 mm × 3.0 mm body, a 0.50 mm lead pitch, and a maximum height of 1.10 mm, registered to JEDEC MO-187 Variation BA. Texas Instruments sells it as VSSOP-10 (package code DGS), or as HVSSOP-10 (DGQ) when it carries an exposed thermal pad. This page gives the full dimensions, how the pins are numbered with a real pinout, and a recommended land pattern.

Key takeaways

• The MSOP-10 body is 3.0 × 3.0 mm, about 4.9 mm wide including the gull-wing leads, and 1.10 mm tall at most.
• Lead pitch is 0.50 mm, not 0.65 mm; the 0.65 mm figure belongs to the 8-pin MSOP.
• Pins number counterclockwise from the top-left: 1–5 down the left side, 6–10 up the right.
• An MSOP-10 pinout is device-specific; the package fixes only the pin geometry, so read the part’s own datasheet.
• TI’s DGS is the plain VSSOP-10; DGQ adds a PowerPAD thermal pad (an eleventh terminal) that must solder to a copper pour.

MSOP-10 dimensions

The MSOP-10 measures 3.0 mm × 3.0 mm in body size, 4.90 mm wide across the gull-wing leads, and 1.10 mm tall at most, with a molded body about 0.85 mm thick and a 0.50 mm lead pitch. It is registered to JEDEC MO-187 Variation BA.

Symbol	Dimension	Value (mm)
A	Overall height (max)	1.10
A1	Standoff	0.00–0.15
A2	Molded body thickness	0.75–0.95 (0.85 nom)
b	Lead width	0.23–0.33
c	Lead thickness	0.08–0.23
D	Body length	3.00 BSC
E	Overall width (incl. leads)	4.90 BSC
E1	Body width	3.00 BSC
e	Lead pitch	0.50 BSC
L	Foot length	0.40–0.80 (0.60 nom)

Values follow Microchip’s 10-Lead MSOP (MS) drawing C04-2021B, JEDEC MO-187-BA. Analog Devices publishes the same footprint as its MS (leaded) and MSE (exposed-pad) 10-lead packages.

MSOP-10 pinout: how the pins are numbered

An MSOP-10 has five leads per side. Pin 1 sits at the top-left, inside the index area marked by a dot or bevel, and the count runs counterclockwise: pins 1 to 5 down the left edge, then 6 to 10 up the right. That numbering is fixed by the package; the pin functions are not.

This matters on a bill of materials. Two different MSOP-10 parts share the outline but almost never share a pinout, so take pin functions from the specific device datasheet, never from another part in the same package.

Pin	Name	Function (example: TI TPS54060, DGQ)
1	BOOT	High-side gate-drive bootstrap
3	EN	Enable / input UVLO adjust
8	COMP	Error-amplifier output, loop compensation
9	GND	Ground
10	PH	Switch node
11	Thermal pad	Exposed pad; tie to GND, solder to copper

Selected pins shown from the TI TPS54060 datasheet; pins 2, 4, 5, 6, and 7 are omitted here. Note the eleventh terminal: on the DGQ (PowerPAD) version the exposed pad is numbered pin 11 and must connect to the ground plane.

DGS vs DGQ: plain VSSOP-10 vs PowerPAD

Two 10-pin variants share the MSOP-10 outline but are not interchangeable.

• DGS is the plain VSSOP-10 (JEDEC outline S-PDSO-G10): gull-wing leads, no thermal pad.
• DGQ is the HVSSOP-10 / MSOP-PowerPAD: the same body with the lead frame exposed on the underside as a thermal pad, added as pin 11.

A correction, because distributor listings get this wrong: the MSOP-10 and VSSOP-10 have gull-wing leads, not bottom pads. Any listing that calls a DGS part “leadless” is mistaken; only the DGQ adds a thermal pad, and even then the signal leads stay gull-wing.

The thermal pad earns its place when the part dissipates power. On the TPS54060, TI gives the DGQ junction-to-ambient resistance as about 62.5 °C/W on a standard board, which is why the pad should be soldered to copper with vias to move heat into the board.

MSOP-10 footprint and land pattern

The land pattern is ten pads at 0.50 mm pitch, five per side, with no center pad on the plain DGS. Every major vendor publishes a suggested pattern and references IPC-7351A for the geometry; Diodes Incorporated notes that a wave-solder pattern adds 0.2 mm to the toe (Z) dimension.

