Search results and distributor filters group several different packages under the “SSOP-36” name. Before laying out anything, work out which one you actually have. The
The SOIC-24 package is a 24-lead wide-body small outline IC with a 7.5 mm body and 1.27 mm lead pitch, built to JEDEC standard MS-013-AD. It
A SOIC-28 package measures 17.9 mm long and 7.5 mm across the molded body, stands 2.65 mm tall at most, and carries 28 gull-wing leads
A SOIC-20 package is 12.80 mm × 7.50 mm nominal with a 10.30 mm lead span, 2.65 mm maximum height and 1.27 mm pitch, registered
There is no narrow-body SOIC-18. Every 18-lead SOIC is the 7.50 mm wide body under JEDEC MS-013, with an 11.55 mm nominal body length and
The SOIC-16 package is not one package. Three incompatible outlines share the name: a 3.90 mm narrow body registered as JEDEC MS-012 variation AC, a
A SOIC-16W package has a 7.50 mm body, a 9.97 to 10.63 mm lead span and a 2.65 mm maximum height, registered under JEDEC MS-013.
A SOIC-14 package is a 3.90 mm wide, 8.65 mm long plastic body with seven gull-wing leads per side on 1.27 mm pitch, registered as
A SOIC package is a plastic surface-mount IC body with gull-wing leads on two sides at 1.27 mm pitch, registered by JEDEC in two widths:
A narrow-body SOIC land pattern uses 0.60 mm × 1.55 mm pads on 1.27 mm pitch, with 5.40 mm between the two pad rows measured