XCZU15EG-2FFVC900I — AMD Xilinx Zynq UltraScale+ MPSoC, FFVC900 BGA, -2 Speed, Industrial

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XCZU15EG-2FFVC900I — AMD Xilinx Zynq UltraScale+ MPSoC, FFVC900 BGA, -2 Speed, Industrial

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Original price was: $6,800.00.Current price is: $6,200.00.

XCZU15EG-2FFVC900I is an AMD Xilinx Zynq UltraScale+ MPSoC (ZU15EG) in a 900-ball FFVC900 flip-chip BGA, -2 speed grade, industrial temperature range.

  • Processing System: quad-core Arm Cortex-A53 (up to 1.3 GHz), dual-core Cortex-R5F real-time unit, Mali-400 MP2 GPU
  • Programmable Logic: 747K system logic cells, 341,280 LUTs, 3,528 DSP slices
  • Memory: 26.2 Mb Block RAM + 31.5 Mb UltraRAM, 64-bit DDR4/LPDDR4 controller with ECC
  • Connectivity: 16 GTH transceivers to 16.3 Gb/s, integrated PCIe Gen3, USB 3.0, SATA, DisplayPort, 4× Gigabit Ethernet
  • Grade: -2 speed, industrial (-40 °C to +100 °C Tj)

Genuine AMD Xilinx stock, tested and traceable. Request a quote for XCZU15EG-2FFVC900I pricing and lead time.

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Description

XCZU15EG-2FFVC900I Overview

The XCZU15EG-2FFVC900I is a Zynq UltraScale+ MPSoC from the AMD Xilinx EG device family, combining a hardened multi-processor system with high-density 16 nm FinFET programmable logic on a single die. Supplied in the 900-ball FFVC900 package at -2 speed grade and industrial temperature rating, the XCZU15EG-2FFVC900I targets designs that need heterogeneous compute, deterministic real-time control and high-bandwidth serial I/O in one device.

Processing System (PS)

The EG suffix denotes the graphics-enabled variant. The XCZU15EG-2FFVC900I processing system integrates:

  • Application Processing Unit — quad-core Arm Cortex-A53, 64-bit, with NEON and 1 MB shared L2 cache
  • Real-Time Processing Unit — dual-core Arm Cortex-R5F with TCM, lock-step capable for functional-safety designs
  • Graphics Processing Unit — Arm Mali-400 MP2 with 64 KB L2 cache
  • Memory controller — multi-protocol 64-bit DDR4 / DDR3 / LPDDR4 / LPDDR3 with ECC
  • Peripherals — USB 3.0, SATA 3.1, DisplayPort 1.2a, 4× Gigabit Ethernet, SD/eMMC, CAN, SPI, I²C, UART, GPIO
  • PS-GTR — 4 transceiver lanes at up to 6 Gb/s serving PCIe Gen2, USB3, SATA, DisplayPort and SGMII

Programmable Logic (PL) Resources

Resource XCZU15EG
System logic cells 747K
CLB LUTs 341,280
CLB flip-flops 682,560
Block RAM 26.2 Mb (744 blocks)
UltraRAM 31.5 Mb (112 blocks)
DSP slices (DSP48E2) 3,528
GTH transceivers 16 @ 16.3 Gb/s
PCIe hard blocks Gen3 x16 integrated block

Package, Speed Grade and Temperature

Attribute Value
Manufacturer Part Number XCZU15EG-2FFVC900I
Manufacturer AMD (Xilinx)
Device Zynq UltraScale+ MPSoC ZU15EG
Package FFVC900, flip-chip BGA, 900 balls
Body size / pitch 31 × 31 mm, 1.0 mm
Speed grade -2
Temperature grade Industrial (I), -40 °C to +100 °C Tj
Process 16 nm FinFET+
Design tools AMD Vivado Design Suite, Vitis Unified Software Platform

Security and Configuration

The XCZU15EG-2FFVC900I includes a Configuration Security Unit supporting AES-GCM 256-bit decryption, RSA-4096 authentication, SHA-3/384 hashing and Arm TrustZone, alongside secure boot and tamper monitoring for defence, aerospace and infrastructure applications.

Typical Applications

  • 5G and wireless remote radio units, massive MIMO beamforming
  • Software-defined radio and RF signal processing
  • Machine vision, medical imaging and industrial inspection
  • Motor control, robotics and functional-safety industrial systems
  • ADAS and automotive sensor fusion prototyping
  • Test and measurement instrumentation
  • Aerospace and defence embedded computing

Why Buy XCZU15EG-2FFVC900I from FPGA.io

FPGA.io supplies genuine AMD Xilinx programmable devices with full traceability. Every XCZU15EG-2FFVC900I is inspected and tested before shipment, backed by a warranty and supported by responsive technical and logistics teams. Contact FPGA.io for current XCZU15EG-2FFVC900I stock, pricing and lead time.

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