Search results and distributor filters group several different packages under the “SSOP-36” name. Before laying out anything, work out which one you actually have.

The two mainstream variants both come from Analog Devices’ Linear Technology legacy line: a narrow 5.3 mm body (drawing 05-08-1640, internally the “G” package) and a wide 7.5 mm body (drawing 05-08-1642, the “GW” package). Renesas and the former Intersil ship a third variant under package code pkg_453, wider still at 8.4 mm. Distributor catalogs also list HSSOP-36 and PowerSSO-36 under similar names; both add an exposed thermal pad and use larger, different bodies built for power-management and motor-driver ICs rather than logic or data-converter parts. Typical dimensions reported for these exposed-pad packages run 10.3 x 7.5 mm for HSSOP-36 and 15.9 x 7.5 mm for PowerSSO-36, though you should confirm any specific part against its own datasheet rather than a distributor listing.

[IMAGE 1: Narrow vs wide SSOP-36 body outline comparison | alt: “SSOP-36 narrow 5.3 mm vs wide 7.5 mm body dimension comparison”]

SSOP-36 Package Dimensions: Narrow Body (5.3 mm, 0.65 mm Pitch)

This is the more common SSOP-36, used across Linear Technology’s older analog and power-management parts.

Parameter	Min	Max	Notes
Body width	5.00 mm	5.60 mm	Body only, excludes leads
Overall width (lead tip to lead tip)	7.40 mm	8.20 mm
Overall length	12.50 mm	13.10 mm	36 leads, 18 per side
Package height	–	2.0 mm	Max, seated height
Standoff	0.05 mm	–	Min
Lead pitch	0.65 mm BSC		Basic spacing
Lead width	0.22 mm	0.38 mm	Typical
Lead thickness	0.09 mm	0.25 mm
Foot length	0.55 mm	0.95 mm
Foot angle	0°	8°

Source: Analog Devices/Linear Technology, 36-Lead Plastic SSOP (5.3 mm), reference drawing 05-08-1640.

SSOP-36 Package Dimensions: Wide Body (7.5 mm / 0.300 in, 0.8 mm Pitch)

Parameter	Min	Max	Notes
Body width	7.417 mm	7.595 mm	Body only, excludes leads
Overall width (lead tip to lead tip)	10.11 mm	10.55 mm
Overall length	15.291 mm	15.545 mm	36 leads, 18 per side
Package height	2.44 mm	2.64 mm
Standoff	0.1 mm	0.3 mm
Lead pitch	0.800 mm BSC		Basic spacing
Lead width	0.28 mm	0.51 mm	Typical
Foot length	0.40 mm	1.27 mm
Foot angle	0°	8°	Typical

Source: Analog Devices/Linear Technology, 36-Lead Plastic SSOP (Wide 0.300 in), reference drawing 05-08-1642; the same figures appear in the mechanical section of the LTC4266 PoE controller datasheet, a production part shipped in this package.

Renesas ships a third 36-lead SSOP under package code pkg_453, part name PRSP0036GA-B, JEITA designation P-SSOP36-8.4×15-0.80. Its published envelope is 15 x 8.4 x 2.35 mm on the same 0.8 mm pitch as the ADI/LTC wide package, but roughly 0.8 mm wider across the body. Treat these as two different footprints – a pad layout built for one will not center correctly under the other.

Parametric Comparison Table

Package	Body width	Overall length	Pitch	Height	Exposed pad	Typical source
Narrow SSOP-36 (“G”)	5.00-5.60 mm	12.50-13.10 mm	0.65 mm	2.0 mm max	No	Analog Devices / Linear Technology
Wide SSOP-36 (“GW”)	7.417-7.595 mm	15.291-15.545 mm	0.8 mm	2.44-2.64 mm	No	Analog Devices / Linear Technology
Wide SSOP-36 (pkg_453)	8.4 mm nom.	15 mm nom.	0.8 mm	2.35 mm nom.	No	Renesas / Intersil
HSSOP-36	approx. 7.5 mm	approx. 10.3 mm	0.65 mm	approx. 1.2 mm	Yes	Multiple, per distributor listings
PowerSSO-36	approx. 7.5 mm	approx. 15.9 mm	0.8 mm	not published	Yes	STMicroelectronics
DIP-36 (600 mil, reference)	15.24 mm	approx. 45.7 mm	2.54 mm	n/a	No	Legacy through-hole

The HSSOP-36 and PowerSSO-36 rows come from distributor catalog listings rather than a single manufacturer drawing; verify the exact figure against the specific part’s own datasheet before you commit a footprint.

