An SSOP-14 package holds fourteen gull-wing leads, seven per long side, on 0.65 mm pitch. The plastic body measures 6.2 mm × 5.3 mm nominal, overall height stops at 2.00 mm, and the lead tips span roughly 7.8 mm across the two rows. The outline is registered as JEDEC MO-150.
Two vendors, one registration, different tolerances.
| Parameter | TI DB0014A (4220762/A) | NXP SOT337-1 (rev 8 Feb 2016) |
| Lead pitch | 0.65 mm | 0.65 mm |
| Body length D | 5.9–6.5 mm | 6.0–6.4 mm (6.2 nom) |
| Body width E | 5.0–5.6 mm | 5.2–5.4 mm (5.3 nom) |
| Lead span | 7.4–8.2 mm typ | 7.6–7.9 mm |
| Overall height A | 2 mm max | 2 mm max |
| Body height A2 | Not called out | 1.65–1.80 mm |
| Standoff A1 | 0.05 mm min | 0.05–0.21 mm |
| Lead width | 0.22–0.38 mm | 0.25–0.38 mm |
| Lead thickness | 0.09–0.25 mm | 0.09–0.20 mm |
| Foot length | 0.55–0.95 mm | 0.63–1.03 mm |
| Lead angle | 0° to 8° | 0° to 8° |
| JEDEC reference | MO-150 | MO-150 |
Table 1. SSOP-14 dimensions from two vendor drawings built to the same JEDEC registration.
Lead span decides the footprint, and the two vendors differ by 0.5 mm of total tolerance on it. A pattern drawn to TI’s 7.4 mm minimum accepts an NXP part comfortably. The reverse is not guaranteed, so draw to the wider window if both sources are qualified.
One convenience worth knowing: TI’s 14-lead and 16-lead SSOP bodies are dimensionally identical at 5.9–6.5 mm by 5.0–5.6 mm with the same 7.4–8.2 mm lead span. Only the pad count and the pattern length differ, so courtyard planning carries straight across between the two.
[IMAGE 1: dimensioned SSOP-14 outline, top and side view, showing pitch, body, lead span and standoff | alt: “SSOP-14 package outline drawing with 0.65 mm pitch and 6.2 by 5.3 mm body”]
SSOP-14 pinout and pin numbering
The package fixes the numbering, and the device fixes what each pin does. Pin 1 sits at the top-left in the standard top view, marked by a pin 1 index area on the package. Numbering runs down the left side to pin 7, then continues at pin 8 on the bottom right and up to pin 14.
For 14-pin logic families the supply convention is stable: ground on pin 7, supply on pin 14. The TI SN74HC14 hex Schmitt-trigger inverter uses exactly that arrangement in its D, DB, N, NS and PW packages.
| Pin | Function | Pin | Function |
| 1 | 1A input | 14 | Vᴄᴄ |
| 2 | 1Y output | 13 | 6A input |
| 3 | 2A input | 12 | 6Y output |
| 4 | 2Y output | 11 | 5A input |
| 5 | 3A input | 10 | 5Y output |
| 6 | 3Y output | 9 | 4A input |
| 7 | GND | 8 | 4Y output |
Table 2. SN74HC14 pin functions in the DB (SSOP-14) package, per TI SCLS085L.
Analog devices in the same body place supplies wherever the die needs them. Treat the logic convention as a family habit and pull the specific datasheet.
SSOP-14 footprint, stencil and board area
TI publishes an example land pattern with each drawing. For DB0014A: fourteen pads of 1.85 mm × 0.45 mm on 0.65 mm pitch with rows 7.0 mm apart, non-solder-mask-defined preferred, and a paste example based on a 0.125 mm thick stencil. Set that against the SOIC and TSSOP patterns from the same datasheet.
| Package (drawing) | Pad size (mm) | Pad pitch (mm) | Row spacing (mm) | Envelope (mm) | Area (mm²) |
| SSOP-14 (DB0014A) | 1.85 × 0.45 | 0.65 | 7.0 | 8.85 × 4.35 | 38.5 |
| SOIC-14 (D0014A) | 1.55 × 0.6 | 1.27 | 5.4 | 6.95 × 8.22 | 57.1 |
| TSSOP-14 (PW0014A) | 1.5 × 0.45 | 0.65 | 5.8 | 7.30 × 4.35 | 31.8 |
Table 3. Land pattern comparison at 14 leads, computed from the example board layouts in TI SCLS085L.
