Description

Overview

The Xilinx XC7Z100-2FFG900I sits at the top of the Zynq®-7000 All Programmable SoC family. It fuses the software programmability of an ARM-based processor with the hardware programmability of an FPGA, enabling analytics and hardware acceleration while integrating CPU, DSP, ASSP and mixed-signal functionality on a single device. This variant carries a -2 speed grade, industrial temperature qualification, and the 900-ball FCBGA (FFG900) package — a proven combination for performance-critical, always-on embedded systems. Newark Electronics

Built on TSMC’s 28 nm process, the XC7Z100 pairs a dual-core ARM Cortex-A9 MPCore Processing System (PS) with Kintex-7-class Programmable Logic (PL), giving designers a scalable path from software prototyping in Vitis / PetaLinux to full custom acceleration in Vivado.

Key Features & Specifications

Processing System (PS)

• Dual-core ARM® Cortex®-A9 MPCore, up to 800 MHz (-2 speed grade)
• NEON™ SIMD engine and single/double precision floating-point unit per processor Mouser
• 32 KB L1 instruction + 32 KB L1 data cache per core; 512 KB shared L2 cache; 256 KB on-chip memory Mouser
• External memory support: DDR3, DDR3L, DDR2, LPDDR2; static memory: 2× Quad-SPI, NAND, NOR Mouser

Programmable Logic (PL) – Kintex-7 based

• 444K logic cells / 277,400 LUTs / 554,800 flip-flops Manuals+
• 26.5 Mb Block RAM (755 × 36 Kb blocks) Manuals+
• 2,020 DSP48E1 slices Manuals+
• Integrated PCIe Gen2 x8 hard block Manuals+

High-Speed Serial & I/O

• 16 GTX transceivers at up to 12.5 Gb/s AldecAMD
• 362 user I/O in the FFG900 package (HR + HP banks) Aldec
• Dual 12-bit, 1 MSPS XADC on-chip ADC

PS Peripherals

• Two Gigabit Ethernet MACs with 1588 v2 PTP (GMII, RGMII, SGMII) FPGAkey
• Two USB 2.0 OTG controllers (up to 12 endpoints each) FPGAkey
• 2× CAN 2.0B, 2× SD/SDIO, 2× UART, 2× I²C, 2× SPI, GPIO

Package & Grade

• Package: FFG900 – 900-ball Flip-Chip Fine-Pitch BGA, 31 × 31 mm
• Speed grade: -2
• Temperature grade: I (Industrial), –40 °C to +100 °C Tj
• RoHS-compliant, Pb-free

Typical Applications

• ADAS and automotive sensor fusion
• Machine vision and industrial inspection
• Medical imaging (endoscopy, ultrasound, CT front-ends)
• Small-cell baseband and wireless infrastructure
• Software-defined radio (SDR) and test & measurement
• Multi-function printers and high-throughput image pipelines
• Aerospace, defense, and mission-ready embedded computing

Design & Tool Support

The XC7Z100-2FFG900I is fully supported by the AMD Xilinx toolchain, including Vivado® Design Suite for the full FPGA/SoC design flow, Vitis™ Unified Software Platform for C/C++ and AI/ML acceleration, and PetaLinux for custom Linux kernel and root filesystem builds. Reference designs and evaluation platforms from AMD partners simplify board bring-up for PCIe, FMC, and high-speed memory subsystems. DRex Electronics

Ordering Information