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A DIP-20 measures 2.54 mm pin-to-pin and comes in two row spacings that are not interchangeable. Get the row spacing wrong and the part will

Through-hole technology (THT) and surface-mount technology (SMT) are the two fundamental methods for attaching electronic components to a printed circuit board. THT inserts leads through

The PDIP package (Plastic Dual In-Line Package) is the most common and lowest-cost variant of the DIP family. It uses a molded epoxy resin body

The DIP-14 package is a 14-pin dual in-line through-hole IC housing with 300 mil (7.62 mm) row spacing, 2.54 mm pin pitch, and a body

DIP sockets are through-hole receptacles that accept dual in-line package ICs without soldering the IC directly to the board. They allow chip insertion, removal, and

DIP pin spacing follows one universal rule and three row-width standards. Every standard DIP package uses a 2.54 mm (0.1” / 100 mil) center-to-center pitch

The DIP package (Dual In-Line Package) is an IC housing with two parallel rows of through-hole pins extending from a rectangular body. Invented at Fairchild

The CPGA package (Ceramic Pin Grid Array) is a hermetically sealed through-hole IC housing that places pins in a full area array across the underside

The CERDIP package (also written CerDIP) is a hermetically sealed ceramic dual in-line package in which a pressed-ceramic lid is bonded to a pressed-ceramic base

The CDIP package (Ceramic Dual In-Line Package), also called CerDIP, is a hermetically sealed through-hole IC housing built from pressed alumina ceramic and closed with