SSOP-14 removes 33 % of the land area against SOIC-14, and it flips the aspect ratio. The SOIC pattern is narrow and long; the SSOP pattern is wide and short. On a crowded board that shape change often matters more than the area saving.
NXP’s reflow footprint for the same outline converges on the same envelope. Its dimension table gives an 8.85 mm outer pad span with a 4.95 mm gap between rows, which works out to 1.95 mm pads against TI’s 1.85 mm. Either lands the part.
Stencil release is not the constraint here. A 1.85 mm × 0.45 mm aperture in 0.125 mm foil gives an area ratio of (1.85 × 0.45) ÷ [2 × (1.85 + 0.45) × 0.125] = 1.45, comfortably above the 0.66 minimum in IPC-7525B, and an aspect ratio of 3.6. The constraint is the 0.20 mm of bare laminate between adjacent pads.
[IMAGE 2: SSOP-14 land pattern with pad dimensions, 0.65 mm pitch and 0.20 mm inter-pad gap annotated | alt: “SSOP-14 package footprint showing 1.85 by 0.45 mm pads on 7.0 mm rows”]
SSOP-14 against SOIC-14 and TSSOP-14
Cross-vendor comparisons mean little because the die changes. This table holds the die fixed.
| Package (TI code) | Body nom (mm) | Pitch (mm) | Max height (mm) | θJA (°C/W) | ΨJT (°C/W) | Reel qty | Tape W / pitch (mm) |
| SSOP (DB) | 6.2 × 5.3 | 0.65 | 2.00 | 114.8 | 23.7 | 2000 | 16.0 / 12.0 |
| SOIC (D) | 8.65 × 3.9 | 1.27 | 1.75 | 133.6 | 45.5 | 2500 | 16.0 / 8.0 |
| SOP (NS) | — | 1.27 | — | 122.6 | 45.4 | 2000 | 16.2 / 12.0 |
| TSSOP (PW) | 5.0 × 4.4 | 0.65 | 1.20 | 151.7 | 25.2 | 2000 | 12.0 / 8.0 |
| PDIP (N) | 19.3 × 6.35 | 2.54 | — | 60.7 | 26.9 | 25 per tube | — |
Table 4. One die, five packages at 14 leads. Source: TI SN74HC14 datasheet SCLS085L, thermal and packaging tables.
The thermal result runs opposite to the usual assumption that shrinking a package always costs heat. At 14 leads the SSOP body is 5.3 mm wide against the narrow SOIC’s 3.9 mm, and the wider leadframe wins: 114.8 °C/W against 133.6 °C/W. Work it as a dissipation budget at 85 °C ambient against the 150 °C maximum junction temperature: SSOP-14 allows 65 ÷ 114.8 = 0.57 W, SOIC-14 allows 0.49 W, and TSSOP-14 allows 0.43 W.
The ΨJT column matters if you plan to measure junction temperature with a thermocouple on the case. SSOP-14 sits at 23.7 °C/W against 45.5 for SOIC-14, so top-surface measurement tracks the junction roughly twice as closely.
Assembly, sockets and prototyping
Bridging is the dominant defect. Pads 0.45 mm wide on 0.65 mm centers leave 0.20 mm of gap. Keep stencil apertures 1:1 with the pad, and use non-solder-mask-defined pads, which is what the vendor drawing marks as preferred.
Moisture handling depends on the part. TI ships SN74HC14 in DB as Level-1-260C-UNLIM with a NIPDAU finish, which carries no floor-life clock. Other suppliers rate the same outline at MSL 3. Read the bag label.
Sockets and adapters need checking. Listings advertised for SSOP14 are routinely specified at a 4.4 mm body width, which is TSSOP geometry and will not accept a 5.3 mm MO-150 part. One widely sold ZIF socket is listed as “TSSOP14 SSOP14 – 0.65mm – Body 4.4mm”. For prototyping, SparkFun’s SSOP-to-DIP adapter uses 0.635 mm pad centers with pads long enough to cover 3.9, 4.4 and 5.3 mm body widths, and a 14-pin SSOP fits its 16-pin board if two pads are left unconnected.
Sourcing an SSOP-14 part
Order against the drawing number, not the marketing string. TI’s designator is DB, and DB0014A is the drawing. NXP’s is SOT337-1, issued 19 February 2003 and referenced to MO-150. Infineon lists the outline as PG-SSOP-14-1. Nisshinbo carries both an SSOP14 and a separate SSOP14-B4 variant, which is a reminder to open the drawing rather than trust the name.