SSOP-36 Pinout and Pin Numbering

SSOP-36 follows the standard small-outline numbering convention: viewed from the top with the pin-1 marker at the upper left, pin 1 through pin 18 run down the left side, and pin 19 through pin 36 run back up the right side. That convention holds for both the narrow and wide bodies.

What it does not tell you is what any given pin does. SSOP-36 is a mechanical footprint, not a pinout standard, and two devices sharing this package can have completely different pin functions. The LTC4266, a 4-channel Power-over-Ethernet controller, and the LTC1709, a dual-phase synchronous step-down controller, both ship in 36-lead SSOP variants, and their pin-1 functions have nothing in common. Always pull the pin table from the specific device’s datasheet, not from a generic package reference.

[IMAGE 2: SSOP-36 pin numbering diagram, top view | alt: “SSOP-36 package pin 1 to pin 36 numbering diagram top view”]

Recommended PCB Footprint and Land Pattern

Both ADI/LTC variants publish a recommended solder pad layout on the same drawing as the body dimensions.

Variant	Pad envelope	Pad pitch	Pad width	Pad length
Narrow SSOP-36	5.3-5.7 x 7.8-8.2 mm	0.65 mm BSC	0.42 ±0.03 mm	1.25 ±0.12 mm
Wide SSOP-36	7.75-8.258 x 10.804 mm min	0.8 mm BSC	0.520 ±0.0635 mm	1.40 ±0.127 mm

[IMAGE 3: SSOP-36 recommended solder pad land pattern | alt: “SSOP-36 package recommended PCB solder pad land pattern”]

Where the manufacturer publishes its own recommended pad layout, as both ADI/LTC drawings do here, use that layout over a generic IPC-7351-generated footprint. IPC-7351 is still the right reference for verifying pad tolerances and courtyard clearance if you’re building the footprint from scratch or checking a CAD library part against a standard.

Is SSOP-36 a JEDEC-Registered Package?

No, not directly – and this is the detail that trips up a footprint pulled from a generic template. JEDEC’s outline registration for the Shrink Small-Outline Package family, MO-150, covers lead counts of 8, 14, 16, 18, 20, 22, 24, 28 and 30. Thirty-six is not on that list. Every 36-lead SSOP in production, narrow or wide, is a manufacturer-specific extension of the family rather than a JEDEC-registered drawing.

The practical consequence: there is no single authoritative outline to check a “generic SSOP-36” footprint against. You have to match the specific manufacturer’s drawing, either from Analog Devices/Linear Technology (05-08-1640 or 05-08-1642) or from Renesas/Intersil (pkg_453), or pull the mechanical section straight from the datasheet of the exact part you’re placing.

Board Area vs DIP-36: A Worked Comparison

SSOP-36 exists to save board space over a through-hole 36-pin DIP. Here’s what that saving looks like using the verified body dimensions above, comparing package body footprint only.

A 600-mil DIP-36 has an 18-lead row on each side at 2.54 mm pitch, giving a body roughly 15.24 mm wide by 45.7 mm long; that length matches the 45.72 mm board length of a commercial SSOP-36-to-DIP-36 adapter card sold for exactly this conversion. Body footprint: approximately 15.24 × 45.7 ≈ 696.5 mm².

Narrow SSOP-36, using the maximum body dimensions (5.60 × 13.10 mm): approximately 73.4 mm², a reduction of about 89.5%.

Wide SSOP-36, using the maximum body dimensions (7.595 × 15.545 mm): approximately 118.1 mm², a reduction of about 83.0%.

Both numbers compare package body only, not the larger solder-pad envelope; use them to size a rough board-area budget, not to calculate exact keep-out zones.

Assembly Notes: Pitch, Hand Assembly and Moisture Sensitivity

Both the 0.65 mm and 0.8 mm pitch are within hand-soldering range with a fine-tip iron, flux, and magnification, though the narrow 0.65 mm pitch takes more care and a steadier hand. That’s also why a dedicated SSOP-36 (0.65 mm pitch) to DIP-36 adapter board exists commercially: 25.4 × 45.72 × 1.6 mm FR-4, rated -40°C to +130°C operating and a 260°C reflow maximum, built specifically to let a narrow SSOP-36 part sit in a DIP-36 prototyping socket.

