An HTSSOP (Heat-sink/thermally-enhanced Thin Shrink Small Outline Package) is a standard TSSOP body with an exposed metal pad added to the underside for direct PCB
An HSOP package is a gull-wing small-outline body with a thick copper heat slug mechanically riveted to the leadframe and exposed on the underside. That
A gull-wing lead exits the package body, bends down, then bends out flat against the board. That second bend is the whole point: it puts
An eSOP package is a small-outline package with the die-attach paddle exposed through the bottom of the mold compound, giving heat a direct path into
The CLCC package is a square ceramic surface-mount package with metallized castellations down its four edges instead of leads, usually on 1.27 mm or 1.02
The CLCC package is a square ceramic surface-mount package with metallized castellations down its four edges instead of leads, usually on 1.27 mm or 1.02
The ZIP package is a through-hole IC package whose leads leave one edge in two staggered rows, letting a 25-lead part occupy half the board
The TO-99 package is an 8-lead hermetic metal can, about 8.5 mm across, with leads on a 5.08 mm circle at 45° spacing. JEDEC registers
The TO-92 package is a three-lead molded plastic body about 4.6 mm across, with leads on 1.27 mm centers and a flat face for orientation.
The TO-8 package is a hermetic metal can roughly 15 mm across the header, taller and wider than a TO-5 and one size below a