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The TSSOP-44 package runs on 0.635 mm pitch, not 0.65 mm, with a 14.0 mm by 6.1 mm body, a lead span of 7.9 mm

Every 38-lead TSSOP package in production shares one geometry: 0.5 mm pitch on a 4.4 mm wide body, 9.7 mm long, 1.2 mm maximum height,

A TSSOP-32 package carries 32 gull-wing leads on 0.65 mm pitch. The version most vendors ship measures 10.9 mm to 11.1 mm long by 6.0

A TSSOP-28 package carries 28 gull-wing leads on a 9.7 mm × 4.4 mm plastic body that stands no taller than 1.2 mm, with the

The TSSOP-20 package is a 20-lead thin shrink small outline package registered to JEDEC MO-153, variation AC. The plastic body measures 4.4 mm × 6.5

The TSSOP-16 package is a 16-lead thin shrink small outline package registered to JEDEC MO-153, variation AB. The body measures 4.4 mm × 5.0 mm,

The TSSOP-14 package is a 14-lead thin shrink small outline package on 0.65 mm pitch, 1.2 mm maximum height, with a 4.9 to 5.1 mm

A TSSOP package is a plastic gull-wing surface-mount package on 0.65 mm pitch with a 1.2 mm maximum height, registered under JEDEC MO-153. Texas Instruments’

The TSOP-86 package is an 86-lead thin small outline package, Type II, on a 22.22 mm by 10.16 mm body with a 1.20 mm maximum

The TSOP-66 package is a 66-lead thin small outline package, Type II, measuring 22.22 mm by 10.16 mm with a 1.20 mm maximum height and