Real parts to check availability against include SN74HC14DBR, SN74AC14DB, SN74LS00DB, SN74LS08DB and SN74LS74ADB, all built to DB0014A. Note the feeder change across package types: the SSOP-14 ships on 16 mm tape at 12 mm pocket pitch, while the TSSOP-14 uses 12 mm tape at 8 mm pitch.
SSOP-14 package FAQ
What are the SSOP-14 package dimensions?
The body measures 6.2 mm × 5.3 mm nominal with a 2.00 mm maximum height. TI’s DB0014A drawing gives 5.9–6.5 mm body length, 5.0–5.6 mm body width and a 7.4–8.2 mm lead span, while NXP’s SOT337-1 holds 6.0–6.4 mm, 5.2–5.4 mm and 7.6–7.9 mm. Both reference JEDEC MO-150.
What is the SSOP-14 pitch?
0.65 mm. Twelve gaps across fourteen leads give a 3.9 mm pin-field length per side, which fits comfortably inside the 6.2 mm body. Lead width runs 0.22–0.38 mm on the TI drawing, leaving roughly 0.27 mm of nominal clearance between adjacent leads before any land pattern is drawn.
What is the SSOP-14 footprint?
Fourteen pads of 1.85 mm × 0.45 mm on 0.65 mm pitch, with the two rows 7.0 mm apart center to center, per the example board layout on TI drawing DB0014A. That yields an 8.85 mm × 4.35 mm envelope and 38.5 mm² of land area.
Is SSOP-14 the same as TSSOP-14?
No. Both use 0.65 mm pitch, and everything else differs. The TSSOP-14 body is 5.0 mm × 4.4 mm with a 1.2 mm maximum height and a 6.2–6.6 mm lead span, against 6.2 mm × 5.3 mm, 2.00 mm and 7.4–8.2 mm for the SSOP. The TSSOP is registered to MO-153 rather than MO-150.
Can a TSSOP-14 part sit on an SSOP-14 footprint?
No. The recommended land rows sit 5.8 mm apart for TSSOP-14 and 7.0 mm apart for SSOP-14, and the TSSOP lead span tops out at 6.6 mm against an SSOP pad envelope reaching 8.85 mm. The TSSOP leads would land roughly 0.6 mm short of each pad row.
[IMAGE 3: SSOP-14, SOIC-14 and TSSOP-14 outlines overlaid at true scale on a millimetre grid | alt: “SSOP-14 package compared with SOIC-14 and TSSOP-14 at true scale”]
What to do next
Choose SSOP-14 when the board has 2 mm of vertical clearance and the layout benefits from a wide, short footprint. It has the lowest thermal resistance of the three surface-mount options here, and its wider leads survive rework better than TSSOP.
Move to TSSOP-14 when height is capped below 1.5 mm, and accept the 37 °C/W thermal penalty. Stay with SOIC-14 when a technician will service the board in the field.
Whichever way it goes, draw the footprint from the vendor drawing for the specific part number, confirm the MO-150 reference line, and check the lead span tolerance against every source you plan to qualify.
Internal links to place
- [INTERNAL LINK: SSOP package guide → SSOP registrations, pitch variants and body widths]
- [INTERNAL LINK: TSSOP-14 package → TSSOP dimensions, MO-153 and exposed-pad variants]
- [INTERNAL LINK: SOIC-14 package → MS-012 dimensions and land pattern]
- [INTERNAL LINK: IPC-7351 density levels → picking Level A, B or C for 0.65 mm pitch]
- [INTERNAL LINK: reading a package outline drawing → datums, gage plane and lead span]
External references cited
- TI SN74HC14 datasheet SCLS085L — https://www.ti.com/lit/ds/symlink/sn74hc14.pdf
- NXP SOT337-1 package information — https://www.nxp.com/docs/en/package-information/SOT337-1.pdf
- NXP SOT337-1 register entry — https://www.nxp.com/packages/SOT337-1
- Infineon PG-SSOP-14-1 — https://www.infineon.com/cms/en/product/packages/PG-SSOP/PG-SSOP-14-1/
- SparkFun SSOP-to-DIP adapter guide — https://learn.sparkfun.com/tutorials/ssop-16-to-dip-adapter-hookup-guide/all
