The CDIP package (Ceramic Dual In-Line Package), also called CerDIP, is a hermetically sealed through-hole IC housing built from pressed alumina ceramic and closed with
Axial lead packages are through-hole electronic components whose wire leads extend from opposite ends of the body along its longitudinal axis. They are the dominant
Transistor package types determine how a discrete semiconductor connects to your PCB, dissipates heat, and survives its operating environment. The two dominant families are TO
Through-hole packages mount electronic components by inserting metal leads through drilled holes in a PCB and soldering them on the opposite side. Despite the dominance
Surface mount packages fall into five working families: two-terminal chip passives, small-signal SOT/SC packages, tabbed power packages, leaded ICs, and leadless or ball-array ICs. Each
Every SOP package type is the same basic idea — a rectangular, surface-mount IC with gull-wing leads on two sides — pushed along one of three
An SOT (Small Outline Transistor) package is a small, plastic, surface-mount package with gull-wing leads on two sides, used for transistors, diodes, voltage references, and small
SMD package types fall into three groups: passive chip packages named by case code, discrete transistor and diode packages in the SOT and SOD families,
An SMD case code is a length-and-width shorthand: imperial 0603 means 0.060 in × 0.030 in, or 1.6 mm × 0.8 mm (metric 1608). This SMD
Three quad flat packages show up on most microcontroller and FPGA schematics: LQFP, TQFP, and PQFP. They look alike — gull-wing leads on all four