XCZU48DR-2FFVG1517I — AMD Xilinx Zynq UltraScale+ RFSoC Gen 3 | 8× 5GSPS RF-ADC, 8× 9.85GSPS RF-DAC, 8 SD-FEC, FFVG1517 BGA

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XCZU48DR-2FFVG1517I — AMD Xilinx Zynq UltraScale+ RFSoC Gen 3 | 8× 5GSPS RF-ADC, 8× 9.85GSPS RF-DAC, 8 SD-FEC, FFVG1517 BGA

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Original price was: $35,200.00.Current price is: $33,999.00.

The XCZU48DR-2FFVG1517I is an AMD (Xilinx) Zynq UltraScale+ RFSoC Gen 3 device that integrates eight 14-bit 5.0 GSPS RF-ADCs, eight 14-bit 9.85 GSPS RF-DACs, eight Soft-Decision FEC cores, a quad-core Arm Cortex-A53 processing system and 930,300 system logic cells on a single 16 nm FinFET+ die.

  • RF-ADC: 8 × 14-bit @ 5.0 GSPS, RF input to 6 GHz, integrated DDC/NCO
  • RF-DAC: 8 × 14-bit @ 9.85 GSPS, integrated DUC/NCO, inverse-sinc
  • SD-FEC: 8 hardened cores — LDPC encode/decode + Turbo decode
  • Logic: 425,280 LUTs · 850,560 FFs · 4,272 DSP48E2 · 60.5 Mb total on-chip RAM
  • Package: FFVG1517, 1517-ball lidded FCBGA, 40 × 40 mm, 1.0 mm pitch
  • Grade: −2 speed, Industrial (TJ −40 °C to +100 °C), RoHS compliant

Genuine AMD/Xilinx parts, full traceability, worldwide shipping. Request a quote for volume pricing and lead time.

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Description

XCZU48DR-2FFVG1517I Overview

The XCZU48DR-2FFVG1517I is a Gen 3 member of the AMD (formerly Xilinx) Zynq UltraScale+ RFSoC family, built on a 16 nm FinFET+ process. It combines a direct-RF sampling data converter subsystem, hardened Soft-Decision Forward Error Correction, a 64-bit Arm application processor complex and a large UltraScale+ programmable logic fabric in a single 1517-ball FCBGA. The result is a monolithic radio platform that removes the external data converters, JESD204B/C interfaces and companion FEC ASICs normally required in a multi-channel wideband radio card.

Within the Gen 3 line-up, the XCZU48DR is the SD-FEC-enabled device. Its closest sibling, the XCZU47DR, shares the same programmable logic and converter counts but contains no SD-FEC blocks. If your design terminates 5G NR, DOCSIS 3.1 or Wi-Fi channel coding on-chip, the XCZU48DR-2FFVG1517I is the correct part number.

RF Data Converter Subsystem (Gen 3)

The Gen 3 converter subsystem is arranged as four RF-ADC tiles and four RF-DAC tiles, each carrying two converters.

  • 8 × RF-ADC — 14-bit resolution, up to 5.0 GSPS, analog input frequency up to 6 GHz, enabling direct sampling in the second and third Nyquist zones.
  • 8 × RF-DAC — 14-bit resolution, up to 9.85 GSPS, with inverse-sinc compensation and Gen 3 digital mixer modes for high-Nyquist synthesis.
  • Integrated DDC / DUC — per-converter digital down- and up-conversion with 48-bit NCOs and programmable decimation and interpolation factors, moving channelisation out of the fabric and cutting DSP and power budgets.
  • On-chip PLLs and multi-tile synchronisation for deterministic, repeatable phase alignment across all converters — essential for phased-array beamforming and MIMO.

Because the converters sit on-die, the JESD204B/C SerDes links, retimers and clock trees of a discrete converter design disappear, along with their board area, insertion loss and latency.

Soft-Decision FEC — the XCZU48DR Differentiator

The XCZU48DR-2FFVG1517I integrates eight hardened SD-FEC cores. Each core supports:

  • LDPC encode and decode with fully user-programmable parity-check matrices, covering 5G NR, DOCSIS 3.1 and IEEE 802.11 code sets;
  • Turbo decode for LTE and legacy 3GPP air interfaces;
  • Run-time code switching, so a single bitstream can service multiple numerologies or standards.

Implementing the same throughput in soft logic would consume a large fraction of the fabric and a disproportionate share of the power budget. The hardened blocks free that capacity for beamforming, DPD, DFE and application logic.

Programmable Logic Resources

System Logic Cells 930,300
CLB LUTs 425,280
CLB Flip-Flops 850,560
DSP Slices (DSP48E2) 4,272
Block RAM 38.0 Mb (1,080 blocks of 36 Kb)
UltraRAM 22.5 Mb (80 blocks of 288 Kb)
Total On-Chip RAM 60.5 Mb

Processing System (PS)

  • Application Processing Unit: quad-core Arm Cortex-A53, up to 1.33 GHz at the −2 speed grade, with NEON and single/double-precision FPU.
  • Real-Time Processing Unit: dual-core Arm Cortex-R5F at 533 MHz, with lock-step operation and TCM for deterministic control tasks.
  • On-Chip Memory: 256 KB OCM with ECC.
  • Memory Controller: 72-bit (64 + 8 ECC) PS DDR4 / LPDDR4 interface; the PL supports independent DDR4 controllers.
  • Peripherals: Gigabit Ethernet, USB 3.0, SD/eMMC, SPI, QSPI, I2C, CAN, UART, GPIO.
  • Security: AES-GCM bitstream decryption, RSA authentication, SHA-3/384, secure boot and configuration security unit.

Note on GPU: Zynq UltraScale+ RFSoC devices, including the XCZU48DR, do

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