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The TO-39 package is a hermetic metal can with a 8.51–9.40 mm base flange, three leads on a 5.08 mm pin circle, and a locating tab.

The TO-3 package is a hermetic diamond-shaped metal can for power semiconductors, registered by JEDEC as the TO-204 family. Two glass-sealed pins pass through the base

The TO-268, commonly called D3PAK (Decawatt 3 Package), is the largest surface-mount package in the JEDEC DPAK family. Sitting above the TO-252 (DPAK) and TO-263

The TO-264 is the largest standard through-hole power package in the JEDEC transistor-outline family. Registered as SOT-199 and designated TO-264AA in JEDEC Publication 95, it

The TO-252 package — everyone calls it DPAK — is a 6.10 mm × 6.58 mm molded body with three gullwing leads on 2.286 mm

The TO-251 package, sold almost everywhere as IPAK, is a three-lead through-hole outline with a molded body around 6.1 mm by 6.6 mm by 2.3

The TO-247-4L package is the four-lead version of the TO-247 outline, and the fourth pin is a Kelvin source that gives the gate driver its

The TO-247-3 package is the three-lead member of the JEDEC TO-247 through-hole family: roughly 21 mm by 16 mm of molded body, leads on a

The TO-247 package is a through-hole power outline roughly 20 mm × 15.5 mm with three or four leads on 5.46 mm pitch and a

The TO-243 package is what JEDEC calls the package the rest of the industry calls SOT-89, and JEITA calls SC-62. It is a 4.5 mm