Description

XCZU49DR-2FFVF1760I Overview

The XCZU49DR-2FFVF1760I is an AMD (Xilinx) Zynq® UltraScale+™ RFSoC Gen 3 device built on 16 nm FinFET+ technology. It integrates a 64-bit quad-core Arm® Cortex®-A53 application processor, a dual-core Arm Cortex-R5F real-time processor, UltraScale+ programmable logic, and a complete direct-RF-sampling data converter subsystem on a single die.

Within the RFSoC family, the ZU49DR is the highest-channel-count member: 16 RF-ADCs and 16 RF-DACs (16T16R) in one package. That makes XCZU49DR-2FFVF1760I the natural choice for dense multi-channel systems — digital phased-array radar, massive-MIMO radio heads, wideband electronic warfare receivers and multi-beam satellite payloads — where channel density per board, not per-channel sample rate, is the binding constraint.

Key Technical Highlights

• Direct RF sampling to 6 GHz — no external mixer chain required for sub-6 GHz bands.
• 16× 14-bit RF-ADC, up to 2.5 GSPS each, arranged as four quad-ADC tiles with one PLL per tile. Each RF-ADC includes a digital down converter (DDC) with a 48-bit NCO, full complex mixer and programmable decimation (1x through 40x).
• 16× 14-bit RF-DAC, up to 9.85 GSPS each, in four quad-DAC tiles, each with a digital up converter (DUC), 48-bit NCO, sin(x)/x correction and 1st/2nd Nyquist zone support. 4 GHz full-power output bandwidth, RF output to 5 GHz.
• Multi-chip synchronisation and on-chip clock forwarding (a Gen 3 feature) for deterministic phase alignment across tiles and across devices — essential for beamforming arrays.
• Quadrature modulator correction (gain / phase / offset) per converter pair, plus programmable amplitude threshold flags per RF-ADC.

XCZU49DR-2FFVF1760I Full Specifications

RF Data Converter Subsystem

Processing System (PS)

Programmable Logic (PL)

Connectivity & I/O

Package, Grade & Environmental

Part Number Decoder: XCZU49DR-2FFVF1760I

• XC — Xilinx commercial product
• ZU — Zynq UltraScale+ architecture
• 49 — value index (device size / converter configuration)
• D — processing system: quad APU + dual RPU
• R — engine type: RF Signal (RFSoC)
• -2 — mid speed grade
• F — lidded flip-chip package (S = lidless stiffener)
• F — flip-chip, 1.0 mm ball pitch
• V — RoHS 6/6 compliant
• F1760 — footprint identifier, 1760 balls
• I — industrial temperature grade

How the ZU49DR Differs From Other Gen 3 RFSoCs

Several third-party component sites publish incorrect data for this device. The following points are taken directly from the AMD Zynq UltraScale+ RFSoC Data Sheet: Overview (DS889):

• The XCZU49DR contains no SD-FEC blocks. Soft-decision FEC is present on the ZU21DR, ZU28DR, ZU46DR and ZU48DR (8 blocks each). If your design needs hardened LDPC or Turbo decoding, plan for a soft implementation in the PL or select a different device.
• RF-ADC sample rate is 2.5 GSPS, not 5.0 GSPS. The ZU49DR trades per-channel ADC rate for channel count; the ZU47DR and ZU48DR offer 8 ADCs at 5.0 GSPS instead.
• There is no Mali GPU. RFSoC devices do not include the graphics processor found on some Zynq UltraScale+ MPSoC parts.
• 10 GSPS RF-DAC operation is quoted by some sources; the datasheet value is 9.85 GSPS, with 10 GSPS available only by arrangement with AMD.
• PL fabric is identical to the ZU46DR, ZU47DR and ZU48DR (930,300 logic cells, 4,272 DSP slices) — the differentiator is the converter and package configuration, not the fabric size.

Pin-Compatible and Related Devices

The FFVF1760 and lidless FSVF1760 packages share a common footprint across three 16×16 RFSoC devices, allowing a single PCB to support multiple generations:

• XCZU29DR — Gen 1, 16× 12-bit 2.058 GSPS ADC, 16× 14-bit 6.554 GSPS DAC
• XCZU39DR — Gen 2, 16× 12-bit 2.220 GSPS ADC, 16× 14-bit 6.554 GSPS DAC
• XCZU49DR — Gen 3, 16× 14-bit 2.5 GSPS ADC, 16× 14-bit 9.85 GSPS DAC

Commonly cross-shopped alternatives: XCZU47DR-2FFVG1517I and XCZU48DR-2FFVG1517I (8× 5.0 GSPS ADC, 1517-ball, ZU48DR adds 8 SD-FEC), and XCZU46DR (12× ADC + 12× DAC). Other order codes in the same footprint include XCZU49DR-2FFVF1760E, XCZU49DR-1FFVF1760I, XCZU49DR-2LFFVF1760I and the lidless XCZU49DR-2FSVF1760I — contact us for availability on any of these.

Target Applications

• Digital phased-array radar and multi-beam beamforming systems
• 5G NR massive-MIMO remote radio heads and O-RAN radio units, sub-6 GHz
• Electronic warfare, SIGINT and wideband spectrum monitoring
• Satellite communications payloads, gateways and ground terminals
• High-density software-defined radio and multi-channel transceivers
• Automated test equipment, arbitrary waveform generation and RF instrumentation
• Cable access / DOCSIS 3.1 Remote PHY, wireless backhaul

Development Support

The ZU49DR is supported by the AMD ZCU216 Evaluation Kit (EK-U1-ZCU216-V1-G), which carries an XCZU49DR-2FFVF1760 device with the XM655 and XM650 16T16R add-on cards and the CLK104 RF clock card — a design prototyped on ZCU216 maps directly onto this industrial-grade part. Development uses the AMD Vivado™ Design Suite, Vitis™ unified software platform, the RF Data Converter IP and evaluation tool, and PetaLinux for embedded Linux. Reference documents: DS889 (overview), DS926 (DC and AC switching characteristics), PG269 (RF Data Converter), UG1075 (packaging and pinouts) and UG1390 (ZCU216 board).

Ordering, Quality & Shipping

• Genuine AMD/Xilinx product supplied in original factory trays with date and lot traceability
• Incoming inspection with test report available on request
• Volume pricing and scheduled deliveries — submit an RFQ for current lead time and stock
• MSL-rated dry-pack handling and ESD-safe packaging; worldwide shipping
• RFSoC devices may be subject to export control; end-use information may be requested prior to shipment

Need PCB assembly, BGA rework or a system-on-module built around the ZU49DR? Contact our team — we can quote the device alone or as part of a turnkey build.