Feature	Value
Pad size (signal)	1.45 mm × 0.30 mm
Pad pitch	0.50 mm
Pad-row centers (across board)	4.40 mm apart
Overall land span	~5.8 mm

Signal-pad values are from TI’s HVSSOP-10 (DGQ) recommended layout; the overall span follows Richtek’s MSOP-10 footprint drawing. For the DGQ (PowerPAD) version, add a central thermal land: TI’s layout uses a 2.20 mm × 3.10 mm copper area with a 1.75 mm × 2.22 mm solder-mask opening and six 0.30 mm thermal vias on a 1.30 mm grid, tying the pad to an inner ground plane.

Soldering and assembly notes

At 0.50 mm pitch the MSOP-10 is a fine-pitch part. Use a stencil and reflow in production; bridging between adjacent leads is the common defect, so keep paste apertures matched to the land rather than oversized.

• Pin 1 is marked by a dot or bevel; the footprint is symmetric, so a rotated part still solders and then fails electrically.
• Hand assembly works with a fine tip, flux, and magnification, or by drag-soldering, but it is slower and bridges easily.
• On the DGQ, a poorly vented thermal pad can float or tombstone the part; follow the vendor’s paste-coverage percentage.
• Plastic MSOP-10 parts carry a J-STD-020 Moisture Sensitivity Level; bake per the reel label before reflow.

Real parts and sourcing

The MSOP-10 is common in analog, power, and mixed-signal devices, so sourcing is usually easy. Examples include the TI TPS54060 buck converter and TPS62051 step-down converter in DGS or DGQ, and the XTR111 voltage-to-current converter in DGQ. Analog Devices ships many parts in the MS (leaded) and MSE (exposed-pad) 10-lead bodies. Before you commit copper, confirm two things on the specific datasheet: whether the part is DGS (no pad) or DGQ (pin-11 pad), and the exact recommended land pattern, since the pad changes both the footprint and the thermal design.

Frequently asked questions

What are the dimensions of an MSOP-10?

An MSOP-10 has a 3.0 mm × 3.0 mm body, is 4.90 mm wide across the gull-wing leads, and stands 1.10 mm tall at most, with a molded thickness near 0.85 mm and a 0.50 mm lead pitch. It is registered to JEDEC MO-187 Variation BA.

What is the pitch of an MSOP-10 package?

The MSOP-10 uses a 0.50 mm lead pitch, confirmed across manufacturer drawings from Microchip, Analog Devices, ROHM, and Texas Instruments. The 0.65 mm pitch sometimes quoted belongs to the 8-pin MSOP, not the 10-pin.

What is the MSOP-10 footprint size?

The land pattern is ten pads at 0.50 mm pitch, five per side. TI’s recommended layout uses 1.45 mm × 0.30 mm pads with the two rows about 4.40 mm apart center-to-center, and an overall span near 5.8 mm. Vendors reference IPC-7351A.

Is MSOP-10 the same as VSSOP-10?

Yes. VSSOP-10 is Texas Instruments’ name for the MSOP-10 footprint; its package code is DGS. The exposed-pad version is DGQ (HVSSOP-10). Confirm the drawing, since distributors list the part under either name.

How are MSOP-10 pins numbered?

Pin 1 is at the top-left, inside the index area marked by a dot or bevel. The count runs counterclockwise: pins 1 to 5 down the left side, then 6 to 10 up the right. Pin functions are set by the device, not the package.

What is the difference between DGS and DGQ?

DGS is the plain VSSOP-10 with gull-wing leads and no thermal pad. DGQ is the same 10-pin body with an exposed PowerPAD thermal pad, numbered pin 11, that solders to a copper pour. They are not footprint-interchangeable.

What to do next

Design in an MSOP-10 when you need a 10-pin analog, power, or mixed-signal part in a 3.0 mm body under 1.10 mm tall and your line can place 0.50 mm pitch. Decide first whether the part is DGS or DGQ, because the pin-11 thermal pad changes the land pattern and the thermal design. Draw the footprint from the specific datasheet and IPC-7351A, take the pinout from that part alone, and match paste apertures to the pads to keep the fine-pitch leads from bridging.