Moisture sensitivity level is not fixed by package type or pin count. Two devices in an identical SSOP-36 body can carry different MSL ratings depending on mold compound and assembly site, so don’t assume a level from the package name. Check the MSL printed on the shipping bag, reel label, or the specific part’s own packaging table in its datasheet before you set a floor-life clock or schedule a bake-out.

Sourcing and Second-Source Availability

Real-world example: the LTC4266CGW#TRPBF, a 4-channel PoE PSE controller in the wide SSOP-36 package, lists at $7.45 per unit in 1,000-piece tape-and-reel quantities on DigiKey, with a manufacturer standard lead time of 21 weeks at the time of writing. Treat that lead time as a schedule input for board release, not a footnote.

Because SSOP-36 sits outside the mainstream JEDEC SSOP pin-count range, second-source options are thinner than you’d get on a standard JEDEC footprint. Expect most 36-lead SSOP parts to originate from Analog Devices/Linear Technology or Renesas/Intersil legacy lines, with few pin-and-function-compatible alternates from other vendors. A search of Texas Instruments’ own SSOP (DBQ) packaging guide turns up documented pin counts through 24, not 36, consistent with this being a narrower, less multi-sourced family than mainstream SSOP sizes. Confirm second-source availability at the specific device level, since it will not exist at the package level the way it does for, say, an 8-pin SOIC.

Choosing Between Narrow and Wide SSOP-36

• If the datasheet cites drawing 05-08-1640, or a body width near 5.3 mm: use the narrow footprint, 0.65 mm pitch.
• If it cites 05-08-1642, the word “wide,” “.300 inch,” or a body width near 7.5 mm: use the wide footprint, 0.8 mm pitch, and confirm the exact manufacturer, since the ADI/LTC and Renesas wide bodies differ.
• If the part carries a thermal or exposed-pad callout: it’s HSSOP-36 or PowerSSO-36, not plain SSOP-36. Pull that device’s own drawing number for pad size and thermal via pattern.
• If no drawing number is given anywhere in the datasheet: don’t guess from the package name. Request the mechanical outline from the manufacturer before you release the board.

Frequently Asked Questions

What is the pin pitch of an SSOP-36 package?

Two pitches are common: 0.65 mm on the narrow 5.3 mm body (Analog Devices/Linear Technology “G” package) and 0.8 mm on the wide 7.5 mm body (“GW” package, and the similarly-pitched Renesas variant). Confirm which one applies from the specific device’s mechanical drawing before laying out pads.

Is SSOP-36 the same as TSSOP-36?

No. TSSOP packages follow JEDEC MO-153 with a thinner profile, generally under 1.2 mm tall against 2.0 mm or more for SSOP-36, and aren’t drawn from the same registration. Don’t substitute one footprint for the other without checking both drawings.

Does SSOP-36 have a JEDEC-standard footprint?

Not directly. JEDEC’s SSOP registration, MO-150, covers only 8 to 30 leads, so every 36-lead SSOP in production is a manufacturer-specific extension rather than a single JEDEC-registered drawing.

Can SSOP-36 be hand-soldered?

Yes. Both the 0.65 mm and 0.8 mm pitch variants are hand-solderable with a fine-tip iron, flux, and magnification. The 0.65 mm pitch needs more care, which is why dedicated SSOP-to-DIP adapter boards exist for prototyping this exact pin count.

How much smaller is SSOP-36 than a DIP-36 package?

Roughly 83-90% less board area at the package body alone, depending on whether you’re comparing the narrow or wide SSOP-36 variant against a 600-mil DIP-36.

Why do some SSOP-36 listings show an exposed thermal pad?

Those are different packages, usually named HSSOP-36 or PowerSSO-36, built for power-management and motor-driver ICs that need a direct thermal path to the board. They share the “SSOP-36” name loosely but use larger bodies and different height and pitch combinations.

The Decision

Before you drop a footprint, open the mechanical section of the datasheet for the exact part number you’re placing, match its drawing number or body width against the narrow (5.3 mm / 0.65 mm) or wide (7.5 mm / 0.8 mm) tables above, and confirm it isn’t one of the exposed-pad variants. If the datasheet gives no drawing number at all, don’t guess from the package name; request the mechanical outline from the manufacturer before you release the board.