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A SIL package puts every lead in one row along one edge of the body, so the part stands upright on the board. SIL and

An SDIP (shrink dual in-line package) is a through-hole DIP with a finer lead pitch than the standard part: 1.778 mm (0.070 in) instead of

In a radial lead package, both leads exit the same face of the component body, so the part stands vertically on the board and takes

A press-fit pin is a solderless PCB termination: a contact with a springy “compliant” zone that is pressed into a plated-through hole, where it deforms

A PPGA package (plastic pin grid array) is an integrated-circuit package built on a bismaleimide-triazine (BT) laminate substrate, with a grid of press-fit pins on

A PGA socket connects a pin grid array device to a board through the device’s underside pins, with no soldering of the device itself. Three

A PGA, or pin grid array, is an IC package with pins arranged in a regular grid on the underside, mounted by inserting those pins

The PDIP package is a Plastic Dual In-line Package: a through-hole IC body with two parallel rows of pins on a 2.54 mm (0.1 in)

The mPGA package is a micro pin grid array: a pin grid array built on a reduced 1.27 mm (50-mil) pin grid, half the pitch

The FCPGA package is a flip-chip pin grid array: a socketed processor package with pins on the bottom and a die mounted face-down on the